Wicking: Requirements

Slides:

Advertisements

Similar presentations

AP Physics March 5.

Advertisements

1) Importing an IDF file with CircuitWorks

IPC Laminate Materials

Delphi Confidential Precision Bump Formation Mushroom type bump X-Sec laser ablate plated up bump Fabrication process.

IPC COMPONENT PLACEMENT

Waveguides Rectangular Waveguides TEM, TE and TM waves

IPC-2221 Annular Ring Requirements

SURFACE AREA and VOLUME of RECTANGULAR PRISMS and CUBES.

Definitions Dielectric—an insulating material placed between plates of a capacitor to increase capacitance. Dielectric constant—a dimensionless factor.

Electric Potential Electric forces are conservative. Work done by an electric force is W=-q o Ed  U=-W.

When a potential difference of 150 V is applied to the plates of a parallel-plate capacitor, the plates carry a surface charge density of 30.0 nC/cm2.

Topic 8: Welding terms and symbols

Capacitors in series: Capacitors in parallel: Capacitors Consider two large metal plates which are parallel to each other and separated by a distance.

P247. Figure 9-1 p248 Figure 9-2 p251 p251 Figure 9-3 p253.

f has a saddle point at (1,1) 2.f has a local minimum at.

ENGR. VIKRAM KUMAR B.E (ELECTRONICS) M.E (ELECTRONICS SYSTEM ENGG:) MUET JAMSHORO 1 CAPACITOR.

Capacitance & Dielectrics

Section 1 Mrs. Trotter Vian Middle School. Elastic Limit.

Adhesive bonding.

Fits & Tolerances.

1 f ’’(x) > 0 for all x in I f(x) concave Up Concavity Test Sec 4.3: Concavity and the Second Derivative Test the curve lies above the tangentsthe curve.

1-2 Points, Lines and Planes M11.B B

IPC Datum Features Datum features indicate the origin of a dimensional relationship between a toleranced feature and a designated feature or.

IPC Bare Board Testing Bare board testing is performed by the printed board supplier and includes continuity, insulation resistance and dielectric.

IPC Assembly and Test Palletization of parts is a standard process in many instances for both test and assembly. This can be achieved using.

IPC RADIAL- COMPONENTS Angularity is required for clearance in the next higher assembly; or That edge of the body nearest the surface of the.

IPC Bus Bar Bus bars are usually in the form of preformed components that are part of the printed board assembly and serve the function of.

IPC Conductor Width and Thickness The width and thickness of conductors on the finished printed board shall be determined on the basis of the.

Chapter 25 Capacitance.

Two parallel plate capacitors of different capacitance will have the same charge on their plates if they are connected in _______. A.series B.parallel.

IPC Gold Plating A variety of gold platings are available for depositions on printed boards. These may be electrolytic, electroless, or immersion.

IPC In-Circuit Test Fixtures In-circuit test fixtures are commonly called bed-of-nails fixtures. A bed-of- nails fixture is a device with.

IPC-2222 Thermal Relief in Conductor Planes

IPC Mounting Over Conductive Areas Metal-cased components shall be mounted insulated from adjacent electrically conductive elements. Insulation.

Acceptance Sampling Terminology

Warm UP Xy graph quadratics Objective: To graph quadratic functions. Where do you find these functions?

Halliday/Resnick/Walker Fundamentals of Physics

Electric Field Lines Contents: Basic Concept Field Lines and point charges Field Lines and conductors.

IPC Conductive Material Requirements The minimum width and thickness of conductors on the finished board shall be determined primarily on the.

Recommendations on Supports and Adjustment systems for ESS LINAC Components Fabien Rey Pawel Garsztka ESS Survey, Alignment and Metrology Group.

Capacitance Chapter 25. Capacitance A capacitor consists of two isolated conductors (the plates) with charges +q and -q. Its capacitance C is defined.

4.4 Size of a Horizontal Boring Machine:  Conventionally, the size of a horizontal boring machine is specified by the spindle diameter in mm.  The spindle.

Dr Badorul Hisham Abu Bakar

IPC Annular Ring Requirements An annular ring shall be required for all plated-through holes in Class 3 designs. The performance specifications.

