KIT – Universität des Landes Baden-Württemberg und nationales Forschungszentrum in der Helmholtz-Gemeinschaft Institute for Data Processing and Electronics (IPE) Balloon-Experiment JEM-EUSO EC-Design Review EC-HV Board

KIT-IPE The EC-HV Board First Design: Single-Layer PCB, 1,5mm FR4 A. Ebersoldt

KIT-IPE The EC-HV Board Second Design: Single-Layer PCB, 1,5mm FR4 A. Ebersoldt

KIT-IPE IPE - Experience A. Ebersoldt Potting Use of 2 component silicon materials. Mass IPE: Project Quench Detection (W7X, TOSKA, KATRIN, HZ-Berlin) Company-Connection: Coating & Potting: Balloon-Experiments Atmospheric measurements with MIPAS, KIT - many flights with MIPAS flown by CNES also in Kiruna (same as maiden flight for EUSO-Balloon) - Flight altitude up to 40km and 18 hours IPE developed electronics: instrument control, communication, power- management, thermal design, for balloons and aircrafts

KIT-IPE IPE Test Facilities Climate chamber: Vibrating table: A. Ebersoldt IPE assembly center for PCB and many more: -Pick-and-Place machine -Flying-Prober -Camera inspection systems -Wire bonder -Clean room -Dry cabinets -Laser-Labeler -… -Laboratories: -Electronics -Mechanics -Optics -Hybrid-Technology