Irradiation test results for SAMPA MPW1 and plans for MPW2 irradiation tests Sohail Musa Mahmood 23.03.17.

Slides:



Advertisements
Similar presentations
Giuseppe De Robertis - INFN Sez. di Bari 1 SEU – SET test structures.
Advertisements

IHP Im Technologiepark Frankfurt (Oder) Germany IHP Im Technologiepark Frankfurt (Oder) Germany ©
SAAB SPACE 1 The M2 ASIC A mixed analogue/digital ASIC for acquisition and control in data handling systems Olle Martinsson AMICSA, October 2-3, 2006.
C3 / MAPLD2004Lake1 Radiation Effects on the Aeroflex RadHard Eclipse FPGA Ronald Lake Aeroflex Colorado Springs.
Scrubbing Approaches for Kintex-7 FPGAs
Radiation Effects on FPGA and Mitigation Strategies Bin Gui Experimental High Energy Physics Group 1Journal Club4/26/2015.
April 30, Cost efficient soft-error protection for ASICs Tuvia Liran; Ramon Chips Ltd.
ICAP CONTROLLER FOR HIGH-RELIABLE INTERNAL SCRUBBING Quinn Martin Steven Fingulin.
STAR Pixel Detector Latch-up in Phase-1, SUZE and Mimosa22 Tests and analysis by Michal Szelezniak.
Token Bit Manager for the CMS Pixel Readout
The Latchup Monitor System, ESA Meeting, December 9 th 2014 R. Secondo, A Masi, R. Losito, P. Peronnard, R. D’Aguanno, R. Ferraro The Latchup Monitor System,
Maintaining Data Integrity in Programmable Logic in Atmospheric Environments through Error Detection Joel Seely Technical Marketing Manager Military &
DEVELOPMENT OF A READOUT SYSTEM FOR LARGE SCALE TIME OF FLIGHT SYSTEMS WITH PICOSECOND RESOLUTION Considerations and designs for a system of tdc’s with.
MDT-ASD PRR C. Posch30-Aug-01 1 Radiation Hardness Assurance   Total Ionizing Dose (TID) Change of device (transistor) properties, permanent   Single.
Beam Loss Analysis Tool for the CTF3 PETS Tank M. Velasco, T. Lefevre, R. Scheidegger, M. Wood, J. Hebden, G. Simpson Northwestern University, Evanston,
COMPONENT TEST H4IRRAD 15 TH NOVEMBER 2011 G. Spiezia, P. Peronnard, G. Foucard, S. Danzeca, P. Gander, E. Fadakis (EN/STI/ECE)
A Serializer ASIC for High Speed Data Transmission in Cryogenic and HiRel Environment Tiankuan Liu On behalf of the ATLAS Liquid Argon Calorimeter Group.
12004 MAPLD: 141Buchner Single Event Effects Testing of the Atmel IEEE1355 Protocol Chip Stephen Buchner 1, Mark Walter 2, Moses McCall 3 and Christian.
SPS Beam Position Monitors: MOPOS Front-End Electronics Jose Luis Gonzalez BE/BI 22/11/2013.
BepiColombo/MMO/PWI/SORBET PWI meeting - Kanazawa 24/03/2006M.Dekkali MMO PWI Meeting Kanazawa University 24 th March 2006.
I n t e g r a t e d D e s i g n C e n t e r / M I s s I o n D e s I g n L a b o r a t o r y N A S A G O D D A R D S P A C E F L I G H T C E N T E R Do.
M. Adinolfi – University of Oxford – MAPMT Workshop – Imperial College 27 June Rad-Hard qualification for the LHCb RICH L0 electronics M. Adinolfi.
Presented by Anthony B. Sanders NASA/GSFC at 2005 MAPLD Conference, Washington, DC #196 1 ALTERA STRATIX TM EP1S25 FIELD-PROGRAMMABLE GATE ARRAY (FPGA)
Experience from using SRAM based FPGAs in the ALICE TPC Detector and Future Plans Johan Alme – for the ALICE TPC Collaboration FPGA.
TRAD, Tests & Radiations 13/09/2011 LHC POWER CONVERTER Radiation analysis.
Irradiation Test of the Omegapix2 Digital Tier May 18-22, 2015, CERN Olivier Le Dortz, LPNHE Paris Juin 2015.
ATMEL ATF280E Rad Hard SRAM Based FPGA SEE test results Application oriented SEU Sensitiveness Bernard BANCELIN ATMEL Nantes SAS, Aerospace Business Unit.
Development of DC-DC converter ASICs S.Michelis 1,3, B.Allongue 1, G.Blanchot 1, F.Faccio 1, C.Fuentes 1,2, S.Orlandi 1, S.Saggini 4 1 CERN – PH-ESE 2.
2/2/2009 Marina Artuso LHCb Electronics Upgrade Meeting1 Front-end FPGAs in the LHCb upgrade The issues What is known Work plan.
Radiation Hardness Test Chip Matthias Harter, Peter Fischer Uni Mannheim.
23 February 2004 Christos Zamantzas 1 LHC Beam Loss Monitor Design Considerations: Digital Parts at the Tunnel Internal Review.
HBD FEM Overall block diagram Individual building blocks Outlook ¼ detector build.
Synthesis Of Fault Tolerant Circuits For FSMs & RAMs Rajiv Garg Pradish Mathews Darren Zacher.
Apr, 2014 TE-EPC-CCE Radiation Tests
