GEM-TPC Status Report GEM-Trackers see MEC session (14:00 hrs)

GEM-TPC@PANDA/FOPI Collaboration Meeting Outline General issues Material research Field Cage Media-Flange Assembly (Supplies) Amplification-Flange Assembly (GEM Stack) Electronic-Flange Assembly (Pad Plane) Front-End Boards Cooling Structure Electrical Supplies Summary Overview GEM-TPC@PANDA/FOPI Collaboration Meeting March 3rd 2009

GEM-TPC@PANDA/FOPI Collaboration Meeting General Issues Status Legend: Successfully finished Neutral, with no influence on timeline Ongoing work, waiting for completion Critical, on hold, stalled Detector & Setup General: Actual CAD models put to the WebDAV (V14 of the FOPI GEM-TPC assembly) First part- & material list available (e.g. for simulations, still preliminary) Still no input on required precision and tolerances GEM-TPC@PANDA/FOPI Collaboration Meeting March 3rd 2009

Material investigations Outgasing & Aging Test Results: Negative - Severe damage! Detailed investigations in progress Status: Outgasing equipment severely damaged needs to be re-built & improved New detector fabrication started (+8w) New base-material purchase started (+4w, 4k€) Still >14 on-stock materials to be investigated (+2w/measurement) Outlook: New results not before May 2009 GEM-TPC@PANDA/FOPI Collaboration Meeting March 3rd 2009

Field cage Problems / Solutions Rohazell® with Kapton®/Al shield Kapton® reinforcement Material research: HV-stability tests negative, Surface discharges Status: Changes in layer stacking & composition 240 µm Kapton insulation layers foreseen Routing of HV & Gas to/trough FC to be rendered more precisely New type of Rohazell® foam improved features (cell diameter, surface structure, humidity, etc.) under test (+2w) material ordered (+4w, 2k€) Storage- & handling-tools + infrastructure under construction (+12w, 15k€) No off-the-shelf product Time line: Planned completion > June 2009 Voltage divider(s): SMD Resistor on Flexible PCB Staggered Stripline on Kapton® backside shifted by ½ (not visible) GEM-TPC@PANDA/FOPI Collaboration Meeting March 3rd 2009

Field cage Staggered Strips ‘Best’ layout: 1 mm Strip / Gap Large-Inhomogeneity problems solved Design work ongoing (+4w) Various offers ‘en route’ (+4w) Purchase pending (+8w, 3k€) Resistor chain Former problems with supplier solved purchase ongoing (6w, +2k€) Split chains in parallel (1..5 W) to cope with paired tolerances Cooling advisable but not feasible to be realized FEM simulations (E,FT,p) Balanced field configuration with equal material thicknesses FCi/FCo Residual field inhomogeneities O(cm) near the ‘edges’ Shows supremacy of a resistive-foil setup Fine-Strip Copper-on-Kapton layout as fall-back solution (n x100µm ‘thick’!) 3 mm GEM-TPC@PANDA/FOPI Collaboration Meeting March 3rd 2009

Field cage Resistive-foil Restarted design, material tests, market research Crucial design parameters Heat density & -dissipation Thickness & Resistivity-Homogeneity (solutions attacked, more questions emerging) Heating simulations look promising (5 W) Status Material R&D and purchase Still ongoing (may take months, distributed only in USA, alternatives will be addressed soon) Costs of ≈6..10 k€ not covered so far Tooling Construction & market research ongoing Costs of ≈15 k€ not covered so far GEM-TPC@PANDA/FOPI Collaboration Meeting March 3rd 2009

Flanges / Structure Assembly Status: Optimization on the structure complete (mass & shielding, gas- & supplies routing) Clamping fixture functional Back plane & Isolation cover under construction (+4w, 1k€) Monitoring developments stalled Material purchase ongoing (+4w, 2k€) Aging test outstanding (+8w) Time line: Planned completion > May 2009 Beam into the plane GEM-TPC@PANDA/FOPI Collaboration Meeting March 3rd 2009

GEM structures & support Assembly Status: Foils (2C) delivered recently … But: partially faulty Final flange to be produced (+4w) HV-Distribution PCB under construction (+4w) Isolation issues addressed Infrastructure: Tools in production (+2w) Local infrastructure ordered (+ 6w) Quality assurance: Lab tests pending (+6w) Full-scale QA stalled Costs not covered so far: 8 k€ GEMs . 6 k€ Structure, Tooling…-Material 10 k€ Infrastructure Time line: Planned completion > May 2009 Support flange HV Distribution PCB GEM stages Clamping fixture Exploded view Partial assembly GEM-TPC@PANDA/FOPI Collaboration Meeting March 3rd 2009