Kursus “electronic assemblies & SOLDERING Technique”

Chapter 7 Visual Aids for Denoting Restricted Use Areas

ELECTRONIC ASSEMBLIES AND SOLDERING TECHNIQUE –PART II

IPC-A-610E SOLDERING.

Consider two conductors carrying charges of equal magnitude but of opposite sign, Such a combination of two conductors is called a capacitor. The.

Topic 9.3 Electric Field, Potential, and Energy

نتعارف لنتألف في التعارف تألف (( الأرواح جنود مجندة , ماتعارف منها أئتلف , وماتنافر منها اختلف )) نماذج من العبارات الايجابية.

Subpart M Fall Protection.

مراجعة عامة.

Introduction to Capacitance

Electric Potential and Electrical Field

بسم الله الرحمن الرحيم الموضوع:الوضوء صفته وفرائضه وسننه

Introduction to IEC/TR A status update and insides

Lecture 20 Today Conductors Resistance Dielectrics

Displacement Current This term must represent a current

Instructor: Radian Belu, PhD

General Capability Parameters Feature Y2017 Y2018 Y2019 Standard

X y y = x2 - 3x Solutions of y = x2 - 3x y x –1 5 –2 –3 6 y = x2-3x.

Fits & Tolerances.

Consider two conductors carrying charges of equal magnitude but of opposite sign, Such a combination of two conductors is called a capacitor. The capacitance.

Structural Fasteners Chap. (4) Non-Structural (A-307) Bolts A325

DFMEA, Thermal Derating CAF, VIA Fatigue

North Carolina Department of Insurance Office of State Fire Marshal

How to design the size of heatsink

Presentation transcript:

3.3.13 Wicking: Requirements IPC-600H, 3.3.13 Acceptable Class 3 Wicking does not exceed 80 μm [3,150 μin] Acceptable Class 2 Wicking does not exceed 100 μm [3,937 μin] Acceptable Class 1 Wicking does not exceed 125 μm [4,921 μin] IPC-6012C, paragraph 3.6.2 IPC-6013B, paragraph 3.6.2.9

Note: Wicking is measured from the laminate edge excluding the plating No wicking present (Target) 80 μm [0.003150 in] maximum allowed (Class 3) Figure 3313a Target Condition Figure 3313b Acceptable Class 3 Note: Wicking is measured from the laminate edge excluding the plating

Note: Wicking is measured from the laminate edge excluding the plating 100 μm [0.003937 in] maximum allowed (Class 2) 125 μm [0.004291 in] maximum allowed (Class 1) Figure 3313b Acceptable Classes 1 & 2 Note: Wicking is measured from the laminate edge excluding the plating

Nonconforming all Classes 3.3.13 Wicking Defects either do not meet or exceed above criteria Wicking measures 162.56 µm [0.0064 in] Figure 3313c Nonconforming all Classes

3.3.13.1 Wicking/Clearance Holes: Requirements IPC-600H, 3.3.13.1 Acceptable All Classes Wicking does not reduce conductor spacing less than specified minimum Acceptable Class 3 Wicking does not exceed 80 μm [3,150 μin] Acceptable Class 2 Wicking does not exceed 100 μm [3,937 μin] Acceptable Class 1 Wicking does not exceed 125 μm [4,921 μin] IPC-6012C, paragraph 3.6.2 IPC-6013B, paragraph 3.6.2.9

3.3.13.1 Wicking/Clearance Holes No wicking of conductive material into base material or along the reinforcement material A: Surface Pad B: Dielectric Material C: Adjacent Noncommon Conductors D: Surface Plating Figure 33131a Target Condition

3.3.13.1 Wicking/Clearance Holes Acceptable for Class 3 (A) < 80 μm [3150 μin] (B) does not reduce conductor spacing below minimum requirements Acceptable for Class 2 (A) < 100 μm [3937μin] Acceptable for Class 1 (A) < 125 μm [4921μin] Figure 33131b Acceptable all Classes

3.3.13.1 Wicking/Clearance Holes Nonconforming all Classes (A) exceeds 125 μm [0.004921 in] (B) reduces conductor spacing below minimum specified requirements Figure 33131c Nonconforming all Classes