Carbon wire sensor based in semiconductor strain gauges

Slides:



Advertisements
Similar presentations
EE 4BD4 Lecture 15 Strain ( force) Gauges, pressure sensors and Load Cells 1.
Advertisements

Wafer Level Packaging: A Foundry Perspective
Ragan Technologies, Inc. Presents - Zero Shrink Technology - ZST™ Process for Embedding Fired Multi-Layer Capacitors in LTCC Packages.
ECE 6466 “IC Engineering” Dr. Wanda Wosik
Non-Arc Welding Processes Resistive heating, chemical reactions, focused light and electrons, sound waves, and friction can also be used to join materials.
Machine Tools And Devices For Special Technologies Semiconductive component manufacturing Slovak University of Technology Faculty of Material Science and.
TSV: Via lining & filling
Piezoresistive sensors
One Way Circuits Limited Printed Circuit Board Manufacturer A Guide To Manufacturing Multilayer PCBs Use Left and Right Cursor keys to navigate ESC to.
Electronic Pack….. Chapter 8: Hybrid Technology and Multichip Modules Slide 1 Chapter 8: Hybrid Technology and Multichip Modules Hybrid = mixture, i. e.:

13/04/2011Rui De Oliveira1 Resistors in Cern PCB worshop.
Integrated Circuits (ICs)
100 Morse Street Norwood, MA Phone: (781) Fax: (781) URL: FOR IMMEDIATE RELEASE Ceramic.
PC Board Manufacturing Kate McDonnell & Cherelle Bishop CSU GK-12 Summer Planning 2011.
Next Generation Integrated Circuits 300 mm wafers Copper metallization Low-K dielectric under interconnect lines High-K dielectric under gate Silicon-on-insulator.
A NOVE LOW-TEMPERATURE MICROCAP PACKAGING USING SU-8 BONDING Y.K. Kim, S.W. Kim, and B.K. Ju Korea,Chungju National,Chungju and University,KOREA Tranducer.
3D PACKAGING SOLUTIONS FOR FUTURE PIXEL DETECTORS Timo Tick – CERN
Chang Liu Micro Actuators, Sensors, Systems Group
1 5. Strain and Pressure Sensors Piezoresistivity Applied stress gives the change in resistance  = F/A  =  x/x  R/R (stress) (strain) In the case of.
Status and outlook of the Medipix3 TSV project
PS fork equipped with 8 semiconductor (4 by arm) strain gauges.
Vacuum, Surfaces & Coatings Group Technology Department Glassy Carbon Tests at HiRadMat 14 March 2014 C. Garion2 Outline: Introduction Context: Transparent.
Training centre for Microtechnology and Nanotechnology Your experts for vocational training and further education Workshop: Introduction to.
1/20 Passive components and circuits - CCP Lecture 13.
INTEGRATED CIRCUITS Dr. Esam Yosry Lec. #2. Chip Fabrication  Silicon Ingots  Wafers  Chip Fabrication Steps (FEOL, BEOL)  Processing Categories 
1 Absolute Pressure Sensors Z. Celik-Butler, D. Butler and M. Chitteboyina Nanotechnology Research and Teaching Facility University of Texas at Arlington.
4W DC/DC converter Specifications TECHNICAL FEATURES : –Power : 4 W –Input Voltage : 22V to 37V –Output Voltage : One Adjustable Output above 3 adjustable.
1 Material Science Ceramics. 2 Introduction to ceramics Ceramics are inorganic, non ‑ metallic materials, which are processed and may be used at high.
CERN Rui de OliveiraTS-DEM TS-DEM Development of Electronic Modules Rui de Oliveira CERN CERN hybrid production experience (or how to stay out of trouble)
Text Book: Silicon VLSI Technology Fundamentals, Practice and Modeling Authors: J. D. Plummer, M. D. Deal, and P. B. Griffin Class: ECE 6466 “IC Engineering”
EE235 Presentation I CNT Force Sensor Ting-Ta YEN Feb Y. Takei, K. Matsumoto, I. Shimoyama “Force Sensor Using Carbon Nanotubes Directly Synthesized.
Presenter Name Facility Name Ultra Thin CCD detectors for particle physics experiments.
1 M. Chitteboyina, D. Butler and Z. Celik-Butler, Nanotechnology Research and Teaching Facility University of Texas at Arlington
ISAT 436 Micro-/Nanofabrication and Applications Photolithography David J. Lawrence Spring 2004.
ADVANCED HIGH DENSITY INTERCONNECT MATERIALS AND TECHNIQUES DIVYA CHALLA.
Possible types of module Si/W CALORIMETER CONCEPT Si/W CALORIMETER CONCEPT G.Bashindzhagyan Moscow State University June 2002 Internal structure (not in.
Dan O. Popa, Intro to EE, Freshman Practicum, Spring 2015 EE 1106 : Introduction to EE Freshman Practicum Lab-Lecture 7: Strain gage and Wheatstone Bridge.
Vessel dimensions GTK assembly carrier Electrical connections Cooling pipes integration Vessel alignment with the beam Next steps Conclusion 3/23/20102electro-mechanical.
Report on dummy detector Equipped with Heater & sensors NA62 GigaTracker Working Group Meeting May 24 th 2011.
Lesson 1-4 Review …Lesson 5-8 Intro. Lesson 1: Component Parts ID Resistors Capacitors Diodes Transistors Switches Speakers Lamps Transformers Batteries.
Thinning and Interconnection DEPFET Meeting, Valencia, Sept Ladislav Andricek, MPI für Physik, HLL  update on thinning  samples for thermal mock-ups.
Antenna Project in Cameron clean room Wafer preparation, conductor deposition, photolithography.
Andrei Nomerotski 1 Flex Status & AID A.Nomerotski, 18 June 2010.
B2GM, Nov 2014 Laci Andricek, MPG Halbleiterlabor 1 PXD Ladder Assembly - Conceptual design of jigs -
HV2FEI4 and 3D A.Rozanov CPPM 9 December 2011 A.Rozanov.
Types of Resistance Strain Gauge
1. Black Board / Slate  2. Time Table 3. Boxing Ring 4. Needle 5. Pepper
Integrated Circuits.
What is IC????? An integrated circuit (IC), sometimes called a chip or microchip, is a semiconductor wafer on which thousands or millions of tiny resistors,
The CSOI approach for integrated micro channels
Solar Panels.
5. Strain and Pressure Sensors
Bonding interface characterization devices
Abrasive cut-off machine (Cutter)
Vertex Detector Mechanical R&D Design Questions and Issues
WG4 – Progress report R. Santoro and A. Tauro.
Hybrid Mechanical/Thermal Design ideas
EuCARD2 WP 10.2 HTS Conductor
Types of Resistance Strain Gauge
SCUBA-2 Detector Technology Development
Electronics Manufacturing Processes
STRAIN GAGE CHARACTERISTICS
Natural Sciences and Technology Grade 6
LPKF Laser Direct Structuring System
Augmenting Path Algorithm
Silicon pixel detectors and electronics for hybrid photon detectors
Augmenting Path Algorithm
Integrated Circuits Computer Signals
Possible types of Si-sensor: SILICON CALORIMETRY FOR A LINEAR COLLIDER G.Bashindzhagyan, Il Park August Silicon sensor.
Presentation transcript:

Carbon wire sensor based in semiconductor strain gauges CONCEPT Sensor 5 Ceramic isolators Ø 1.2 Sleeve in copper Soldering Carbon Wire 5 Action to be measured by the sensor Fork Arm ~ SCALE 10:1 24.03.2014

Carbon wire sensor based in semiconductor strain gauges Option Description GF Feasibility Remarks Cermet Resistor on alumina Printed Cermet circuit on alumina. Baking cycle 800 Celsius Electrical leads and path for cable soldering metalized in the ceramic ~ 15 Technology is well known   Metal printed circuit on ceramic Printed circuit on alumina. ~ 2 Technology is well known, don’t know if this technology has been used for such sensors ScSG Brazed on ceramic plate Silicon cutting Silicon ends metallization Ceramic metallization Brazing (in vacuum furnace) ~ 100 (expected) Technologies are known don’t know if this technology has been use for sensors. Production process complex. Suitable strain gauge thickness ~ 200um Silicon metallization can change gauge properties. Brazing process could induce residual stress. Silicon material ScSG from SOI SOI wafer etching Electrical lead by metallization of bonding Path for cable soldering metalized Silicon oxide layer Technology is known Examples of application for sensor can be found in the literature SOI material type 24.03.2014

Decide on sensor technology Final prototype design Carbon wire sensor based in semiconductor strain gauges Next steps: Define final requirements i.e, suitable gauge factor, sensor dimensions Fix conceptual design Decide on sensor technology Final prototype design Prototype production Test and characterization Final design Final production 24.03.2014