Date of download: 10/25/2017 Copyright © ASME. All rights reserved. From: Reliability-Based Design Guidance of Three-Dimensional Integrated Circuits Packaging Using Thermal Compression Bonding and Dummy Cu/Ni/SnAg Microbumps J. Electron. Packag. 2014;136(3):031006-031006-9. doi:10.1115/1.4026854 Figure Legend: Simulation models of 3D ICs packaging using WLUF and microbumps. (a) 2D FEA at the specified cutting line; (b) Cu/Ni/SnAg microbumps; and (c) meshed model of a microbump.

Date of download: 10/25/2017 Copyright © ASME. All rights reserved. From: Reliability-Based Design Guidance of Three-Dimensional Integrated Circuits Packaging Using Thermal Compression Bonding and Dummy Cu/Ni/SnAg Microbumps J. Electron. Packag. 2014;136(3):031006-031006-9. doi:10.1115/1.4026854 Figure Legend: Temperature-dependent stress/strain curve of solder material [7]

Date of download: 10/25/2017 Copyright © ASME. All rights reserved. From: Reliability-Based Design Guidance of Three-Dimensional Integrated Circuits Packaging Using Thermal Compression Bonding and Dummy Cu/Ni/SnAg Microbumps J. Electron. Packag. 2014;136(3):031006-031006-9. doi:10.1115/1.4026854 Figure Legend: Numerical results: (a) distribution of warpage (millimeter) in the packaging after the thermal compression process and (b) distribution of von Mises strain in the microbumps at the corner region of the die

Date of download: 10/25/2017 Copyright © ASME. All rights reserved. From: Reliability-Based Design Guidance of Three-Dimensional Integrated Circuits Packaging Using Thermal Compression Bonding and Dummy Cu/Ni/SnAg Microbumps J. Electron. Packag. 2014;136(3):031006-031006-9. doi:10.1115/1.4026854 Figure Legend: SEM images of microbump assembly: (a) assembly with WLUF and (b) cross section of the SnAg interconnection

Date of download: 10/25/2017 Copyright © ASME. All rights reserved. From: Reliability-Based Design Guidance of Three-Dimensional Integrated Circuits Packaging Using Thermal Compression Bonding and Dummy Cu/Ni/SnAg Microbumps J. Electron. Packag. 2014;136(3):031006-031006-9. doi:10.1115/1.4026854 Figure Legend: Gap distance between the top chip and the substrate at (a) the center and (b) the edge regions of microbump array after a 2.0 kg bonding process

Date of download: 10/25/2017 Copyright © ASME. All rights reserved. From: Reliability-Based Design Guidance of Three-Dimensional Integrated Circuits Packaging Using Thermal Compression Bonding and Dummy Cu/Ni/SnAg Microbumps J. Electron. Packag. 2014;136(3):031006-031006-9. doi:10.1115/1.4026854 Figure Legend: A failure mode of microbump assembly with WLUF after a thermal-compression procedure

Date of download: 10/25/2017 Copyright © ASME. All rights reserved. From: Reliability-Based Design Guidance of Three-Dimensional Integrated Circuits Packaging Using Thermal Compression Bonding and Dummy Cu/Ni/SnAg Microbumps J. Electron. Packag. 2014;136(3):031006-031006-9. doi:10.1115/1.4026854 Figure Legend: Warpage estimations of FEA for the center and edge regions of a packaging structure under a loading of 2.0 kg bonding force

Date of download: 10/25/2017 Copyright © ASME. All rights reserved. From: Reliability-Based Design Guidance of Three-Dimensional Integrated Circuits Packaging Using Thermal Compression Bonding and Dummy Cu/Ni/SnAg Microbumps J. Electron. Packag. 2014;136(3):031006-031006-9. doi:10.1115/1.4026854 Figure Legend: Layout designs of the dummy microbumps at the distances of (a) 30, (b) 60, and (c) 90 μm from the critical microbumps

Date of download: 10/25/2017 Copyright © ASME. All rights reserved. From: Reliability-Based Design Guidance of Three-Dimensional Integrated Circuits Packaging Using Thermal Compression Bonding and Dummy Cu/Ni/SnAg Microbumps J. Electron. Packag. 2014;136(3):031006-031006-9. doi:10.1115/1.4026854 Figure Legend: 3D contours of response surfaces of (a) warpage and (b) strain with respect to the design variables

Date of download: 10/25/2017 Copyright © ASME. All rights reserved. From: Reliability-Based Design Guidance of Three-Dimensional Integrated Circuits Packaging Using Thermal Compression Bonding and Dummy Cu/Ni/SnAg Microbumps J. Electron. Packag. 2014;136(3):031006-031006-9. doi:10.1115/1.4026854 Figure Legend: Deterministic design guidance in various levels of allowable (a) warpage and (b) strain (D = 0)

Date of download: 10/25/2017 Copyright © ASME. All rights reserved. From: Reliability-Based Design Guidance of Three-Dimensional Integrated Circuits Packaging Using Thermal Compression Bonding and Dummy Cu/Ni/SnAg Microbumps J. Electron. Packag. 2014;136(3):031006-031006-9. doi:10.1115/1.4026854 Figure Legend: Probabilistic design guidance in various levels of allowable (a) warpage and (b) strain (D = 0)