Current activities in Kyushu for Silicon-ECAL Taikan Suehara (Kyushu University, Japan) H. Hirai, H. Sumida, S. Takada, T. Tomita, Y. Miyazaki, H. Ueno, Y. Sudo, T. Yoshioka, K. Kawagoe

Topics Sensor study Mass production Optimization (stopped: will resume soon) DAQ Misc

Laser injection I/V dependence on temperature/humidity Production plan Sensor study Laser injection I/V dependence on temperature/humidity Production plan

Sensors 4 x 4 pixels 5.5 x 5.5 mm pixel, 320 mm thick 16 x 16 pix (full, not used) 3x3/4x4 (baby) 65 V full depletion voltage Made by Hamamatsu 3 x 3 pixels Guard ring (GR): To raise breakdown voltage Cause ring events, dead region Baby chips 0GR (4x4) 1GR (3x3) 2GR (split, 4x4) 4GR (split, 3x3)

Laser Injection chip laser system microscope Camera XY stage ←BOX response of pixel close to laser point chip laser system microscope Camera XY stage ←BOX preamplifier laser point BOX pixel edge

Laser response no GR No.10-1 1GR 2 GR (split) No.2-2 1GR

Temperature and Humidity dependence Setup Si-pad insulation sheet copper sheet Voltage generator and Ammeter Thermohygrostat BOX

results Error bars: RMS of several meas. (shows reproducibility) (devided by sqrt(N)) No clear difference seen on GR types Fit to the temperature dependence differs from theoretical

Sensor study summary & plan We’re studying guard ring effects Crosstalk at edge seen on 1-GR no-split and not seen in split and no GR I/V on Temperature and Humidity consistent Breakdown voltage: 0 GR OK up to 300-500V (slightly lower BR in 0GR seen) Crosstalk in pixels will be investigated using meshed electrodes

Mass production

Comments on mass production Hamamatsu said: 8 inch is possible, but not desired for HPK standard thickness is 700-800 mm extra cost for thinner (due to grinding) resistivity is smaller ( more bias voltage) simple patterns only 6 inch: sensors of 320 and 500 mm thickness cost almost the same 650 mm, 10-15% raise on cost < 300 mm, 70% raise on cost 70,000 chips/year (ILD DBD: ~ 5 years) 500 mm, 6 inch currently seems the best

A procedure for mass production Chips from Hamamatsu IV/CV tested in Hamamatsu Laser scan on every pixel on bare chips Dead pixels (no reply, strange reply) Connecting pixels (crosstalk) Glued to PCB/SKIROC, making slabs Test with RI source (57Co or 90Sr) Gain calibration Noise

Springs or conductor sheet Plan of laser scan readout (SKIROC?) Laser beam Put the IR laser beam at every gap between the pixels using XYZ stage Check gain (roughly) and leakage (connecting) pixel on each pixel before gluing Should be short time eg. 2 sec/gap, 300 pad/day (can be loosen if we have multiple stations) PCB with many holes Springs or conductor sheet Si sensor Electrode XYZ stage Laser beam

Slab test with RI source slabs Calibration of gain and noise with electronics 90Sr (2.28 MeV (Max) e-) MIP-like signals (non-monochromatic) Dependence on angle to source 57Co (122 & 136 keV (10%) g) life: 0.7 yr quasi-Monochromatic gamma, easy to calibrate only ~2% stops at 500 mm silicon: scattering background < 1 hour of accumulation time required

Plan to assemble a test station 57Co will arrive in Oct. 90Sr already available XYZ automated stage: order soon PCB with holes: should design DAQ: firstly CAMAC with non-full channel (eg. 16 channels) Plan to establish them within this fiscal year (~Mar. 2015) DAQ with SKIROC: next fiscal year

Optimization

Optimization: plan We’d like to quantize the effect of different detector sizes/number of layers/etc. Low energy: intrinsic resolution of calorimeters  layer configuration High energy: confusion  overall size, cell size Investigating effects to physics is critical We’ll resume the effort soon

Injection study Online monitor Integration to EUDAQ

Injection study A quick theme for DAQ performance analysis We imported LLR setup at this spring with a FEV8 slab with the calicoes software at that time “Injection” is a function of SKIROC to put “charge” from outside (eg. FG) to each input channel before preamp Injection channel can be specified in SKIROC configuration

Injection summary & plan In the injection study, Crosstalk at neighbor pixel seen Baseline shift is also seen We’ll move to Cosmic and RI for getting energy calibration S-scan for determine noise level Analysis help to identify DAQ issues Testboard for BGA SKIROC under design

Online monitor

DAQ development plans in Kyushu Ongoing Online monitor Connection to external framework (EUDAQ or others) Planned after looking at new calicoes Flexible logging system C++ support module Enforce analysis/debugging

Topics about EUDAQ connection Structure Data format (LCIO) Schedule/Plan

EUDAQ structure Calice Producer TCP connection calicoes / others

Data format in LCIO Store ‘hit’-like objects We have ‘CalorimeterHit’ class in LCIO Need threshold – not always suitable for low-level analysis (cross talk etc.) Store simple array of raw data  planned More flexibility; hit-like data can be created from the raw array Need more steps for high-level analysis No specific LCIO structure, use LCGenericObject with attachment class

LCIO: GenericObject LCIO Event  1 RC - LCIO collections  1 types of data (SiADC, ScADC, ScTDC etc.) LCIO objects LCGenericObject  1 chip of data LCGenericObject can save one array (int, float, double) dataDescription in every object can be used for tags, eg. “LDA=1;DIF=2;BX=10;”

Current status Succeeded to run EUDAQ with CaliceProducer producing dummy data encoded to LCIO object and save to LCIO file using DataCollector Ready to attach to calicoes/others

Things to do EUDAQ part Writing TCP adapter Converter from raw to LCIO (if needed) calicoes part Attachment of calicoes to output data to TCP Integration and test Testbeam at CERN: 26 Nov. – 8 Dec.

ILC in Japan Next CALICE meeting Misc ILC in Japan Next CALICE meeting

MEXT Y. Okada, 7 Sep. 2014 Task Force Review by Science Council of Japan MEXT Task Force Particle・Nuclear Physics WG Academic Experts Committee TDR Validation WG February 6, 2014 May 8, 2014 TDR Validation Value Estimation for Quake-Proof Value Estimation for Environmental Improvement Total Value Estimation Clarification of ILC Physics Review Issues 2013 2014 2015 2016 Y. Okada, 7 Sep. 2014

Summary Action Plan before Construction Y. Okada, 7 Sep. 2014 ① ② ③ ④ ⑤ ⑥ ⑦ ⑧ ⑨ Site-Dependent Value (LCC-PreLab) Y. Okada, 7 Sep. 2014

Next CALICE meeting 16-18 March 2015 @ Kyushu University 2.5 Million population 1000 km west from Tokyo

Summary Sensor – 1GR non-split disfavored our baseline – 0GR Mass production – laser & RI test scheme will be checked later in this FY (-Mar. 2015) Optimization – will resume DAQ – should be rapidly developed towards combined TB Nov.-Dec. this year We look forward to see you in Kyushu!