SPring-8 FADC Module Compiled by Wen-Chen Chang Updated: 07/12/2002.

Slides:



Advertisements
Similar presentations
20/Oct./2000 CF IEEE NSS 2000 at Lyon,France 1 An MWPC Readout Chip for High Rate Environment Introduction ASIC Structure & Fabrication ASIC Evaluation.
Advertisements

6 Mar 2002Readout electronics1 Back to the drawing board Paul Dauncey Imperial College Outline: Real system New VFE chip A simple system Some questions.
IPAS SPring-8 FADC Project 章文箴 蘇大順 04/26/2002. Super Photon Ring 8 GeV (SPring-8) Harima Science Garden City.
Ultrafast 16-channel ADC for NICA-MPD Forward Detectors A.V. Shchipunov Join Institute for Nuclear Research Dubna, Russia
1 MICE Tracker Readout Update, Preparation for Cosmic Ray Tests Introduction/Overview AFE-IIt firmware development VLSB firmware development Hardware progress.
DSP online algorithms for the ATLAS TileCal Read Out Drivers Cristobal Cuenca Almenar IFIC (University of Valencia-CSIC)
6 June 2002UK/HCAL common issues1 Paul Dauncey Imperial College Outline: UK commitments Trigger issues DAQ issues Readout electronics issues Many more.
Large Area, High Speed Photo-detectors Readout Jean-Francois Genat + On behalf and with the help of Herve Grabas +, Samuel Meehan +, Eric Oberla +, Fukun.
Development of novel R/O electronics for LAr detectors Max Hess Controller ADC Data Reduction Ethernet 10/100Mbit Host Detector typical block.
TOF Electronics Qi An Fast Electronics Lab, USTC Sept. 16~17, 2002.
Preliminary Design of Calorimeter Electronics Shudi Gu June 2002.
BESIII Electronics and On-Line BESIII Workshop in Beijing IHEP Zhao Jing-wei Sheng Hua-yi He Kang-ling October 13, 2001 Brief Measurement Tasks Technical.
Electronics for PS and LHC transformers Grzegorz Kasprowicz Supervisor: David Belohrad AB-BDI-PI Technical student report.
The GANDALF Multi-Channel Time-to-Digital Converter (TDC)  GANDALF module  TDC concepts  TDC implementation in the FPGA  measurements.
1 LEPS TPC Electronics 章文箴 Wen-Chen Chang Institute of Physics, Academia Sinica 03/30/2001.
Data is sent to PC. Development of Front-End Electronics for time projection chamber (TPC) Introduction Our purpose is development of front-end electronics.
Prototype Test of SPring-8 FADC Module Da-Shung Su Wen-Chen Chang 02/07/2002.
TDC and ADC Implemented Using FPGA
K.C.RAVINDRAN,GRAPES-3 EXPERIMENT,OOTY 1 Development of fast electronics for the GRAPES-3 experiment at Ooty K.C. RAVINDRAN On Behalf of GRAPES-3 Collaboration.
September 8-14, th Workshop on Electronics for LHC1 Channel Control ASIC for the CMS Hadron Calorimeter Front End Readout Module Ray Yarema, Alan.
FADC progress in Vienna Reported by H.Ishino for Vienna FADC group M.Pernicka and H.Steininger.
HBD FEM Overall block diagram Individual building blocks Outlook ¼ detector build.
First ideas for the Argontube electronics Shaper, simulations Block Diagram for analog path Delta Code Data Reduction Bus system, Controller Max.
Features of the new Alibava firmware: 1. Universal for laboratory use (readout of stand-alone detector via USB interface) and for the telescope readout.
Front-end readout study for SuperKEKB IGARASHI Youichi.
The DRS2 Chip: A 4.5 GHz Waveform Digitizing Chip for the MEG Experiment Stefan Ritt Paul Scherrer Institute, Switzerland.
PSI - 11 Feb The Trigger System of the MEG Experiment Marco Grassi INFN - Pisa On behalf of D. Nicolò F. Morsani S. Galeotti.
March 9, 2005 HBD CDR Review 1 HBD Electronics Preamp/cable driver on the detector. –Specification –Schematics –Test result Rest of the electronics chain.
Update on final LAV front-end M. Raggi, T. Spadaro, P. Valente & G. Corradi, C. Paglia, D. Tagnani.
Front-End Electronics for PHENIX Time Expansion Chamber W.C. Chang Academia Sinica, Taipei 11529,Taiwan A. Franz, J. Fried, J. Gannon, J. Harder, A. Kandasamy,
SoLiD/PVDIS DAQ Alexandre Camsonne. DAQ limitations Electronics Data transfer.
HBD/TPC Electronics Status Works done to for a)Prototype detector readout b)Understand packing density and heat loading issues c)Address the overall system.
1 MICE Tracker Readout Update Introduction/Overview TriP-t hardware tests AFE IIt firmware development VLSB firmware development Hardware progress Summary.
11 October 2002Paul Dauncey - CDR Introduction1 CDR Introduction and Overview Paul Dauncey Imperial College London.
TPC electronics Status, Plans, Needs Marcus Larwill April
D. Attié, P. Baron, D. Calvet, P. Colas, C. Coquelet, E. Delagnes, R. Joannes, A. Le Coguie, S. Lhenoret, I. Mandjavidze, M. Riallot, E. Zonca TPC Electronics:
Click to edit Master subtitle style Presented By Mythreyi Nethi HINP16C.
.1PXL READOUT STAR PXL READOUT requirement and one solution Xiangming Sun.
D. Attié, P. Colas, E. Delagnes, M. Riallot M. Dixit, J.-P. Martin, S. Bhattacharya, S. Mukhopadhyay Linear Collider Power Distribution & Pulsing Workshop.
1 Carleton/Montreal Electronics development J.-P Martin (Montreal) Shengli Liu & M. Dixit (Carleton) LC TPC Meeting DESY Hamburg, 4 June 2007.
Current Status of RICH LVL-1 Trigger Module Takashi Matsumoto and Ken Oyama Presentation Outline Topics Geometry of Trigger Tile Required function of RICH.
Status of hardware activity in CNS Taku Gunji Center for Nuclear Study University of Tokyo 1.
TDC and ADC Implemented Using FPGA
IPAS SPring-8 FADC Project
DAQ ACQUISITION FOR THE dE/dX DETECTOR
DCH FEE STATUS Level 1 Triggered Data Flow FEE Implementation &
vXS fPGA-based Time to Digital Converter (vfTDC)
Jinfan Chang Experimental Physics Center , IHEP Feb 18 , 2011
A General Purpose Charge Readout Chip for TPC Applications
LHC1 & COOP September 1995 Report
Readout System of the CMS Pixel Detector
Iwaki System Readout Board User’s Guide
PSD Front-End-Electronics A.Ivashkin, V.Marin (INR, Moscow)
DCH FEE 28 chs DCH prototype FEE &
APV Readout Controllers DAQ
Power pulsing of AFTER in magnetic field
A First Look J. Pilcher 12-Mar-2004
Possible Upgrades ToF readout Trigger Forward tracking
Status of n-XYTER read-out chain at GSI
Neurochip3.
TPC electronics Atsushi Taketani
NA61 - Single Computer DAQ !
BESIII EMC electronics
Tests Front-end card Status
Stefan Ritt Paul Scherrer Institute, Switzerland
On behalf of MDC electronics group
PID meeting Mechanical implementation Electronics architecture
sPHENIX DOE-SC CD-1/3a Review WBS 1.5.3: CalElec Digitizers
TOF read-out for high resolution timing
for BESIII MDC electronics Huayi Sheng
Presentation transcript:

