Mechatronics Assignment#1 Topic: MEMS ACTUATORS Prepared by: Sandeep Sharma Dept of Electrical and Computer Engineering Utah State University.

Slides:



Advertisements
Similar presentations
MICROELECTROMECHANICAL SYSTEMS ( MEMS )
Advertisements

Applications of PICs Advantages/disadvantages Digital and analogue control Loops, sub-routines, scanning, counting and feedback Interrupts Problems with.
Unbounding the Future: the Nanotechnology Revolution by Eric Drexler Chris Peterson Gayle Pergamit Presented by Kalyani Komarasetti.
Thermal Actuators.
MICROFLEX S Beeby, J Tudor, University of Southampton Introduction to MEMS What is MEMS? What do MEMS devices look like? What can they do? How do we make.
Assignment#01: Literature Survey on Sensors and Actuators ECE5320 Mechatronics Assignment#01: Literature Survey on Sensors and Actuators Topic: Comb Drive.
An Introduction to Electrostatic Actuator
© Copyright 2002 ABB. All rights reserved. - Microelectromechanical Systems for Process Analytics IFPAC 2003 Dr. Berthold Andres ABB Automation Products.
Introduction to digital signal processing T he development is a result of advances in digital computer technology and integrated circuit fabrication. Computers.
MEMS and its Applications Optical Routing, an example Shashi Mysore Computer Science UCSB.
Tutorials on Systems Miniaturization Luiz Otávio S. Ferreira - LNLS November 28, 2001.
Silicon Programming--Introduction to MEMS 1 Introduction to MEMS; energy domains; mechanical and fluidic devices.
Microelectronics & Device Fabrication. Vacuum Tube Devices Thermionic valve Two (di) Electrodes (ode)
The Degree Paths in Microsystems & Nanotechnology Hal Evensen Program Coordinator, MSNT Spring,
SEMICONDUCTOR DEVICE FABRICATION AN OVERVIEW Presented to EE 2212 Text Section 2.11 Supplement 24 September 2014.
Name – June 11, 2010 – 1 UTober_ExCo Call Preparation on PPP – September 1, 2012 Photonics21 research priorities for the ICT work programme 2013 Work Group.
MEMs Fabrication Alek Mintz 22 April 2015 Abstract
MEMS Fabrication and Applications Brought to you by: Jack Link & Aaron Schiller Date delivered on: Friday the third of May, 2013 ABSTRACT: Taking a brief.
NANO-ELECTRO-MECHANICAL SYSTEM(NEMS)
Nano electro mechanical systems (nems)
TOPICS IN (NANO) BIOTECHNOLOGY Microfabrication techniques I PhD Course.
1 Chapter Two Electrical & Computer Engineering Specialization.
CHEMICAL SENSING USING MEMS. courtsey Micro Electro Mechanical Systems Micro-Electro-Mechanical Systems (MEMS) is the integration of mechanical.
SEMINAR ON MICRO-ELECTRO-MECHANICAL SYSTEMS (MEMS) A.RADHAKRISHNAN MECHANICAL ENGINEERING, CPT COLLEGE THIRUVANANTHAPURAM PART-1.
Microsystems and sensor networks Lecturer - prof. Tadeusz Pisarkiewicz building C-1, room No homepage:
Micro and Nanosystems IST Programme Call Micro/nano based subsystems Francisco J. Ibáñez European Commission
EE Faculty. EE Technical Areas Micro Devices & Physical Principals Integrated Circuits & Systems Signals & Information Processing Networking & Communications.
1 New Materials, Surfaces and Sensing Applications Novel Functional Materials Intelligent Materials Surface Functionalisation Nanomaterials and Nanocoatings.
Micro-Electro-Mechanical Systems (MEMS) Submitted to: Mr.Deepak Basandari Made By: Rupesh Kumar Rupesh Kumar B.Tech Mechanical B.Tech Mechanical.
Integrated Projects & Networks of Excellence Examples in IST.
