Chapter 1 - Introduction

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Presentation transcript:

Chapter 1 - Introduction What is materials science? Why should we know about it? Materials drive our society Stone Age Bronze Age Iron Age Now? Silicon Age? Polymer Age?

Example – Hip Implant With age or certain illnesses joints deteriorate. Particularly those with large loads (such as hip). Adapted from Fig. 22.25, Callister 7e.

Example – Hip Implant Requirements mechanical strength (many cycles) good lubricity biocompatibility Adapted from Fig. 22.24, Callister 7e.

Example – Hip Implant Adapted from Fig. 22.26, Callister 7e.

Hip Implant Key problems to overcome fixation agent to hold acetabular cup cup lubrication material femoral stem – fixing agent must avoid any debris in cup Ball Acetabular Cup and Liner Femoral Stem Adapted from chapter-opening photograph, Chapter 22, Callister 7e. (Photograph courtesy of Zimmer, Inc., Warsaw, IN, USA.)

Example – Develop New Types of Polymers Commodity plastics – large volume ca. $0.50 / lb Ex. Polyethylene Polypropylene Polystyrene etc.  Engineering Resins – small volume > $1.00 / lb Ex. Polycarbonate Nylon Polysulfone etc.   Can polypropylene be “upgraded” to properties (and price) near those of engineering resins?

Structure, Processing, & Properties • Properties depend on structure ex: hardness vs structure of steel (d) 30 μm 6 00 5 00 (c) 4 μm Data obtained from Figs. 10.31(a) and 10.32 with 4 wt% C composition, and from Fig. 11.15, Callister & Rethwisch 9e. Micrographs adapted from (a) Fig. 10.19; (b) Fig. 9.30; (c) Fig. 10.33; and (d) Fig. 10.21, Callister & Rethwisch 9e. (Figures 10.19, 10.21, & 10.33 copyright 1971 by United States Steel Corporation. Figure 9.30 courtesy of Republic Steel Corporation.) 4 00 (b) 30 μm (a) 30 μm Hardness (BHN) 3 00 2 00 100 0.01 0.1 1 10 100 1000 Cooling Rate (ºC/s) • Processing can change structure ex: structure vs cooling rate of steel

Types of Materials Metals: Strong, ductile High thermal & electrical conductivity Opaque, reflective. Polymers/plastics: Covalent bonding  sharing of electrons Soft, ductile, low strength, low density Thermal & electrical insulators Optically translucent or transparent. Ceramics: ionic bonding (refractory) – compounds of metallic & non-metallic elements (oxides, carbides, nitrides, sulfides) Brittle, glassy, elastic Non-conducting (insulators) Metals have high thermal & electrical conductivity because valence electrons are free to roam

The Materials Selection Process 1. Pick Application Determine required Properties Properties: mechanical, electrical, thermal, magnetic, optical, deteriorative. 2. Properties Identify candidate Material(s) Material: structure, composition. 3. Material Identify required Processing Processing: changes structure and overall shape ex: casting, sintering, vapor deposition, doping forming, joining, annealing.

ELECTRICAL • Electrical Resistivity of Copper: Resistivity, ρ T (°C) -200 -100 Cu + 3.32 at%Ni Cu + 2.16 at%Ni deformed Cu + 1.12 at%Ni 1 2 3 4 5 6 Resistivity, ρ (10-8 Ohm-m) Cu + 1.12 at%Ni “Pure” Cu Fig. 18.8, Callister & Rethwisch 9e. [Adapted from: J.O. Linde, Ann Physik 5, 219 (1932); and C.A. Wert and R.M. Thomson, Physics of Solids, 2nd edition, McGraw-Hill Company, New York, 1970.] • Adding “impurity” atoms to Cu increases resistivity. • Deforming Cu increases resistivity.

THERMAL • Space Shuttle Tiles: • Thermal Conductivity of Copper: -- Silica fiber insulation offers low heat conduction. • Thermal Conductivity of Copper: -- It decreases when you add zinc! Chapter-opening photograph, Chapter 17, Callister & Rethwisch 3e. (Courtesy of Lockheed Missiles and Space Company, Inc.) Composition (wt% Zinc) Thermal Conductivity (W/m-K) 400 300 200 100 10 20 30 40 100 μm Fig. 19.4W, Callister 6e. (Courtesy of Lockheed Aerospace Ceramics Systems, Sunnyvale, CA) (Note: "W" denotes fig. is on CD-ROM.) Fig. 19.4, Callister & Rethwisch 9e. [Adapted from Metals Handbook: Properties and Selection: Nonferrous alloys and Pure Metals, Vol. 2, 9th ed., H. Baker, (Managing Editor), ASM International, 1979, p. 315.]

MAGNETIC • Magnetic Permeability • Magnetic Storage: vs. Composition: -- Recording medium is magnetized by recording head. • Magnetic Permeability vs. Composition: -- Adding 3 atomic % Si makes Fe a better recording medium! Magnetic Field Magnetization Fe+3%Si Fe Adapted from C.R. Barrett, W.D. Nix, and A.S. Tetelman, The Principles of Engineering Materials, Fig. 1-7(a), p. 9, 1973. Electronically reproduced by permission of Pearson Education, Inc., Upper Saddle River, New Jersey. Fig. 20.23, Callister & Rethwisch 9e. (Courtesy of HGST, a Western Digital Company.)

OPTICAL • Transmittance: -- Aluminum oxide may be transparent, translucent, or opaque depending on the material’s structure (i.e., single crystal vs. polycrystal, and degree of porosity). single crystal polycrystal: no porosity some porosity Fig. 1.2, Callister & Rethwisch 9e. (Specimen preparation, P.A. Lessing)

DETERIORATIVE • Stress & Saltwater... • Heat treatment: slows -- causes cracks! • Heat treatment: slows crack speed in salt water! “held at 160°C for 1 hr before testing” increasing load crack speed (m/s) “as-is” 10-10 10-8 Alloy 7178 tested in saturated aqueous NaCl solution at 23°C Fig. 17.21, Callister & Rethwisch 9e. (from Marine Corrosion, Causes, and Prevention, John Wiley and Sons, Inc., 1975.) Adapted from Fig. 11.20(b), R.W. Hertzberg, "Deformation and Fracture Mechanics of Engineering Materials" (4th ed.), p. 505, John Wiley and Sons, 1996. (Original source: Markus O. Speidel, Brown Boveri Co.)

SUMMARY Course Goals: • Use the right material for the job. • Understand the relation between properties, structure, and processing. • Recognize new design opportunities offered by materials selection.