PadPlane & Support Assembly Status: PadPlane: Various modular designs developed options discussed intensively ready since months Pin-out on SAMTEC connector slightly changed Various offers available (11/14 suppliers disapproved) Ordering done (-8w, 5..6k€) Delivery pending (R&D-type, +6..8w) Heat screening required, under construction (+4w) (Rohazell/GRP sandwich) Flange & Assembly: Final flange to be produced (+4w, 1k€) Material purchase ongoing (+4w, 2k€) Aging test outstanding (+8w) Time line: Possible availability May 2009 GEM-TPC@PANDA/FOPI Collaboration Meeting March 3rd 2009

Electronic-Flange & Cooling Assembly Design: 46 slots for FEBs foreseen Integrated passive liquid cooling, thermal screening, LV distribution Dedicated sealing of inner FC Sensors foreseen (flowi,o, pi,o, Tn, HVn) Supply & distribution at outer periphery Overpressure valves (not shown) Status: Final parts delivered Customized sealing structures fabricated Needs refinement in details and testing Assembly pending Time Line: Planned completion > April 2009 Cooling pots LV-connectors (70A) Stabilizers & Media bridge GEM-TPC@PANDA/FOPI Collaboration Meeting March 3rd 2009

Front-End Electronic (FEBs) Status: nXYTER based 2 chip board delivered & set-up Lab-test revealed higher power consumption than originally quoted  improvement under investigation mid-term redesign required & attacked Signals from 90Sr seen Readout-Concept: In-beam: not attacked Lab readout: triggerable board addressed (‘EXPLODER’MBS) In-beam test pending Time Line: Future tests and use not foreseeable GEM-TPC@PANDA/FOPI Collaboration Meeting March 3rd 2009

General Overview Working Places Material tests (Aging, Geometry) Resistors: Concept Availability, Delivery QA & Selection GEM: Cu@Kapton® (2C) Outgasing/Aging (GRP support) Purchase & Delivery Structure: GR-PBT Tooling & Manufacturing (Timescale) Sensors: Read out concept Slow-Control Integration EC: Design (Calibration equipment) FEE: Basic concept Supply Setup / Tests Cooling: Operation conditions Heat dissipation Temperature Stability FC: Kapton®/Rohazell® sandwich structure Layout Concept (homogeniety) SAP (costs) Tooling / Manufacturing HV-/Heat stability PP: Kapton®/Rohazell® Mech.Stability HeatTransfer/-Shielding Purchase & Delivery Operation: Heat-Shielding/-FlowDetection GEM-TPC@PANDA/FOPI Collaboration Meeting March 3rd 2009

GEM-TPC crew members & tasks Andreas Heinz PadPlane, GEMs Jörg Hehner Aging tests Markus Henske Material tests, Sensors, Infrastructure, Purchase Volker Kleipa Front-end Jochen Kunkel Mechanics, drawings, simulations, assembly Christian Schmidt Front-end Sandra Schwab Part Production, Tooling Daniel Soyk Simulations Bernd Voss ‚All & nothing‘, ideas & concepts, project & logistics Jan Voss General mechanics, Material tests Joachim Weinert Part Production, Tooling

Backup Slides

Status Overview WorkPackages Milestone/Feature Status Next step Open questions / steps Support structure finished Material research ongoing delivery, aging tests Aging Overall Fabrication ongoing input & discussion Geometrical tolerances Field Cage ongoing delivery, tooling, test, … Kapton XC GEM ongoing test & assembly Quality assurance PadPlane ongoing delivery FEB ongoing in-beam test ReadOut Plane & ROC final finished Integration tasks Gas ongoing delivery HV ongoing integration LV ongoing integration Cooling ongoing integration DCS Controller system ongoing input & discussion Cabling ongoing integration Detailed cabling list required Sensors & Actuators Pressure ongoing assembly Over-Pressure ongoing assembly Temperature ongoing assembly Flow-Liquid ongoing assembly Flow-Gaseous ongoing assembly Oxygen under investigation purchase Water under investigation purchase Test beam-time Bonn Sensors ready freshly calibrated still needed FEBs ongoing see above successful ‘baptism of fire’ during ROC (SysCore/EXPLODER) ongoing test show some problems CBM beam time 09 / 2008 GEM-TPC@PANDA/FOPI Collaboration Meeting March 3rd 2009

GEM-TPC@PANDA/FOPI Collaboration Meeting General Issues Status Personnel/staff: Andreas Heinz former staff on fixed-term contract, now on free-lancing Volker Kleipa new member of the crew (electronic engineer) Rahul Arora will join end of March (PhD Student, MC-Pad Marie Curie) Funding: GSI DL-budget problematic & no PANDA money till today QA-procedure & Testing: On-site GEM-QA Full-scale test rig postponed (no budget, low-profile man power) Minimum setup in discussion On-site detector test-setup stalled, may be addressed in May (no budget, low profile manpower) GEM-TPC@PANDA/FOPI Collaboration Meeting March 3rd 2009

Readout-End plate structures Cooling Open questions: Operational conditions  Simulations Feasibility  Tests Media Bridge ‚slap‘ option (others under investigation) GEM-TPC@PANDA/FOPI Collaboration Meeting March 3rd 2009