2018/6/15 The Fast Tracker Real Time Processor and Its Impact on the Muon Isolation, Tau & b-Jet Online Selections at ATLAS Francesco Crescioli1 1University.

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Presentation transcript:

2018/6/15 The Fast Tracker Real Time Processor and Its Impact on the Muon Isolation, Tau & b-Jet Online Selections at ATLAS Francesco Crescioli1 1University of Pisa – INFN Pisa – francesco.crescioli@pi.infn.it on behalf of the FTK Collaboration Why Add a Hardware Tracker? Proposed FTK in Trigger System FTK Execution time for 100 WH events with 75 pile-up events Event clean-up in~25 us It reconstructs all tracks with Pt>1 GeV with good precision The FTK system receives data from ReadOut Drivers (RODs) ROD output is duplicated by a dual output board Tracks reconstructed by the FTK processors are written into ReadOut Buffers (ROBs) for use at the beginning of LVL2 trigger processing FTK operates in parallel with the silicon tracker readout following each LVL1 trigger FTK-based isolation CALO ISO 1 FTK-based  selection The ATLAS Inner Detector (ID) 1034 1034 6.2 m 2.1 m ID: ~100 million channels of silicon pixel and strip (SCT) detectors and straw drift tubes FTK uses pixel and SCT hit information to infer charged particle tracks FTK processes 8 overlapping Φ-regions in parallel TRACK ISO Fakes for both single & triple prongs: few ‰ Single prongs 1034 1034 Pattern Recognition using Associative Memory (AM) Divide into 8 Φ sectors Trigle prongs  ATLAS Pixels + SCT A large bank of pre-computed hit patterns is used for very fast tracking (memory → speed) Bingo analogy Allow a small overlap for full efficiency Define 11 logical layers Combining barrel and disk modules Many parallel buses 100MHz/bus 1/2  processor FTK Functional Diagram & Architecture 1/2  processor Linearized track fit using full-resolution silicon hits after pattern recognition The chip under development Large use of FPGA GHz serial links One processing unit= 1 slot Control logic in Standard Cell : fast development and reliability + Associative Memory bank in Full Custom : high density, low power, better performances (both in TSMC 65nm technology) New in this chip Ternary logic Special bits can store values 0 1 X (don't care) Very useful in FTK: - Smaller banks - Lower roads rate Highly parallel data flow: 64 η - Φ towers in 8 core crates and 4-fold parallelism within each tower (for 3×1034) W 75 pile-up events 8 Core crates, 16PUs/crate, 64 eta-phi towers A scalable system First prototype (2011): 8k patterns/chip Production (>2014): 80k patterns/chip (old chip 5k patterns/chip, 6 bus instead of 8, no don't care, 100 mm2 vs 12 mm2) Core Crate 45o Hits from DF Pix+axial SCT Stereo SCT hits from DF W 17 pile-up events 8 PUs, one per Φ sector Everything in a single crate 7layer tracks Full custom AM layer 32 x 1 layer bank NAND CELL NOR CELL 11 layers FTK tracks High density: - 8x 12 bit (binary) + 3 bit (ternary) - majority logic - readout tree ~550 x 1.8 μm Low power: - Current race scheme - Selective precharge 50% less power FTK Output tracks to FTK ROD Extrapolate to SCT stereo + 11-layer fits + removal of 11-layer fit duplicates 1  tower 7-layer (3 pixel + 4 axial SCT) AM + fits 1 ACES 2011 ~ 9-11 March 2011 ~ CERN ~ Geneva, Switzerland