3rd International Workshop on Mechanisms of Vacuum Arcs (MeVArc 2012)

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Presentation transcript:

3rd International Workshop on Mechanisms of Vacuum Arcs (MeVArc 2012) Surface roughness and field emission measurements on diamond turned Cu samples Stefan Lagotzky, Günter Müller Berg. Universität Wuppertal Tomoko Muranaka, Sergio Calatroni CERN, Geneva Motivation and strategy Measurement techniques and samples Surface quality Field emission (FE) results Conclusion and outlook 02.10.2012 3rd International Workshop on Mechanisms of Vacuum Arcs (MeVArc 2012)

Motivation and strategy Dark current/Electric Breakdown is the main field limitation of accelerating structures for CLIC (Eacc=100 MV/m, Epk=243 MV/m) Deep and quantitative understanding of the origins of breakdown processes is important Investigation of the Cu surface quality after different fabrication procedures Strategy Preparation of Cu samples with all/selected preparation steps Investigation of the actual surface quality. Roughness? Cleanliness? Measuring of the initial enhanced field emission (EFE, dark currents) of the samples after the preparation Investigation of the EFE from single emitters. Stability? High resolution SEM identification of the emitting defects (if possible) Presenting here: First results of surface quality measurements and EFE measurements

FE & SEM measurement techniques Field emission scanning microscope (FESM): - localisation of emitters - FE properties 500 MV/m 10-7 mbar 10-9 mbar Regulated V(x,y) scans for FE current I=1 nA & gap ∆z  emitter density at E=U/∆z Spatially resolved I(E) measurements of single emitters  Eon, βFN, S Ion bombardment (Ar, Eion= 0 – 5 kV) and SEM (low res.) In-situ heat treatments up to 1000°C Ex-situ SEM + EDX Identification of emitting defects Correlation of surface features to FE properties (positioning accuracy ~ ±100 µm)

- surface roughness - defect geometry Optical profilometer (OP) with atomic force microscope (AFM): Full surface quality scans by OP: white light irradiation and spectral reflection (chromatic aberration) up to 20×20 cm2 and 5 cm height difference 2 µm (3 nm) lateral (height) resolution further zooming by AFM: ±2 µm precision of positioning with respect to the optical profilometer 95x95 µm2 scanning range 3 (1) nm lateral (height) resolution contact or non-contact modes CCD camera for positioning control granite plate with an active damping system for undisturbed nm measurement clean laminar air flow from the back to reduce particulate contamination - surface roughness - defect geometry DPG-Frühjahrstagung, Göttingen, 27. Feb. 2012 3rd International Workshop on Mechanisms of Vacuum Arcs (MeVArc 2012) 4

Samples Two flat Cu samples Protection cap Diameter: ~11 mm One hole as mark to identify the position in different systems Diamond turned and glued to a sample holder at CERN Mounted to an adapter for the FESM at BUW Surface cleaned with ionized N2, cleanroom condition (class 100) with 5 bar pressure Teflon protection cap to avoid damage and contaminations after polishing and cleaning Only 1 sample measured yet Investigated surface sample holder FESM adapter

Surface quality (OP) Survey scan (20 µm resolution) 1x1 mm² Survey scan (20 µm resolution) High resoultion (2µm) measurements 2x2 mm² Few particles/scratches can be found (d ≥ 1 µm) Ridges as result of diamond turning? Slightly waved surface (λ~ 0,5 – 1 mm)

Surface quality (AFM) AFM scan of ridges More particles (Ø = 0.6 – 3 µm) observed Polycrystalline structure? (dgrain ~ 60 nm) Ridges: Height h = 70 nm Curvature radius r = 30 – 50 nm Calculation of roughness and estimation of geometric field enhancement factor for FE

Roughness and geometric field enhancement Surface roughness: z(xi, yj) = actual height value of profile n, m = No. of points in x and y direction = average height value particles / protrusions: scratch: metal-insulator-metal (MIM): Electric field enhancement factor: h = height of defect r = curvature radius EL = local electric field on defect ES = electric field on flat surface → emission area

Surface roughness OP AFM Comparison with Nb (OP): Ra=20 nm Rq=24 nm (100x100 µm²) Ra=3 nm Rq=4 nm (10x10 µm²) Ra=126 nm Rq=145 nm (2x2 mm²) Ra=43 nm Rq=54 nm (1x1 mm²) Comparison with Nb (OP): 100 µm EP, polycrystalline 40 µm BCP, single crystal (DESY) 120 µm BCP, single crystal (JLAB) Ra=518 nm, Rq=646 nm, (0,5x0,5 mm²) Ra=57 nm, Rq=77 nm, (1x1 mm²) Ra=126 nm, Rq=165 nm, (1x1 mm²) Even without electrochemical polishing: very flat surface!