What is Mechatronics? Mechatronics is the synergistic combination of mechanical engineering, electronics, controls engineering, and computers, all integrated.
MECHATRONICS Lecture 02 Slovak University of Technology Faculty of Material Science and Technology in Trnava.
School of Biomedical Engineering, Science & Health Systems V 1.0 SD [020214] The sensor market is one of the fastest.
Self-assembly Nanostructure and Lithography
What is MEMS Technology?. What is MEMS ? What is MEMS ? Micro Electro Mechanical Systems – micro scale dimensions (1mm = 1000 microns) – electrical and.
IC Fabrication Overview Procedure of Silicon Wafer Production
SEMICONDUCTOR DEVICE FABRICATION AN OVERVIEW Presented to EE October 2012 by Stan Burns MWAH 153.
SEMICONDUCTOR DEVICE FABRICATION AN OVERVIEW Presented to EE September 2015 by Stan Burns MWAH 153.
Moore’s Law and Its Future Mark Clements. 15/02/2007EADS 2 This Week – Moore’s Law History of Transistors and circuits The Integrated circuit manufacturing.
Tyndall National Institute Confidential Document | Dated : April : 2012 Tyndall National Institute Confidential Document | Dated : April :
Micro Electro Mechanical Systems (MEMS) Device Fabrication
1 Device Fabrication And Diffusion Overview 5 and 8 February 2016 Silicon Wafer Production-Refer to Chapter “0” Prologue Raw material ― Polysilicon nuggets.
SENSITIVE SKIN. OUTLINE INTRODUCTION SKIN MATERIALS DEVICES SIGNAL PROCESSING ADVANTAGES DISADVANTAGES APPLICATION CONCLUSION.
M EMS FBRICATION METHODS MADE BY: Amit. K. Parcha Roll No:2K13E21 Department of Electronic Science Uinversity Of Pune.
WP1 WP2 WP3 WP4 WP5 COORDINATOR WORK PACKAGE LDR RESEARCHER ACEOLE MID TERM REVIEW CERN 3 RD AUGUST 2010 Work Package 1: Pixel detector systems for particle.
Embedded Systems. What is Embedded Systems?  Embedded reflects the facts that they are an integral.
A microelectronic computer circuit incorporated into a chip or semiconductor In electronics, an as IC is a miniaturized electronic circuit. An electronic.
Industrial Automation and Robotics Mr. Muhajir Ab. Rahim School of Mechatronic Engineering UniMAP.
14ME404 INTRODUCTION TO MEMS DISCIPLINE ELECTIVE-II Thanking everyone for MEMS as an elective subject Dr.J.S.Senthilkumaar, Professor Mechanical Engineering.
14ME404 INTRODUCTION TO MEMS DISCIPLINE ELECTIVE-II Thanking everyone for MEMS as an elective subject Dr.J.S.Senthilkumaar, Professor Mechanical Engineering.
EE Faculty.
SEMICONDUCTOR DEVICE FABRICATION
• Very pure silicon and germanium were manufactured
EE5900 Cyber-Physical Systems
Sensor technology Lecturer - prof. Tadeusz Pisarkiewicz
Integrated Circuits.
Mechanical & Manufacturing Engineering Program
MEMs Applications other than Sensors
An Overview on the Artificial Eye (Using MEMS Technology)
MEMS TECHNOLOGY Anand John Abraham. S3, EC. 1.
Computer Integrated Manufacturing ( CIM). Chapter One 1.1 Introduction 1.2 Types of Manufacturing 1.3 CIM Hardware and CIM Software 1.4 Nature and Role.
MEMS TECHNOLOGY.
MEMS: Basic structures & Current Applications
MicroElectroMechanical Systems
Device Fabrication And Diffusion Overview
Internet of Things (IoT) for Industrial Development and Automation
IC Fabrication Overview Procedure of Silicon Wafer Production
• Very pure silicon and germanium were manufactured
Device Fabrication And Diffusion Overview
HIGHER TECHNOLOGICAL INSTITUTE (HTI) Principles of Mechatronics Engineering (MTE 101) PHY MTH 002 Prerequisites: PHY MTH 002 Lecture 1.
Presentation transcript:

Mechatronics Assignment#1 Topic: MEMS ACTUATORS Prepared by: Sandeep Sharma Dept of Electrical and Computer Engineering Utah State University

OUTLINE WHAT IS MEMS? MEMS ACTUATORS APPLICATIONS CHALLENGES

REFERENCES www.memsnet.org The Investigation of MEMS-Fabricated Actuators for Use in Optical and Mechanical Applications, 14-9158 Applications of MEMS Actuators in Optical and Ultrasound Imaging www.memx.com

WHAT IS MEMS? Micro-Electro-Mechanical Systems (MEMS) is the integration of mechanical elements, sensors, actuators, and electronics on a common silicon substrate through microfabrication technology. While the electronics are fabricated using integrated circuit (IC) process sequences (e.g., CMOS, Bipolar, or BICMOS processes), the micromechanical components are fabricated using compatible "micromachining" processes that selectively etch away parts of the silicon wafer or add new structural layers to form the mechanical and electromechanical devices .

WHAT IS MEMS? MEMS promises to revolutionize nearly every product category by bringing together silicon-based microelectronics with micromachining technology, making possible the realization of complete systems-on-a-chip. MEMS is an enabling technology allowing the development of smart products, augmenting the computational ability of microelectronics with the perception and control capabilities of microsensors and microactuators and expanding the space of possible designs and applications

WHAT IS MEMS? MEMS is an emerging technology which uses the tools and techniques that were developed for the Integrated Circuit industry to build microscopic machines. These machines are built on standard silicon wafers.  The real power of this technology is that many machines can be built at the same time across the surface of the wafer, with no assembly required. Since it is a photographic-like process, it is just as easy to build a million machines on the wafer as it would be to build just one.

WHAT IS MEMS Microelectronic integrated circuits can be thought of as the "brains" of a system and MEMS augments this decision-making capability with "eyes" and "arms", to allow microsystems to sense and control the environment. Sensors gather information from the environment through measuring mechanical, thermal, biological, chemical, optical, and magnetic phenomena. The electronics then process the information derived from the sensors and through some decision making capability direct the actuators to respond by moving, positioning, regulating, pumping, and filtering, thereby controlling the environment for some desired outcome or purpose. Because MEMS devices are manufactured using batch fabrication techniques similar to those used for integrated circuits, unprecedented levels of functionality, reliability, and sophistication can be placed on a small silicon chip at a relatively low cost.

MEMS ACTUATORS The greatest promise of microelectromechanical systems (MEMS) lies in their ability to produce mechanical motion on a very small scale. Such devices are typically low power and fast, taking advantage of such microscale phenomenon as strong electrostatic forces and rapid thermal responses. Although MEMS-based sensors have been widely deployed, few MEMS-based actuators have achieved more than laboratory-level development due to their technical challenges. The market for such devices is growing rapidly, especially for optical and electronic applications.

MEMS ACTUATORS The explosive growth of data traffic, such as the Internet, has produced a pressing need for large-capacity optical networks. Optical switches are now in high demand in the telecommunications industry for their ability to reconfigure an optical network for traffic management or circuit protection without having to resort to low-bandwidth, protocol-dependant, opto-electronic conversions. To be widely deployed, such switches must be small, low-cost, batch-fabricated, and have a high port count. A MEMS-based optical switch is well suited to addressing these requirements.

MEMS ACTUATORS The traditional method of creating a timed electronic switch requires a timer circuit or discrete mechanical components. Such devices tend to be large or unable to handle high currents. There are a number of applications where a small, timed relay would be desirable, such as military and computer industries. For instance, the device could be incorporated into a computer, so that after a series of incorrect password entries, the computer locks out all communications and cannot be overcome without physical access. Again, MEMS actuators can provide such a solution.

Applications Data Storage

ULTRASOUND IMAGING

OPTICAL IMAGING

                                                                                                                        ELECTRIC RELAY SWITCH

PATCH ANTENNA

CHALLENGES Limited Options Most companies who wish to explore the potential of MEMS and Nanotechnology have very limited options for prototyping or manufacturing devices, and have no capability or expertise in microfabrication technology. Few companies will build their own fabrication facilities because of the high cost. A mechanism giving smaller organizations responsive and affordable access to MEMS and Nano fabrication is essential.

Packaging The packaging of MEMS devices and systems needs to improve considerably from its current primitive state. MEMS packaging is more challenging than IC packaging due to the diversity of MEMS devices and the requirement that many of these devices be in contact with their environment. Currently almost all MEMS and Nano development efforts must develop a new and specialized package for each new device.

Most companies find that packaging is the single most expensive and time consuming task in their overall product development program. As for the components themselves, numerical modeling and simulation tools for MEMS packaging are virtually non-existent. Approaches which allow designers to select from a catalog of existing standardized packages for a new MEMS device without compromising performance would be beneficial

Fabrication Knowledge Required Currently the designer of a MEMS device requires a high level of fabrication knowledge in order to create a successful design. Often the development of even the most mundane MEMS device requires a dedicated research effort to find a suitable process sequence for fabricating it. MEMS device design needs to be separated from the complexities of the process sequence.