Xiangming Sun1PXL Sensor and RDO review – 06/23/2010 STAR XIANGMING SUN LAWRENCE BERKELEY NATIONAL LAB Firmware and Software Architecture for PIXEL L.
14/Sept./2004 LECC2004 Irradiation test of ASIC and FPGA for ATLAS TGC Level-1Trigger System 1 TID (  -ray) and SEE (proton) tests and results for ROHM.
The development of the readout ASIC for the pair-monitor with SOI technology ~irradiation test~ Yutaro Sato Tohoku Univ. 29 th Mar  Introduction.
TRIUMF and ISIS Test Facilities Radiation 2 Electronics (R2E) LHC Activities TRIUMF and ISIS test facilities Rubén García Alía, Salvatore Danzeca, Adam.
Erik Jonsson School of Engineering & Computer Science Redundant SAR ADC Architecture and Circuit Techniques for ATLAS LAr Phase-II Upgrade Ling Du 1, Hongda.
DAQMB Status – Onward to Production! S. Durkin, J. Gu, B. Bylsma, J. Gilmore,T.Y. Ling DAQ Motherboard (DMB) Initiates FE digitization and readout Receives.
LC Power Distribution & Pulsing Workshop, May 2011 Super-ALTRO Demonstrator Test Results LC Power Distribution & Pulsing Workshop, May nd November.
FPGAs in ATLAS Front-End Electronics Henrik Åkerstedt, Steffen Muschter and Christian Bohm Stockholm University.
Numerical signal processing for LVDT reading based on rad tol components Salvatore Danzeca Ph.D. STUDENT (CERN EN/STI/ECE ) Students’ coffee meeting 1/3/2012.
IB PRR PRR – IB System.
Investigating latchup in the PXL detector Outline: What is latchup? – the consequences and sources of latchup – techniques to reduce latchup sensitivity.
Radiation 4-5 December 2005 AB/BDI/BL.
1 Single event upset test of the voltage limiter for the ATLAS Semiconductor tracker TSL Experiment Number: F151 distance between power supplies and modules.
Sohail Musa Mahmood on behalf of SAMPA team and Norwegian group SAMPA linearity test results SAMPAmeeting
Actel Antifuse FPGA Information – Radiation Tests Actel Antifuse FPGA – A54SX72A 72K gates 208 pqfp package 2.5v to 5.0v I/O tolerant $62 each for tested.
Ketil Røed - LECC2005 Heidelberg Irradiation tests of the ALICE TPC Front-End Electronics chain Ketil Røed Faculty of Engineering, Bergen University.
Sampa testing Arild Velure. FPGA testboard design SoC-Kit Board HPS Memory Command and Control Module Clock Manager Uart to bus MUX Data manager.
Xilinx V4 Single Event Effects (SEE) High-Speed Testing Melanie D. Berg/MEI – Principal Investigator Hak Kim, Mark Friendlich/MEI.
MAPLD 2005/213Kakarla & Katkoori Partial Evaluation Based Redundancy for SEU Mitigation in Combinational Circuits MAPLD 2005 Sujana Kakarla Srinivas Katkoori.
Ketil Røed University of Bergen - Department of Physics Ketil Røed MSc student, microelectronics University of Bergen Norway Irradiation tests of Altera.
Development of SEU-robust, radiation-tolerant and industry-compatible programmable logic components Sandro Bonacini CERN.
Comparison Study of Bulk and SOI CMOS Technologies based Rad-hard ADCs in Space Feitao Qi , Tao Liu , Hainan Liu , Chuanbin Zeng , Bo Li , Fazhan Zhao.
CALIFES 2015 run preliminary results
Hongda Xu1, Yongda Cai1, Ling Du1, Datao Gong2, and Yun Chiu1
A General Purpose Charge Readout Chip for TPC Applications
An Unobtrusive Debugging Methodology for Actel AX and RTAX-S FPGAs
SmartFusion2 and Artix 7 radiation test results for the new developments G. Tsiligiannis, S. Danzeca (EN-STI-ECE)
Problems and solutions to the use of FPGA's in radiation zones
SEU Mitigation Techniques for Virtex FPGAs in Space Applications
PSI test REPORT MARCH 2011 G. Spiezia, P. Peronnard (EN/STI/ECE)
Radiation Tolerance of an Used in a Large Tracking Detector
A microTCA Based DAQ System for the CMS GEM Upgrade
Maintaining Data Integrity in Programmable Logic in Atmospheric Environments through Error Detection Joel Seely Technical Marketing Manager Military &
Irradiation Test of the Spartan-6 Muon Port Card Mezzanine
SEE Characterization of XC7K70T, Kintex Serie7 familly FPGA from Xilinx Hello everyone, I’m ELG, I’m here today to present you a SEE ch…, performed at.
Design of a ‘Single Event Effect’ Mitigation Technique for Reconfigurable Architectures SAJID BALOCH Prof. Dr. T. Arslan1,2 Dr.Adrian Stoica3.
Presentation transcript:

