DESIGN FINDINGS FOR THE CONSOLIDATION OF THE DIODE BUS BAR INSULATION

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Presentation transcript:

DESIGN FINDINGS FOR THE CONSOLIDATION OF THE DIODE BUS BAR INSULATION Th. Sahner EN/MME 10. October 2017

DESIGN FINDINGS FOR THE CONSOLIDATION OF THE DIODE BUS BAR INSULATION Present Design Th. Sahner EN/MME 10. October 2017 Ø90mm Ø90mm Present Situation (15%) Present Situation (85%) Ø162.5 Ø162.5 Present Situation (100%)

DESIGN FINDINGS FOR THE CONSOLIDATION OF THE DIODE BUS BAR INSULATION Half Moon Splice Insulation Proposal Th. Sahner EN/MME 10. October 2017 Present Situation (15%) Proposal Nominal gap size 1mm Filling with epoxy of large gaps >1.5mm 1 mm 1mm Left and right half moon insulator Fixation screw clued in the half moon Insulation tube The half moon parts are installed 2 M6 are screwed and glued in the part

DESIGN FINDINGS FOR THE CONSOLIDATION OF THE DIODE BUS BAR INSULATION Half Moon Splice Insulation Proposal Th. Sahner EN/MME 10. October 2017 Proposal A Preformed Kapton® inserts New half moon geometry Old half moon Cleaning New insulation pieces with increased space. Preformed Kapton foils Exceptionally epoxy filling of large gaps Present Situation (85%) 8.5 17 swarf

DESIGN FINDINGS FOR THE CONSOLIDATION OF THE DIODE BUS BAR INSULATION Half Moon Splice Insulation Proposal Th. Sahner EN/MME 10. October 2017 Proposal B Present Situation (85%) swarf 8.5 17 Covering the gap with modified half moon insulators. Problem with the disassembly of the insulation tube and was not retained as a solution.

DESIGN FINDINGS FOR THE CONSOLIDATION OF THE DIODE BUS BAR INSULATION Half Moon Splice Insulation Th. Sahner EN/MME 10. October 2017 Present Situation (85%) Proposal C Proposal D swarf 8.5 17 Grid insert Insulation layer on the inside The ideas C and D are not retained as there is no reasonable technical solution to realize such a proposal.

DESIGN FINDINGS FOR THE CONSOLIDATION OF THE DIODE BUS BAR INSULATION Diode Box Insulation Insert Proposal Th. Sahner EN/MME 10. October 2017 First Proposal Ø90mm This solution was not retained due to the positioning uncertainty of the flange and diode. Furthermore possible thermal problems during the welding of the flange Ø162.5

DESIGN FINDINGS FOR THE CONSOLIDATION OF THE DIODE BUS BAR INSULATION Diode Box Insulation Insert Proposal Th. Sahner EN/MME 10. October 2017 Second Proposal Ø90mm Ø162.5 This solution was not retained due to the positioning uncertainty of the diode bus bar.

DESIGN FINDINGS FOR THE CONSOLIDATION OF THE DIODE BUS BAR INSULATION Diode Box Insulation Insert Proposal Th. Sahner EN/MME 10. October 2017 Recent Part Design Proposals Ø90mm Injection molding Ø162.5 CNC Milling

DESIGN FINDINGS FOR THE CONSOLIDATION OF THE DIODE BUS BAR INSULATION Material and Technologies Th. Sahner EN/MME 10. October 2017 PE-HD PPS-Ryton PEI ULTEM 1000 PE-HD PPS-Ryton® PEI-ULTEM® 1000 Part Materials EP GC 203 (G11) EP GC 203 (G11) Part Manufacturing technologies CNC Milling Injection molding CNC Milling Injection molding PPS = PolyPhenylene Sulfide, melting point of about 285°C PE HD = PolyEthylene High Density, melting point‎ of ‎115–135 °C PEI = PolyEtherImide, a melting point of 73–75 °C.

DESIGN FINDINGS FOR THE CONSOLIDATION OF THE DIODE BUS BAR INSULATION Economic Aspects Th. Sahner EN/MME 06. October 2017 high ~1000 parts each in total In different versions possible Cost 3D printing CNC Milling Injection Molding low Quantity high 3D Printing was not considered by the fact that the material is not available and the quantity is too big ~1300parts

DESIGN FINDINGS FOR THE CONSOLIDATION OF THE DIODE BUS BAR INSULATION Th. Sahner EN/MME 10. October 2017 RETAINED SOLUTION Cleaning 2 Kapton® insulation foils with optimized half moon parts design, CNC machined in G11 Polymer insert, manufactured in Injection molding technology , screwed together with the diode box Exceptionally epoxy filling of large gaps More information about materials and FEM analysis by Friedrich Assembly and mechanical testing by Florian

DESIGN FINDINGS FOR THE CONSOLIDATION OF THE DIODE BUS BAR INSULATION Th. Sahner EN/MME 10. October 2017 Thank You