Date of download: 10/20/2017 Copyright © ASME. All rights reserved.

Slides:



Advertisements
Similar presentations
Date of download: 5/30/2016 Copyright © ASME. All rights reserved. From: Introduction of the Element Interaction Technique for Welding Analysis and Simulation.
Advertisements

Date of download: 5/31/2016 Copyright © ASME. All rights reserved. From: Considerations in the Design and Analysis of an ASME Section VIII, Div. 2 Reactor.
Date of download: 6/2/2016 Copyright © ASME. All rights reserved. From: Nonisothermal Transient Flow in Natural Gas Pipeline J. Appl. Mech. 2008;75(3):
Date of download: 6/24/2016 Copyright © ASME. All rights reserved. From: High Performance Anisotropic Conductive Adhesives Using Copper Particles With.
Date of download: 6/27/2016 Copyright © ASME. All rights reserved. From: Specific Heat Measurement of Three Nanofluids and Development of New Correlations.
Date of download: 7/2/2016 Copyright © ASME. All rights reserved. Thermal Performance of an Al 2 O 3 –Water Nanofluid Pulsating Heat Pipe J. Electron.
Date of download: 7/3/2016 Copyright © ASME. All rights reserved. From: Analysis of Flow and Thermal Performance of a Water-Cooled Transversal Wavy Microchannel.
Date of download: 7/7/2016 Copyright © ASME. All rights reserved. Cost-Effective Reliability Analysis and Testing of Medical Devices 1 J. Med. Devices.
Date of download: 11/12/2016 Copyright © ASME. All rights reserved. From: An Open Loop Pulsating Heat Pipe for Integrated Electronic Cooling Applications.
Date of download: 9/27/2017 Copyright © ASME. All rights reserved.
Date of download: 9/27/2017 Copyright © ASME. All rights reserved.
Date of download: 10/3/2017 Copyright © ASME. All rights reserved.
Date of download: 10/5/2017 Copyright © ASME. All rights reserved.
From: A Stepped-Bar Apparatus for Thermal Resistance Measurements
Date of download: 10/9/2017 Copyright © ASME. All rights reserved.
Date of download: 10/9/2017 Copyright © ASME. All rights reserved.
From: Pressure Surge During Cryogenic Feedline Chilldown Process
Date of download: 10/12/2017 Copyright © ASME. All rights reserved.
Date of download: 10/12/2017 Copyright © ASME. All rights reserved.
Date of download: 10/13/2017 Copyright © ASME. All rights reserved.
Date of download: 10/13/2017 Copyright © ASME. All rights reserved.
Date of download: 10/15/2017 Copyright © ASME. All rights reserved.
Date of download: 10/15/2017 Copyright © ASME. All rights reserved.
Date of download: 10/16/2017 Copyright © ASME. All rights reserved.
Date of download: 10/16/2017 Copyright © ASME. All rights reserved.
Date of download: 10/17/2017 Copyright © ASME. All rights reserved.
Date of download: 10/21/2017 Copyright © ASME. All rights reserved.
Date of download: 10/22/2017 Copyright © ASME. All rights reserved.
Date of download: 10/22/2017 Copyright © ASME. All rights reserved.
From: Reliability of Lead-Free Solder Joints
Date of download: 10/23/2017 Copyright © ASME. All rights reserved.
Date of download: 10/25/2017 Copyright © ASME. All rights reserved.
From: Thermal Analysis of Composite Phase Change Drywall Systems
Date of download: 10/25/2017 Copyright © ASME. All rights reserved.
Date of download: 10/26/2017 Copyright © ASME. All rights reserved.
Date of download: 10/29/2017 Copyright © ASME. All rights reserved.
From: Surgical Access System for Frugal Bariatric Surgery
Date of download: 10/30/2017 Copyright © ASME. All rights reserved.
Date of download: 11/1/2017 Copyright © ASME. All rights reserved.
Date of download: 11/1/2017 Copyright © ASME. All rights reserved.
Date of download: 11/1/2017 Copyright © ASME. All rights reserved.
From: Heat Exchanger Efficiency
Date of download: 11/2/2017 Copyright © ASME. All rights reserved.
Date of download: 11/3/2017 Copyright © ASME. All rights reserved.
Date of download: 11/3/2017 Copyright © ASME. All rights reserved.
Date of download: 11/3/2017 Copyright © ASME. All rights reserved.
Date of download: 11/4/2017 Copyright © ASME. All rights reserved.
From: Numerical Optimization of the Thermoelectric Cooling Devices
From: Modeling Transmission Effects on Multilayer Insulation
Date of download: 11/11/2017 Copyright © ASME. All rights reserved.
Date of download: 11/12/2017 Copyright © ASME. All rights reserved.
Date of download: 11/13/2017 Copyright © ASME. All rights reserved.
Date of download: 12/2/2017 Copyright © ASME. All rights reserved.
Date of download: 12/18/2017 Copyright © ASME. All rights reserved.
Date of download: 12/19/2017 Copyright © ASME. All rights reserved.
Date of download: 12/19/2017 Copyright © ASME. All rights reserved.
From: A Damage-Mechanics-Based Constitutive Model for Solder Joints
Date of download: 12/24/2017 Copyright © ASME. All rights reserved.
From: Vapor Chamber Acting as a Heat Spreader for Power Module Cooling
Date of download: 12/25/2017 Copyright © ASME. All rights reserved.
Date of download: 12/25/2017 Copyright © ASME. All rights reserved.
Date of download: 12/26/2017 Copyright © ASME. All rights reserved.
Date of download: 12/27/2017 Copyright © ASME. All rights reserved.
From: An Investigation of a Tunable Magnetomechanical Thermal Switch
Date of download: 12/31/2017 Copyright © ASME. All rights reserved.
Date of download: 1/1/2018 Copyright © ASME. All rights reserved.
Date of download: 1/1/2018 Copyright © ASME. All rights reserved.
Date of download: 1/2/2018 Copyright © ASME. All rights reserved.
Date of download: 1/6/2018 Copyright © ASME. All rights reserved.
Design of a Wireless Biological Signal Conditioning System1
Presentation transcript:

Date of download: 10/20/2017 Copyright © ASME. All rights reserved. From: Analysis of ZnO Thin Film as Thermal Interface Material for High Power Light Emitting Diode Application J. Electron. Packag. 2016;138(1):011001-011001-6. doi:10.1115/1.4032029 Figure Legend: Cumulative structure function of 3 W LED for various boundary conditions measured at (a) 100 mA, (b) 350 mA, and (c) 700 mA

Date of download: 10/20/2017 Copyright © ASME. All rights reserved. From: Analysis of ZnO Thin Film as Thermal Interface Material for High Power Light Emitting Diode Application J. Electron. Packag. 2016;138(1):011001-011001-6. doi:10.1115/1.4032029 Figure Legend: Variation of junction temperature rise with respect to boundary conditions measured at (a) 100 mA, (b) 350 mA, and (c) 700 mA

Date of download: 10/20/2017 Copyright © ASME. All rights reserved. From: Analysis of ZnO Thin Film as Thermal Interface Material for High Power Light Emitting Diode Application J. Electron. Packag. 2016;138(1):011001-011001-6. doi:10.1115/1.4032029 Figure Legend: Surface morphology of (a) bare, (b) 400 nm, and (c) 800 nm ZnO thin film coated on the Cu substrates

Date of download: 10/20/2017 Copyright © ASME. All rights reserved. From: Analysis of ZnO Thin Film as Thermal Interface Material for High Power Light Emitting Diode Application J. Electron. Packag. 2016;138(1):011001-011001-6. doi:10.1115/1.4032029 Figure Legend: Change in CCT of 3 W LED for various boundary conditions measured at (a) 100 mA, (b) 350 mA, and (c) 700 mA

Date of download: 10/20/2017 Copyright © ASME. All rights reserved. From: Analysis of ZnO Thin Film as Thermal Interface Material for High Power Light Emitting Diode Application J. Electron. Packag. 2016;138(1):011001-011001-6. doi:10.1115/1.4032029 Figure Legend: Variation of Lux of 3 W LED for various boundary conditions observed at (a) 100 mA, (b) 350 mA, and (c) 700 mA