Irradiation test results for SAMPA MPW1 and plans for MPW2 irradiation tests Sohail Musa Mahmood 23.03.17

Radiation level at ALICE during RUN 3 Fig : Rate of hadrons with energy of >20MeV for a Pb-Pb collision rate of 50 kHz [1] Contour plot based on monte carlo simulations using FLUKA for RUN 3. Single Event Effects High Energy Hadrons (HEH) are main source of SEEs in TPC. Estimated Flux (HEH) ~3.4kHz/cm^2. (10 x). . It is also comparable to the fluxes experienced by space electronics when passing through the South Atlantic Anomaly This may lead to Single Event Upset (SEU) Single Event Transient (SET) Single Event Latch-up (SEL) SEEs may result in the complete system failure in the readout for the TPC detector, which in turn can require the complete ALICE experiment to be stopped and reconfigured in order to remove and correct this situation. High Energy Hadrons (HEH) are the main source of Single Event Effects (SEE) in TPC readout electronics (~3.4kHz/cm^2) . [1]: ALICE TDR for the Upgrade of the ALICE Read-out & Trigger System, LHCC-TDR-015, 3. July 2014

Single Event Effects in Electronics A Single Event Effect occurs when a highly energetic particle strikes sensitive regions of an electronic device disrupting its correct operation. VDD 1 Trigger parasitic PNPN structure Heavy charged particle Qdeposited > Qcritical => 1  0 Direct path between power and ground. High current state. Permanently damaged, if not power cycled. Single Event Latchup (SEL): High LET particles trigger a parasitic PNPN structure which creates a potentially high current state which in turn can lead to permanent damage unless current limitation protects the device (requires power cycle). -SEL may cause permanent damage to the device. If the device is not permanently damaged, power cycling of the device (off and back on) is necessary to restore normal operation. -An example of SEL in a CMOS device occurs when the passage of a single particle induces the creation of parasitic bipolar (p-n-p-n) shorting of power to ground. Single Event Upset (SEU) in SRAM Single Event Latch-up (SEL) in CMOS

SAMPA MPW1 irradiation tests 1st Prototype (DUT) 159 MeV 429 cm Proton beam 180 MeV Energy SAMPA MPW1 irradiation tests were conducted in Uppsala April 2015 using the Proton beam (Fluence ~2e11 p/cm2 ). 38mm x 38 mm graphite collimator Blue Hall @ The Svedberg Laboratory (TSL)

Irradiation test setup for MPW1 3 Pre-amplifiers 3 Analog to Digital Converters (ADCs) Shift register (15000 flip flops) 3 Digital Signal Processing channels (DSPs) For data storage: Only registers (FFs) Current monitoring board FPGA-kit to control shiftregister Single Event Latch-up (SEL): Monitoring currents on analog and digital power supply. Single Event upset (SEU) in shiftregister FPGA-kit controls shiftregister (pattern / clock) over HSMC cable. Input pattern 01010101.

