K. H. Lee, H. Y. Lee, Young-Gi Kim, J. Yang, S. M. Yang, K.J. Chung, Y.S. Na and Y. S. Hwang Residual Gas analysis during Glow discharge cleaning, Baking.

Slides:



Advertisements
Similar presentations
AMCF Materials Characterization School 2012 X-Ray Photoelectron Spectroscopy Tim Morgan.
Advertisements

High-Vacuum Technology Course
Center for Materials for Information Technology an NSF Materials Science and Engineering Center Vacuum Fundamentals Lecture 5 G.J. Mankey
Vacuum equipment. Pumps Rotary vane pumps Rotary piston pumps Roots pumps Turbo molecular pumps Diffusion pumps Getter pumps –Sublimation pumps.
1. Pump down the chamber from the atmosphere pressure 2. Using RHEED to obtain diffraction images 3. Open the RHEED chamber or venting from high vacuum.
Safety Review: RF Issues Derun Li Absorber Safety Review December 9-10, 2003 Lawrence Berkeley National Laboratory Berkeley, CA
Varian 3118 Thermal Evaporation System
PSB H 0 -H - Injection: Sectorisation Analysis C.Pasquino, J. Hansen, P.Chiggiato LIU - PSB Ho-H- Injection Meeting 1.
Solar Cell conductive grid and back contact
Jungmin Jo, Jeong Jeung Dang, Young-Gi Kim, YoungHwa An, Kyoung-Jae Chung and Y.S. Hwang Development of Electron Temperature Diagnostics Using Soft X-ray.
Threshold ionization mass spectroscopy of radicals in RF silane discharge Peter Horvath 5/19/2004 Progress of experiments.
Refining of Liquid Metal by Hydrogen Cold Plasma Shanghai University Weizhong Ding School of Material Science and Engineering Shanghai University.
Vacuum science.
ASIPP In-time retention evaluation by particle balance analysis on HT-7 Y. YANG*, and HT-7 team Institute of Plasma Physics, Chinese Academy of Sciences.
Vacuum Fundamentals 1 atmosphere = 760 mm Hg = kPa 1 torr = 1 mm Hg vacuum range pressure range low 760 ~ 25 torr medium 25~ high ~ 10.
Techniques of Vacuum and Basics of High Voltage (2/3) Pauli Heikkinen Jyväskylä University.
S. Jachmich (slide 1) Vessel Conditioning SL-Training, Nov 2010 Vessel conditioning Stefan Jachmich SL-Training 2010.
Center for Materials for Information Technology an NSF Materials Science and Engineering Center Vacuum Systems Lecture 6 G.J. Mankey
MICE CC Test Status Ruben Carcagno 11/06/13 1. Cooldown Coil Temperature (calculated average in each of 8 coil segments) SC Transition (voltages across.
LAPPD Collaboration Meeting 12/10/2011 Ossy Siegmund, Experimental Astrophysics Group, Space Sciences Laboratory, U. California at Berkeley 20cm Sealed.
Pressure-measurement errors in a cold- cathode-ionization gauge caused by electrons and photoelectrons Hiroshi Saeki a), Tamotsu Magome a), Tsuyoshi Aoki.
Vacuum Technology.
ASIPP In-time retention evaluation by particle balance analysis on HT-7 Y. YANG*, and HT-7 team Institute of Plasma Physics, Chinese Academy of Sciences.
Top Down Method Vacuum Applications in Nanomanufacturing Author’s Note: Significant portions of this work have been reproduced and/or adapted with permission.
Threshold ionization mass spectroscopy of radicals in RF silane discharge Progress report 11/19/2003 Contributors: Alan Gallagher Peter Horvath Karoly.
X-ray absorption spectroscopy (XAS)
Solar Cells need a top side conductor to collect the current generated They also need a conductive film on the backside.
Beam Loss Monitor Production. IHEP (Protvino) V. Grishin, A. Koshelev, A. Larionov, V. Seleznev, M. Sleptsov, A. Sytin At IHEP manufactured: Ionization.
