Impregnable Brand Protection For Non-Electronic Products ICTK Co., Ltd. 3/5 fl, Vforum Building, 323 Pangyo-ro, Bundang, Gyunggi-do, Korea 13488 TEL : + 82-31-739-7890 FAX : +82-31-739-7891 www.ictk.com puf@ictk.com contact@ictk.com Impregnable Brand Protection For Non-Electronic Products Based on VIA PUF

Counterfeit Industry

Conventional Anti-Counterfeit Technologies Hologram ALL CLONED Smartcard chip Poor Security Nano Ink

What is new Technology? VIA PUF + NFC or RFID Security Function Physical Unclonable Function Connectivity Function To link non-electronic products to electronic world

What’s PUF? Physical Unclonable Function Utilize micro tolerance of semiconductor process Same process & same design, but unique pattern on every chip Unclonable finger print on the chip “Fingerprint on IC”

Conventional Security Vulnerability in conventional security solution Solution based on SW and memory Store KEY & Cipher data <encrypted data> in memory Attackers steal the KEY & Cipher data from NVM Storing KEY safely never perfect Attacking technology advancing Plain data Cipher data KEY Cipher Data Non Volatile Memory Cryptography

Attacking Technology Advancing Shorter hacking time as reverse engineering technology advancing Hacking time getting shorter Steal the KEY from Infineon TPM memory 6months for device analysis, 6hours to steal the KEY 3months for device analysis Reverse engineering technique advanced Black Hat 2010 Black Hat 2015 2020?

PUF Security = ROOT of TRUST New Paradigm of Security Solution based on PUF/HW and memory Store only Cipher data<encrypted data> in memory KEY generated from physical status & goes back to physical status after use Attackers can steal only Cipher data Without KEY, never decrypt Plain data Cipher data KEY Cipher Data Non Volatile Memory Cryptography PUF Cipher data encrypted by PUF KEY is perfectly SAFE

What is VIA PUF? Utilize VIA holes between metal layers Certain hole size gives “open or short” randomly by recipe not by design The combination of this “open and short” generates VIA PUF

VIA PUF Hole Formation Via size A Via size B Via size C Via Hole Size: XM Metal 1 Metal 2 Value 1 Via size A Via size B Via size C

VIA PUF Hole Formation Multi-size holes used Via Hole Size: XM Metal 1 Metal 2 Value 1 Via size A Via size B Via size C Multi-size holes used Combine multi holes to a bit of VIA PUF Ensure high randomness

The 1st volume production in the world Produced multi-millions pieces Advantages of VIA PUF Excellent repeatability Complies JEDEC standard for reliability test High Quality of Randomness Satisfies “ NIST SP800-90B” test suit No Error Correction Circuit required Smaller real estate The 1st volume production in the world Since July, 2016 – Giant IL005 Produced multi-millions pieces

What is new Technology? VIA PUF + NFC or RFID Security Function Physical Unclonable Function Connectivity Function To link non-electronic products to electronic world

Giant 2 Small Semiconductor = VIA PUF + NFC All Keys and Data protected by VIA PUF is safe from any type of attacks Unclonable NFC Memory SHA2 VIA PUF Control Logic ISO 14443-3A ISO7816 part4 ISO-14443-4(type A) 13.56MHz

Giant Security Module Integrate Giant 2 + NFC antenna Size can be as small as button Sticker, PET mould, water proof, etc...

Concept of Operation Each product has VIA security module Display authenticate authenticate Server Smartphone Giant Security Module Display pass or fail result Each product has VIA security module Authenticate through consumer’s smartphone Server centric authentication Collect consumer data

Advantages Perfect brand protection Higher customer satisfaction Collect big data of customers Direct Promotion to customers Better customer relationship management

Thank you. TEL : + 82-31-739-7890 FAX : +82-31-739-7891 www.ictk.com puf@ictk.com contact@ictk.com