cooling and supports of the forward endcap EMC Henk Smit, Michel Lindemulder, Rick Veenstra (mech. engineering), Annelie Kluttig (research engineer), Myroslav Kavatsyuk, Herbert Löhner, KVI Groningen new light frame integration of electronics integration of supports 5.9.11 H. Löhner - PANDA-FwEndcapEMC
Fw Endcap frame refinements DiscDIRC adaptations 200 kg Al frame 5.9.11 H. Löhner - PANDA-FwEndcapEMC
FwEndcap EMC + DiscDIRC required distances observed; adaptation for DiscDIRC foreseen 5.9.11 H. Löhner - PANDA-FwEndcapEMC
H. Löhner - PANDA-FwEndcapEMC light frame space gained for accessible electronics frames easy fabrication: small screwed parts 5.9.11 H. Löhner - PANDA-FwEndcapEMC
H. Löhner - PANDA-FwEndcapEMC side cooling cooled side-parts: close to crystals, max. space for DIRC, easy fabrication 5.9.11 H. Löhner - PANDA-FwEndcapEMC
H. Löhner - PANDA-FwEndcapEMC cooling pipes and taps insulation 30 mm thick lower part: mirror symmetric inner 46 mm 5.9.11 H. Löhner - PANDA-FwEndcapEMC
H. Löhner - PANDA-FwEndcapEMC 5.9.11 H. Löhner - PANDA-FwEndcapEMC
H. Löhner - PANDA-FwEndcapEMC 5.9.11 H. Löhner - PANDA-FwEndcapEMC
H. Löhner - PANDA-FwEndcapEMC SADC module under construction by Pawel Marciniewski 5.9.11 H. Löhner - PANDA-FwEndcapEMC
H. Löhner - PANDA-FwEndcapEMC digitizer boards 165x100 mm2 single set of 44 optical link 5.9.11 H. Löhner - PANDA-FwEndcapEMC
H. Löhner - PANDA-FwEndcapEMC digitizer boards 165x100 mm2 double set of 44 5.9.11 H. Löhner - PANDA-FwEndcapEMC
H. Löhner - PANDA-FwEndcapEMC Summary new light FW Endcap frame design with accessible space for digitizer electronics many components designed in detail cooling simulations for a full ¼ model max. crystal temp. gradient 1.9 oC surface shield temperature 22 oC at 35 oC environment 5.9.11 H. Löhner - PANDA-FwEndcapEMC
time schedule Forw. Endcap EMC Mechanics 1. inside cold area: - inserts + mounting plates for APD-readout <12.2011 2. isolation: - test of vacuum panels, isolation, feed-throughs with Proto192 < 3.2011 outside cold area: - define & design space for SADC electronics, power supplies < 3.2011 - design cable routing and connectors < 6.2011 - concept of installation frame and insertion operation < 8.2011 - design options for including TOF layer <12.2011 - construct support for * shaper, SADCs, cooling distribution, HV, LV cables, ... 2012 * mechanical support frame 2013 Cooling 4. test of cooling and isolation: proto192 < 3.2011 5. concept of cooling with liquid + air flow < 3.2011 6. planning / design heat exchanger, cooling circuit, regulation? 2012 7. planning for cooling plant 2012 5.9.11 H. Löhner - PANDA-FwEndcapEMC