Estimation of βgeo for particulets H=207nm R ≤ 94nm → β ≥ 4.7 H=113nm R ≤ 94nm → β ≥ 3.7 H=107nm R ≤ 94nm → β ≥ 3.6 Many particles: H < R, only few with β > 2.5 Only low values for βgeo What about polycrystalline structure?

Estimation of βgeo for grain boundaries H = 33 nm R ≤ 10nm β ≥ 5.8 Grain boundaries: slightly higher βgeo Altogether only low β values At which field EFE sets in? 𝑗 𝐸 = 𝐴 (𝛽𝐸) 2 𝜙 𝑡(𝑦) 2 𝑒 − 𝐵 𝜙 3 2 𝜈(𝑦) 𝛽𝐸 Modified Fowler-Nordheim (FN) law 𝜈 𝑦 =𝑡 𝑦 ≈1 𝑦= Δ𝜙 𝜙 𝐴=154, 𝐵=6830 With β = 5,8: 1 nA/µm² at ~500 MV/m (Φ=4,4 eV)

Regulated E(x,y) maps for I = 1 nA , ∆z ≈ 50 µm of the same area FESM results Regulated E(x,y) maps for I = 1 nA , ∆z ≈ 50 µm of the same area 130 MV/m 160 MV/m 190 MV/m Eon = 120 MV/m EFE starts at 130MV/m and not 500MV/m Emitter density increases exponentially with field Activated emitters: Eact=(1,2 – 1,4)∙Eon 2nd measurement: shifted to lower fields Possible explanations: Surface oxide adsorbates

FE due to oxides and adsorbates → activation by burning of conducting channels: ad- or desorption lead to enhancement or reduction of field resonance tunneling can occur: [2] (2) Adsorbates: (1) Nb surface oxide: MIV Ambient oxide layer MIM Nb Insulator Nb Switch-on state persists! for a long period without E under UHV at RT → permanent formation of conducting channels [1] Impact for cavities: Heating or rf power ? [4] activate emitters (3) Reduction of isolating Nb2O5 layer by heat treatment [3]: [1] R. V. Latham, “High vacuum insulation,” (1995) [2] J. D. Jarvis, et al. IFEL 2010, WEPB46 (2010) [3] T. Proslier et.al. Appl. Phys. Let., 93, 192504 (2008) [4] J. W. Wang, et al. SLAC-PUB-7684 (1997) Enhance MIM-activation of particles Enhance MIV-activation or surface defects Nb2O5 natural (~5nm) isolating NbO2 semiconducting NbO metalic Heating of a Nb surface can activate EFE

Local measurements of a typical emitter on Cu FN-plot Eon(1nA)=118MV/m Field calibrated via U(z) β and S: Calculation from FN-law Local measurements of the strongest emitters 𝐼(𝐸)= 𝐴𝑆 (𝛽𝐸) 2 𝜙 𝑡(𝑦) 2 𝑒 − 𝐵 𝜙 3 2 𝜈(𝑦) 𝛽𝐸

Results of β and S of strongest emitters 1 2 3 5 Sample size Anode size 𝑆~ exp⁡( 1 𝛽 ) 𝛽 2 (FN-law) Strong fluctuation of EFE Fit for FN law reflects nearly const. current range But: FN analysis provides impossible S values Random current switching and S values of single emitters cannot only be described by FN law. Influence of surface oxides and adsorbates is important, too (MIM and MIV). 3 2 1

SEM correlations Emitter 1 Emitter 2 Emitter 4 Too many surface features and particles near the emission sites Impossible to give a clear correlation Surface features = inclusions after diamond turning? Damage layer?

Conclusions and Outlook The Cu surface is very flat (even after diamond turning) Remaining particulates and grains revealed the highest βgeo (≥ 5.8) EFE sets in between 120MV/m and 130 MV/m, earlier than expected from βgeo EFE from single emitter: very unstable with impossible values of S Emission cannot be described by FN-law, but other mechanism are involved No correlation to SEM images, too many particulates and surface features Electrochemical polishing and Dry Ice Cleaning (DIC) of the surface should improve the EFE of the samples Outlook: Measuring additional samples with the same fabrication Measuring samples after the standard CLIC manufacturing procedure (diamond turning, slight chemical etching, vacuum firing in H2 atmosphere) Installing a DIC system at the BUW and application to Cu samples