1 Differential Residual Gas Analysis in the HT-7 Tokamak J.S Hu and HT-7 vacuum group Institute of Plasma Physics, Chinese Academic of Science, Hefei,
SPS coating studies 28 February, 2016TE-VSC1 Present situation of the development of e-cloud mitigation methods -MD 2011 results -Carbon coating of dipoles.
THIN FILMS FOR CLIC ELEMENTS Outline Motivation The role of MME-CCS DB and MB transfer lines Main beam Main beam quadrupoles Other issues conclusions CLIC.
Applications as Residual Gas Analyzer (RGA)
Performed at Brookhaven National Lab for Fermilab Main Injector Electron Cloud Studies June 2009 Linda Valerio September 11, 2009.
Cryo Pump Limitations Recent operating issues with helium Mick Mann ANSTO – Lucas Heights - Australia.
Outgassing of Outer Tracker Glue Maarten Buffing (VU) June
DESIGN AND PERFORMANCE OF VACUUM SYSTEM FOR HIGH HEAT FLUX TEST FACILITY Rajamannar Swamy*, Prakash Mokaria, Samir Khirwadkar, Sunil Belsare, M S Khan,
Jari Koskinen 1 Thin Film Technology Lecture 2 Vacuum Surface Engineering Jari Koskinen 2014.
1 Before degassing RGA head After degassing RGA head RGA scans of test dewar December 23, 2005 (PR and SP) Ion Gauge readings : Vacuum (with RGA off) before.
Solar Cells need a top side conductor to collect the current generated They also need a conductive film on the backside.
Outgassing studies DC Spark Corrected calibration Mo and Cu data with same calibration data and same experimental environment Field emission measurements.
RGAs at the companies during XFEL cavities production and cavity performances Paolo Michelato INFN – LASA Paolo Michelato, TTC Meeting at Saclay, July.
Vacuum Systems for Electron Microscopy Constraints on Specimens Specimens placed in the electron microscope must be able to withstand very high vacuum.
Holders and Pumps Summary
A Study on the Possibility of Initiating Tungsten Alpha Decay Using Electric Explosions Alabin K.A.
Sub-system integration for the VBOX
International Youth Conference on Fusion Energy Conference
Study on Monatomic Fraction Improvement with Alumina Layer on Metal Electrode in Hydrogen Plasma Source Bong-Ki Jung, Kyung-Jae Chung, Jeong-Jeung Dang,
Study on Electron Cyclotron Heating (ECH)
Vacuum At LLO 2016 SURF Udochu, Ogbonnaya LIGO-T
1.3-GHz Cavity Vacuum Furnace at IB4
Preliminary study for Soft X-ray Spectroscopy in VEST
A study of the effect of salinity on pulsed arc discharge in water
Seok-geun Lee, Young-hwa An, Y.S. Hwang
Design of Interferometer System
Operation status of KTX
Department of Nuclear Engineering Seoul National University
In-time retention evaluation by particle balance analysis on HT-7
SNS Operational History
Charlie Sinclair Cornell University (ret.)
V. Measurement pressure gauges, flow meters
-Honors Thesis Defense- In Situ Ellipsometry of Surfaces in an Ultrahigh Vacuum Thin Film Deposition Chamber Joseph Choi Department of Physics and Astronomy,
Plasma Cleaning Safety Presentation
Mass Spectroscopy (MS) Applications as Residual Gas Analyzer (RGA)
VIII. Production of Vacuum
Charlie Sinclair Cornell University (retired)
BASIC VACUUM PRACTICE.
NEG-coated gun: Black R30 arc at 227kV, white R30 arc at 164 after refurbishing and second bake Carlos Wednesday, August 10, 2018.
SPECTROPHOTOMETRY Applied Chemistry.
Residual Gas Analyzer (RGA)
Vacuum System Design for the Target Monolith System
Presentation transcript:

