From: Reliability of Lead-Free Solder Joints

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From: Reliability of Lead-Free Solder Joints Date of download: 10/23/2017 Copyright © ASME. All rights reserved. From: Reliability of Lead-Free Solder Joints J. Electron. Packag. 2006;128(3):297-301. doi:10.1115/1.2229234 Figure Legend: Young’s modulus of lead-free and tin-lead solders

From: Reliability of Lead-Free Solder Joints Date of download: 10/23/2017 Copyright © ASME. All rights reserved. From: Reliability of Lead-Free Solder Joints J. Electron. Packag. 2006;128(3):297-301. doi:10.1115/1.2229234 Figure Legend: Tensile creep strain rate for SnAgCu and Sn37Pb solder alloys at 50°C

From: Reliability of Lead-Free Solder Joints Date of download: 10/23/2017 Copyright © ASME. All rights reserved. From: Reliability of Lead-Free Solder Joints J. Electron. Packag. 2006;128(3):297-301. doi:10.1115/1.2229234 Figure Legend: Thermal cycling test of lead-free 256-Pin PBGA package on PCB (−25–125°C, one cycle per hour)

From: Reliability of Lead-Free Solder Joints Date of download: 10/23/2017 Copyright © ASME. All rights reserved. From: Reliability of Lead-Free Solder Joints J. Electron. Packag. 2006;128(3):297-301. doi:10.1115/1.2229234 Figure Legend: 256-Pin PBGA with 25°C, 1h thermal cycle)

From: Reliability of Lead-Free Solder Joints Date of download: 10/23/2017 Copyright © ASME. All rights reserved. From: Reliability of Lead-Free Solder Joints J. Electron. Packag. 2006;128(3):297-301. doi:10.1115/1.2229234 Figure Legend: Reliability engineering