SPring-8 FADC Module Compiled by Wen-Chen Chang Updated: 07/12/2002

Requirement of TPC Electronics Good energy resolution: measuring dE/dx from the charge readout of either wires or pads for the particle identification for K/p separation at low momentum. Requirement of spatial resolution: x,y < 300 m. z < 1 mm. Position information: x(t),y(t): x from fired sense wires; y from interpolation of signals on pads(t). z(t) from time bin of FADC time slice. Timing information: fitting of pulse peak in FADC. On-board zero-suppression to ensure fast data transfer and short system dead time.

Digitizer in TPC Electronic: FADC Large data size: High sampling rate: 40 MHz = 25 nsec. Read-out bit (Nbit): 10 bits. # of Time bins per event: ~600 time bins. (Max drift time/clock = 14 sec/25 nsec = 560 bins.) 1000 channels. Trigger latency: 1 sec . On-board zero-suppression. Need of a large buffer size to store 4-5 events on board for one single VME readout.(16*600*5=48K per channel, w/o a zero suppression factor.) High channel density.

SPring-8 FADC Module Use TEXONO FADC and IHEP BES version as the starting point. 40 MHz; 10-bit FADC: ADC input 0-2 V range. Shift register inside FPGA: max length = 100 time bin. On-board FPGA for threshold suppression. Buffer FIFO: dual port memory. CPLD: controlling VME actions. Free clock running. VME 9U; 32 channels/module; 8 attached cards/module; 4 channel/card.

Main Electronic Components

SPring-8 FADC Module (4 channels, 10 bits, 40 MHz) FIFO FADC OPA FPGA

Mixed signal AD Converter Adapter Board 40 MHz sampling rate. 10 bits resolution with 2Vp-p dynamic range. Clock distribution with Phase Lock Loop circuit. On Board digital signal delay and Real-Time ZERO-Suppression. High capacity First In First Out Memory. Easy to use with high density connector.