K. H. Lee, H. Y. Lee, Young-Gi Kim, J. Yang, S. M. Yang, K.J. Chung, Y.S. Na and Y. S. Hwang Residual Gas analysis during Glow discharge cleaning, Baking and UV treatment in VEST Nuplex / A3 summer school / 2015.07.20

4. Conclusion & Future Work 1. Introduction Contents 2. Experimental Setup - impurity monitoring system 4. Conclusion & Future Work 1. Introduction 3. Experiment - Residual gas analysis in VEST - GDC - Baking wall conditioning - UV treatment

Introduction Motivation The early plasma current quenching even with sufficient loop voltage has been observed in VEST It is considered to be resulted from the radiation cooling due to the oxygen impurity influx during a discharge limited by the tungsten limiter. And the oxygen exist in water form Impurities inside fusion devices can affect plasma performance Confirmation of Impurity control effect focusing on water outgassing by wall conditioning techniques Impurity control Impurity diagnostics Monitoring system

Introduction Motivation Residual Gas Analyzer Source Quadrupole Detector      𝑓 2 𝑟 0 2      𝑓 2 𝑟 0 2 m : ion mass f : frequency (MHz) ro : radius between poles

Experimental setup Impurity Monitoring System Design Gauge PFEIFFER full range gauge Differential Pumping Chamber Angle valve MDC KGV-1500C Gauge PFEIFFER full range gauge Hot cathode filament gauge Gate valve MDC KGV-1500C QMS 200 PFEIFFER full range gauge Valve Gate valve – CF 6” Roughing valve/ foreline valve Vent valve Pump Oil rotary pump (D20A) - NW40 ->pumping speed:380l/m ->ultimate pressure:5× 10 −3 Torr PFEIFFER TMP 521P - CF 6” ->pumping speed:290l/m( 𝑁 2 ) ->ultimate pressure:5× 10 −10 Torr Differential pumping RGA operating pressure: ~7.5×10 −5 𝑡𝑜𝑟𝑟 Pressure difference between VEST main chamber and RGA system can be made by controlling gate valve in front of RGA Real time Impurity monitoring during high pressure such as VEST shot operation, Glow discharge cleaning is possible

Experiment Residual Gas Analysis of VEST VEST device has main 8 peaks ->1, 2, 14, 16, 17, 18, 28, 32,44 Cascade shape of 16, 17, 18 line Indicates water exist Mass16 : Mass17 : Mass18 = 1 : 22 : 77 Gas type and partial pressure can be calculated from peak current data ->major gas : Hydrogen, Methane , Water Air(Nitrogen, Oxygen, Argon) Carbon dioxide Every partial pressure which is taken from RGA signal changes with total pressure -> use water/air(Ar) ratio to evaluate air is choosed because it has enough high signal and it is not related directly with wall conditioning effect VEST full spectrum data (2015-06-29 10:22)

Experimental Setup - discharge current : 1.5A - cleaning time: 6hours Experiment GDC Glow discharge plasma H+ ion Water, oxygen Before 4/21 5:54 분 After 4/21 10:21분 4/21 12:31분 Glow discharge cleaning in VEST Experimental Setup - discharge current : 1.5A - cleaning time: 6hours Ions are accelerated by DC, AC or RF voltages toward the wall. And this wall surface is sputter cleaned.

Partial pressure of gases and water/air ratio Experiment GDC Partial pressure of gases and water/air ratio 6hours of 𝑯 𝟐 1.5A GDC When GDC is started, partial pressure of all gases increase by hydrogen gas injection through gas line which have slight other gases After discharge cleaning, partial pressure of water goes down and then return to before state for 4hours but it need more research to know its cause Water to air(argon) ratio help to evaluate wall conditioning effect because it is not affected by pressure changes. Water to air ratio shows that water comes off of the wall at first. when GDC is finished, detached water get out of the chamber through the pump or go to wall again. It appears water ratio decreasing Before 4/21 5:54 분 After 4/21 10:21분 4/21 12:31분

Experiment Baking effect Experimental setup Heating tool : Heat tape, band heater Heating time : 1h, 4h, 12h Temperature : 180°C Heating area : 1649 𝒄𝒎 𝟐 Heating part : cryo pump duct whole chamber baking would be more effective than partial baking. But in VEST, because of complicated structure, we should take partial baking method. We think that cryo pump duct is one of the most effective parts because it is the path which the water goes out.

