Impact of TIDVG problem on LSS5 dump design schedule

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Presentation transcript:

Impact of TIDVG problem on LSS5 dump design schedule Marco Calviani, Etienne Carlier, Antonio Perillo Marcone LIU-SPS Coordination Meeting 08-06-2016

Strategy Use the design of TIDVG#4 (new LSS1 dump) as test bench for TIDVG#5 (new LSS5 dump) Common developments for both dumps TIDVG#4 will be installed in the machine in LSS1 during EYETS16-17 Profit of the outcome of TIDVG#5 preliminary design review held in 04/2016 for the design of TIDVG#4 Reduction of number of cooling feedthroughs Remove lengthy longitudinal welding of the dump copper core

TIDVG#4 new features that will profit to TIDVG#5 No more longitudinal welding. Dump block and copper core will be housed in a single extruded tube. Tube will act as vacuum chamber Tube feasibility confirmed Tube length is not a limiting factor Better separation between vacuum and cooling functions Improvement of cooling circuit Use of diffusion bounding technique (copper / inox) for improved heat exchange between cooling plate and cooling circuit Reduction of the number of cooling feedthroughs for cooling plates Cooling circuits will enter/exit the dump from the upstream or downstream ends

Impact on TIDVG#5 Development of a TIDVG#5 prototype on hold TIDVG#4 will be fully instrumented to measure cooling efficiency in order to serve as real prototype for the design of TIDVG#5 Cooling efficiency will be tested with beam Development of Thermal Conductivity and Cooling (TCC) test bench ongoing Study of thermal exchange efficiency between graphite / copper Will be useful for both dumps Lessons learned from TIDVG#4 problem to be retrofitted to TIDVG#5 project Diagnostic in case of dump failure Impact of external shielding on dump failure diagnostic to be evaluated

Summary Design of TIDVG#4 is progressing full speed with a positive impact on TIDVG#5 A lot of synergies present between design of TIDVG#4 and TIDVG#5 New concepts (mechanical assembly and cooling circuit) will be tested with beam. This will be invaluable for the final design of TIDVG#5 No visible impact of the TIDVG#5 planning for the time being. Strong feeling that, at the end, TIDVG#5 will profit of the TIDVG#3 problem Delivery of the full dump in 2019 for mock-up installation in BB5 is still the project baseline.