FADC Mother Board Driver CPLD Clock Driver VME Connector

32 Channels, high sampling rate Flash AD converter. VMEBus slave controller, with high performance BLTransfer Mode. FPGA, digital signal control chip. First In First Out memory. Differential AD Converter (40 MHz) 16 channels differential signal input connector. 32 Channels, high sampling rate Flash AD converter. Spring-8 2002/03

Prototype 2

Prototype 2 : FADC card

Prototype 2: LED Power Download Trigger VME READ

Prototype 2: LEMO Input Clock Trigger Reset Busy

Prototype 2: Lab Test

Prototype 2: Lab test

Analog Input to ADC

1-channel FPGA Block

FPGA Block

Data Format CS: Checksum bit Lowest Bit ND: Not defined. Header 1 16 15 14 13 12 11 10 09 08 07 06 05 04 03 02 01 * FADC Module number (6 bits) is set by two blue dip-switches on the lower part of VME 9U FADC. Left one for the highest 2 bits and right one for the lowest 4 bits. Header 1 CS 1 ND *FADC Module Number (1-64) Channel Number (1-32) Header 2 CS 1 ND Suppression Level (0-255) Evt Num (1-8) ADC CS 1 ND ADC (0-1024) Time CS 1 ND Time (0-1024) Trailer CS 1 ND Number of ADC data bins (0-1024)

CSR Format Lowest Bit VME address: 0x010000 16 15 14 13 12 11 10 09 08 07 06 05 04 03 02 01 Reset: counters, FIFO, BUSY. 1 Number of Events stored in FIFO before issuing IRQ 1 Num of Evts (0-31)

FADC VME Action List (A24/D16) 0x0i0000: CSR address to write; bit 9 for resetting FIFO and clear busy, bit 1-4, 10 for setting IRQ event numbers (Address modifier: 0x3D). 0x0i0100: address to read the all-merged 32 FIFOs’ content in BLT mode for FADC i. (Address modifier: 0x3B, 0x3F). Check up the last 16 bits of package after each read. If value = 0xFFFF, end of FIFO is reached and BLT read should be stopped. 0x0i0100+j*0x02: address to read the single FIFO content in AO mode for channel j. (Address modifier: 0x3D) (channel 0, 0x0i0100, channel 1, 0x0i0102 ,…. channel 31, 0x0i013C, channel 32, 0x0i013E) 0x0i0100+j*0x02: address to write for setting the zero-suppression threshold for channel j. (Address modifier: 0x3D) i: module number for VME address definition set by the dip-switch on the upper right side of each VME 9U board.

CPLD FADC Trigger Clock 100MHz The Control Flow of FADC For each channel DAQ Start Trigger , Conversion Master Yes NIM < 5 events Preamplifier Module VME CPU No Trigger Count *Veto Send IRQ to VME CPU Trigger signal DAQ READ FIFO CPLD FADC Trigger Clock 100MHz FADC Module DAQ send Reset Trigger Clock FADC clear BUSY FADC Reset Clear trigger Veto BUSY Slave

Observation Window of Signals Shift Register Length ( max 100*25ns = 2.5 s) Trigger Conversion Strobe Sampling Counts ( max 1024*25ns=25s)

DAQ Test Trigger Logic SPring-8 32-channel FADC TEXONO MAMP LeCroy222 LTDS1 Rst LTD0 Strb SCLK HTD0 Evnt H VT L VT LeCroy222 START OR BLANK STOP NIM DEL TTL BUSY 1.0 10 100 LATCH Full scale width FBSY INT READ CLK Busy Reset +5V +12V -12V -5.2V SPring-8 32-channel FADC Trigger Voltage Reference Clock Generator

TEXONO Online Event Display (400 KHz sine wave)

TEXONO Online Event Display (1 MHz sine wave)

ROOT Offline Event Display for 2 SPring-8 FADC (64 channels) Module 1 Module 2

Events 02/09/2001: Prof. Imai and Ahn visited AS. Collaborating plan was discussed and finalized. 03/31/2001: Wen-Chen and Henry visited IHEP, Beijing and explored the R&D plan in IHEP. 05/31/2001: IHEP was not able to perform the R&D plan. 08/01/2001: Da-Shun visited IHEP for 3 weeks to learn the conceptual design. 02/01/2002: Prototype 1 boards made. 02/28/2002: Wen-Chen and Da-Shun tested prototype-1 boards with TPC at SPring-8. 04/25/2002: Finished up 64 channels of prototype-1 and deliver them to SPring-8.

Events 06/03/2002: Issue out prototype-2 (quasi-final) fabrication and SMT order. 06/24/2002: Deliver prototype-2 (64 channels) to SPring-8. 06/25/2002: System test with a complete electronic chain (Pre-amp, shaper, and FADC) with TPC at SPring-8. 07/02/2002: ordering of CPLD, PROM and other inexpensive components. 07/06/2002: Successful reading and decoding of pulser data by VME SPARC and UNIDAQ. 07/10/2002: Return prototype-2 (64 channels) to Taipei for fixing up the pedestals.

Plan to be finished: 07/25/2002: Return prototype-2 (64 channels) to SPring-8 for testing with TPC and Solenoid magnet. 08/15/2002: Finalize design and issue out the final production fabrication order (1440 channels). 09/01/2002: Send production boards for stuffing. 09/08/2002 – 09/25/2002: Test production boards in Taipei. 09/25/2002 – 10/15/2002: Delivery of production board, installation, system test and DAQ. 10/15/2002: Commission run with photon beams.