Experiment Baking effect Partial pressure of gases and water/air ratio Heater on During 12hours baking treatment, 𝑯 𝟐 𝟎 partial pressure decreasing is observed. Water to air ratio changes from 1.94 to 1.80 When heater turns on, water ratio increase slightly. And then water decrease steadily RGA에 찍힌 pressure와 total pressure는 다를 수 있음 RGA에는 after baking이 reference보다 조금 낮에 측정됨

Experiment UV treatment Experimental setup Light source: UV lamp through quartz window(SANKYO DENKI) in-vacuum lamp UVB-100(rbd instrument, movable) Source power : 36W(outer lamp) 20W(in-vacuum lamp) Wave length : 253.7nm(outer lamp) 245nm(70%),185nm(30%) Treatment time: 8hours

Experiment UV treatment Partial pressure of gases and water/air ratio UV lamp on UV treatment using two lamps shows water partial pressure growth Water to air ratio changes from 1.3 to 1.4 it means that water detached from wall remain in chamber. Two peaks of pressure and other signals is observed. But is can not understand yet. RGA에 찍힌 pressure와 total pressure는 다를 수 있음 RGA에는 after baking이 reference보다 조금 낮에 측정됨

Experiment UV with Baking Comparison UV treatment only case with UV + Baking RGA에 찍힌 pressure와 total pressure는 다를 수 있음 RGA에는 after baking이 reference보다 조금 낮에 측정됨 UV treatment only UV treatment with baking In UV treatment case, water detached from wall can not get out from chamber. It shows water ratio increasing Baking of cryo pumping duct helps to release water. In UV with baking case, water ratio which is increased in early stage is eliminated with time. Finally, water ratio is reduced after treatment finished steadily. Water ratio changes from 1.42 to 1.38 for 16hours

Experiment comparison with reference Reference case that any treatment is not conducted also shows water ratio changes from 1.98 to 1.94 for 12 hours All wall conditioning method that we are taken shows water removing effect. GDC : 1.83 to 1.41 (8h) Baking: 1.94 to 1.80 (12h) UV + Baking : 1.42 to 1.38 (16h) Although UV with baking treatment shows lower reduction effect than other methods or reference, it seems to be because starting point is already low. Reference GDC RGA에 찍힌 pressure와 total pressure는 다를 수 있음 RGA에는 after baking이 reference보다 조금 낮에 측정됨 Baking UV + Baking

Conclusion & Future work - Find the optimum of GDC, Baking and UV treatment condition such as heating area, time, temperature etc. - Research how to hold the GDC effect - Comparison between VEST operations before and after wall conditioning Conclusion - In order for impurity monitoring in VEST, RGA with differential pumping system is developed. - After glow discharge cleaning, water ratio decrease significantly in VEST - Baking treatment can help to decrease water in VEST wall. But In VEST, it can not cover whole chamber because of complicate outside structure - In this situations, water detaching effect of UV treatment is another solution. Even though, it needs baking to release water, UV with baking seems to be able to replace whole baking

Partial pressure calculation Experiment Backup Partial pressure calculation 𝑃𝑃 𝐴 = 𝐼 𝐴𝐵 × 𝐹𝐹 𝑁28 𝐹𝐹 𝐴𝐵 × 𝑋𝐹 𝐴 × 𝑇𝐹 𝐵 ×𝐷𝐹×𝑆 ≈ 𝐼 𝐴𝐵 𝐹𝐹 𝐴𝐵 × 𝑋𝐹 𝐴 ×𝑆 𝑃𝑃 𝐴 = partial pressure of Gas A 𝐼 𝐴𝐵 = Current of the peak at Mass B from Gas A 𝐹𝐹 𝑁28 = Fragmentation Factor for Nitrogen Mass 28 (usually taken as 1.0) 𝑋𝐹 𝐴 = Ionization Probability of A 𝑇𝐹 𝐵 = Transmission factor for Mass B 𝐷𝐹 = Detection Factor (usually taken as 1.0) 𝑆 = Sensitivity for Nitrogen at Mass 28 in Amps/Torr RGA에 찍힌 pressure와 total pressure는 다를 수 있음 RGA에는 after baking이 reference보다 조금 낮에 측정됨 -> 이 식으로 부터, 각 gas들의 partial pressure 값을 절대량으로 알 수 있음 다만, 질소에 대한 RGA 자체의 sensitivity를 몰라 상수인 S를 제외하고 계산함 단위가 pressure로 나타나진 않겠지만 각 gas의 절대량을 알고 비교할 수 있음 -> 그러나, partial pressure는 압력이 감소하면 따라서 감소하므로 다른 압력일 때 비교하기 어려움. 위의 그래프에서와 같이 모든 mass의 current의 총합이 pressure를 따라 가므로 이를 나누어 주어 gas별 분율로 계산후 비교함