SVD Ladder assembly at IPMU Yoshiyuki Onuki University of Tokyo, Kavli IPMU Higuchi Takeo, Kavli IPMU

Activities at IPMU L6 Ladder assembly procedure(Ref. previous my talk) Wire-bonding parameter optimization Mechanical QA and misalignment parameters measurement with coordinate measuring machine. Talked by Shimizu(U-Tokyo) TIFR L4 Ladder assembly at IPMU

Optimization of wire-bonding for PA1 on Si-Detector All testing was performed at the IPMU. Optimization of wire-bonding for PA1 on Si-Detector Dong-Ha Kah, Kuk-Hyun Kang, Chang-Woo Joo Toru Tsuboyama Kyoungpook National University Seoul National University KEK https://www.dropbox.com/sh/qurfkz5j5tx569u/raxEZ78wU7 Test data sharing rink

Test Set-up Bonding Pulling Change bonding parameters Measurement of force per bonding

Sample PA1 on the CMS silicon detector CMS silicon detector PA1 Au-Cu

Parameter 1 Parameter (next page) Bonding target Bonding condition Power Force Time Bonding target PA1 to Detector Detector to Detector Bonding condition 1st target (PA1 pad) 2nd target (bias-ring) 1700 um 2nd target (bias-ring) 1200 um 1st target (AC pad) <PA1 to Detector test> <Detector to Detector test> PA1 to Detector Detector to Detector Wire length 1200 μm 1700 μm Wire height 500 μm Bonding wires 20 Bonding speed 50000 μm/sec

Parameter 2 Step1 : PA1 to Detector Step2 : Detector to Detector test Power 60,70 70 Force 20 26 Time 10,20 30 Step2 : Detector to Detector test Detector to Detector Power 50,60,70 Force 20,26 Time 20,30 Final : PA1 to Detector PA1 Detector Power 60,70 60 Force 20 Time

Detector to Detector Bonding Optimization process STEP 1 Final PA1 to Detector Bonding Fixing Detector Parameters (Power 70, Force 26, Time 30) PA1 to Detector Bonding Fixing optimized Detector Parameters PA1 Power 60 or 70 Force 20, Time 20 Detector to Detector Bonding To optimize detector parameters STEP 2 Detector Power 60, Force 20, Time 20

Pulling Test Pulling force for PA1 to Detector Break Type PA1 (P70,F20,T20) Detector (P60, F20, T20) PA1 (P60,F20,T20) PA broken neck 75% Detector broken neck 25% Detector lift-off 35% Detector broken neck 30% PA lift-off 15% PA broken neck 15% Wire broken 5%

Summary REBO-7 (wire-bonding machine) is available to make 10 g. In PA1 case, parameters are recommended PA1 (Power 60, Force 60,Time 20(ms)) Detector (Power 60, Force 60,Time 20(ms)) Foot-prints PA1 (P60, F20, T20) Detector (P60, F20, T20)

Summary Wire-bonding parameter optimization for PA was performed by Korean group. The test with Si-detector and PA had been studied from 7th Jan. to 31th Jan. The result shows over 10gf bonding force in average. We are preparing TIFR assembly work at IPMU.

New space for TIFR at IPMU Construction: 21th(Tur) Feb. – 27th(Wed) Feb.

Status We are preparing the MoU between TIFR and Kavli IPMU. New clean room space will be allocated for TIFR L4 assembly. Our(Japan, Korea, TIFR) office room will be allocated in the Kashiwa Research Complex 2 building. Wire bonder shipment work has started. The bonder, Delvotec 6400, will be delivered by 20th March.

Back-up slides

Pulling Pulling force for PA1 to Detector

Pulling Pulling force for Detector to Detector

Bonding Foot-prints (don’t measured each width) Sensor (P50, F20, T20)