KemiPalTM PAD-6 Technical Data Sheet
Contents Effect of plating time Effect of bath temperature Effect of pH Effect of Pd concentration Effect of PAD-6-M concentration Effect of PAD-6-R concentration Effect of Ni contamination Effect of Cu contamination Effect of Fe contamination
2. Effect of bath temperature 1. Effect of plating time Conditions Pd : 0.6 g/L pH : 7.2 Bath temp. : 51℃ PAD-6-M : 100 ml/L PAD-6-S1 : 250 ml/L PAD-6-R : 5 ml/L variable : Plating time 2. Effect of bath temperature Conditions Pd : 0.6 g/L pH : 7.2 Plating time : 10 min PAD-6-M : 100 ml/L PAD-6-S1 : 250 ml/L PAD-6-R : 5 ml/L variable : Bath temp.
4. Effect of Pd concentration 3. Effect of pH Conditions Pd : 0.6 g/L Bath temp. : 51℃ Plating time : 10 min PAD-M : 100 ml/L PAD-S1 : 250 ml/L PAD-R : 5 ml/L variable : pH 4. Effect of Pd concentration Conditions pH : 7.2 Bath temp. : 51℃ Plating time : 10 min PAD-6-M : 100 ml/L PAD-6-S1 : 250 ml/L PAD-6-R : 5 ml/L variable : Pd conc.
5. Effect of PAD-6-M concentration Conditions Pd : 0.6 g/L pH : 7.2 Bath temp. : 51℃ Plating time : 10 min PAD-6-S1 : 250 ml/L PAD-6-R : 5 ml/L variable : PAD-6-M conc. 6. Effect of PAD-6-R concentration Conditions Pd : 0.6 g/L pH : 7.2 Bath temp. : 51℃ Plating Time : 10 min PAD-6-M : 100 ml/L PAD-6-S1 : 250 ml/L variable : PAD-6-R conc.
7. Effect of Ni contamination Conditions Pd : 0.6 g/L pH : 7.2 Bath temp. : 51℃ Plating time : 10 min PAD-6-M : 100 ml/L PAD-6-S1 : 250 ml/L PAD-6-R : 5 ml/L variable : Ni conc. 8. Effect of Cu contamination Conditions Pd : 0.6 g/L pH : 7.2 Bath temp : 51℃ Plating Time : 10 min PAD-6-M : 100 ml/L PAD-6-S1 : 250 ml/L PAD-6-R : 5 ml/L variable : Cu conc.
9. Effect of Fe contamination Conditions Pd : 0.6 g/L pH : 7.2 Bath temp. : 51℃ Plating time : 10 min PAD-6-M : 100 ml/L PAD-6-S1 : 250 ml/L PAD-6-R : 5 ml/L variable : Fe conc.