MPW1 irradiation test results for shift register The first results showed a linear behavior between number of particles hitting DUT (Fluence) and number of errors (SEUs). σ [SEU] cm^2/bit = 1E−09 15000 = 6.67E-14 # of flip flops Only 15000 FFs

Impact of irradiation test results on the full readout system for TPC detector. No SEL was observed during 1st irradiation tests, with 1.3 hr beam time and fluence of 1.7e11 p/cm2 . SEE/s = σ x # bits x Flux (TPC) x [#chips] σ [FFs] = 1E-13 cm2/bit σ [SEL] < 6E-12 cm2 FLUX (TPC) = 3400 p/cm2/s Total SAMPAs = 17000 SEE/s MTB SEE #chips 1 17000 Flip-flop (55k) 1.87e-5 0.32 15 hr 3 s SEL < 2e-8 < 3.5e-4 > 13.5 khr > 48 min

New features are added to SAMPA MPW2 9 mm 32 ADCs 3 Pre-amplifiers 5 mm 32 Pre-amplifiers 5 mm 9 mm 3 ADCs 3 DSP channels For data storage: Only registers (FFs) 32 DSP channels For data storage: 125k registers (FFs) 2.5 Mbit SRAM Memory 32 OUTPUT DRIVERS Ball Grid Array (BGA) package

SEU mitigation techniques in MPW2 Tripple Modular Redundancy (TMR) TMR works, if the SEU happens in one of the triplicated modules, or on the data path. TMR fails, if SEUs occur in two out of three modules, or the SEU occur in the voter. 62% (35 k) registers are TMR protected (critical configuration/control registers). Hamming Error Correction Code The header packet is protected against SEU with Hamming error correction code which performs correction of single error and detection of double error (SECDED). The packet headers are equipped with a Hamming error correction code which enables correction of one error and detection of two errors in the header. The Hamming code is added to the header before it is written to the ringbuffer memory and it is checked again when it is read out of the ringbuffer, before it is sent to the serial links

SEU tests for MPW2 Registers (FFs) Hamming correction SRAM Memory

Plans for MPW2 irradiation tests Single Event Latchup Current monitoring for all power domains (2 Analog, 1 ADC, 2 Digital). Longer runs to increase statistics. At least 3 devices for minimum probing of device-to-device variation. Total Ionizing Dose (TID) Monitor the output voltage of power regulators. Monitor the Baseline from the analog part. Monitor the frequency of Ring Oscillator (test structure in MPW2). Proton beam 190 MeV @ KVI on 29.03 Questions?

Back up

During irradiation test, the rate at which the protons strikes the DUT (Flux) and the irradiating time is important. Flux: ~6e6 – 6e7 p/cm2/s Total Fluence: ~2e11 p/cm2 (~12kRad)

SEU test setup for MPW1 (8-bit SR) CLK IN POS 1 POS 2 POS 3 POS 4 POS 5 POS 6 POS 7 POS 8 OUT 1 1 1 2 1 1 3 1 4 1 5 Bit flip from 1 to 0 6 1 7 8 1 1 1 9 1 10 1 1

MPW1 @ TSL: Results shift register SEU (10) SEU (01) SEU (Tot) Fluence [p/cm2] Cross setion/bit [cm2] RUN 1 2 4 6 5.8E+9 6.9E-14 RUN 2 23 47 70 6.2E+10 7.5E-14 RUN 3 9 13 1.4E+10 6.2E-14 RUN 5 8 17 2.2E+10 5.5E-14 Total 38 68 106 1.0E+11 7.1E-14 Out of 6 runs, only 4 runs are analyzed for SEU : RUN # 1, 2, 3 and 5. RUN 4 was operated on 320 MHz clock frequency by mistake. In RUN 6, 32 bits were shifted at a time, which made the analyzing very difficult. RUN 2 is the longest run (35 minutes).

SEL test-setup for MPW1 Vdd DSP (1.2V) Vdd (3.3V) Vdd analog (1.2V) Monitoring currents on analog and digital supply VDDA 1.2V: Preamp & ADC VDD 3.3V(2.7V): I/O pad for SAMPA, Output drivers, regulators VDD 1.2V: DSP and shift register Vdd DSP (1.2V) Vdd (3.3V) Current monitoring board FPGA-kit to control shiftregister Vdd analog (1.2V) Measuring voltage over 0.1 ohm resistors using INA226 Monitoring currents from HMP2020 power supply (5V, 1.2V).

No SEL was observed during 1st irradiation tests, with 1 No SEL was observed during 1st irradiation tests, with 1.3 hr beam time and fluence of 1.7e11 p/cm2 σSEL < 6e-12 cm2 Assuming HEH flux of 3400 /cm2/s and 17000 SAMPAs SEL rate < 2e-4/s (MTB SEL > 1.5 hr) Only 1 chip tested (device-to-device variation, temperature and VDD dependency, tungsten?, grazing angles ?) No TID effect observed until 12 kRad One high current event observed (<2s) Disappeared by itself without intervention SELs are typically persistent