Status Caltech meeting – discussions of assembly centers, US responsibilities We will try to organize a PS module assembly workshop at Brown April 30 – May 1 Building a smaller test rod to understand CF thermal interface, gluing … Smaller radius pipe Test with instrumented AL block Eventually section old rod to examine interface surfaces

Dummy Modules Status at CVI? Daisy Chain testing when received MPA-lite testing is very encouraging Chip basically works as designed CERN is planning to go to 3 vendors for bump bonding Seems excessive to me – some are irrelevant to PS module Few months before chip testing at universities MAPSA-lite sensor fabrication is going more slowly Poor sensor material (?) Some parts broken during testing Bonding vendors have been told that we have dummy parts (as requested by CERN). They will let us kno where or when they are needed.

OT modules The table summarizes the number of modules of each kind in the baseline design with flat inner barrel modules and in the modified design with tilted inner barrels modules. There are 8424 2S modules in either design. These sensors will be about 10x10 cm2 in size for a total silicon area of 170 m2. The PS sensors will be about 5x10 cm2 in size. In the baseline design there will be 7004 of them for a total silicon area of 70 m2. In the modified design the number of PS barrel modules in the barrel would be reduced from 4164 to 2908.

Our interests in OT modules develop and build the support and cooling structure for the flat part of the barrel and in the assembly of a number of the PS modules. The PS modules consist of a strip sensor and a pixel sensor. The strip sensor has two rows of AC coupled strip with a length of 2.5 cm and a pitch of 100 𝜇m. It is bonded on either side to a hybrid with a row of short-strip ASIC (SSA) readout chips. The pixel sensor has 32 rows of macro-pixels of length 1.5 mm and pitch 100 𝜇m. The macro-pixel ASIC (MPA) readout chips will be bump-bonded directly onto the sensor to form a macro-pixel-sub-assembly (MaPSA). The module assembly has to provide for precise alignment of the two sensors relative to each other and supply power and cooling to the sensors and readout chips.

PS Module DC-DC sensor Strip hybrid Opto hybrid Carbon fiber Al-CF R. Lipton

US interests build and test a larger faction of the PS modules (>50%). other options to discuss build and test a significant number of 2S modules? build some mixture of PS and 2S modules? Participating US Institutions Brown University Cornell University Davis Fermilab Rutgers University University of Rochester Santa Barbara Princeton University

Institutional Interests R&D Task Brown Cornell Davis Fermilab Santa Barbara Rochester Rutgers Princeton   R&D Tasks Module Prototyping X Development of assembly procedures Development of testing procedures Development of production infrastructure Support Development Mechanical and thermal tests Readout and test electronics Beam tests

PS Module Participation plans Task Brown Cornell Davis Fermilab Santa Barbara Rochester Rutgers Princeton   Module Constrtcution Tasks 1 Sensors 1.1 Sensor Quality Control X 1.2 Process Quality Control 1.3 Irradiation Tests 2 Hybrids 2.1 FE or Service Hybrid QA X? 3 Mechanics 3.1 Al-CF production(vendor contact) and QA 3.2 Al-CF coating 3.3 CF production (vendor contact) and QA 4 MaPSA 4.1 Vendor Contact and QA 5 Assembly 5.1 Gluing x 5.2 verification of geometrical precision 5.3 Wirebonding 5.4 QA assembled modules (connectivity etc) 5.6 Full QA w/ extended operation & thermal cycles 5.7 Transport Equipment 6 Mechanical Structures 7 Tracker Integration 8 Backend Electronics/L1 Track Trigger Not a production assembly w/ w/Rutgers center

Construction and R&D Cost Estimate for 50% of PS modules

R&D Estimate (in progress) Task # Task Name Start date duration (months) end date milestone/goal date M&S (k$) Travel (k$) Labor (#FTE) Engineer Labor (#FTE) Tech 1 PS Module 1.1 Modules and Chips   155 10 1.5 1.6 1.1.1 Dummy PS Module 1.1.1.1 Fabrication 1/1/15 3 4/1/15 20 0.2 1.1.1.2 Thermal testing 2/1/15 4 6/1/15 1.1.1.3 Fabrication of alternatives 3/1/15 6 8/28/15 50 0.4 1.1.1.4 Parts for commercial test 7/31/15 25 1.1.1.5 Commercal pre-production 12 7/25/16 0.5 1.2 Bump bonding dummy module 113 5 0.95 1.2.1 Sensor wafer fabrication 12/15/14 1/14/15 9 0.1 1.2.2 Dummy ROIC fabrication 1.2.3 Bump bonding 1/10/15 2/9/15 1.2.4 Dummy MPA testing 6/9/15 1.2.5 Integration into dummy module 10/7/15 1.2.6 Commercial pre-production 8 2/4/16 40 0.25 1.3 Full PS Prototype Assembly and test 390 3.2 2 1.3.1 Develop assembly procedures 16 9/23/16 200 1.3.2 assemble prototype 6/26/17 9/24/17 1.3.3 test prototype 1/22/18 1.3.4 7/21/18 100 1.3.5 Test commercial modules 1/17/19 15 Chips 2.1 MAPSa Lite 145 45 1.4 2.1.1 Initial chip tests 2.1.2 Integration with sensors 8/30/15 2.1.3 Bench tests 7/1/15 10/29/15 2.1.4 Beam tests 4/26/16 2.2 MPA Chip fabrication 715 1.75 2.25 2.2.1 Test board development 6/1/16 9/29/16 2.2.2 1/27/17 5/27/17 550 2.2.3 MPA chip test 75 2.2.4 MPA hybrid fabrication 11/28/16 3/28/17 2.2.5 MPA hybrid test Sensors Sensor Development 7/26/17 485 1.9 2.4 3.1.1 First round Novati Fabrication 6/13/15 3.1.2 Test 12/10/15 3.1.3 Pixel sensor fabrications 150 3.1.4 Strip sensor fabrications 3.1.5 sensor testing 60 cost/FTE Total 2003 90 10.7 10.8 Total cost 5853 2140 1620

R&D Estimate (in progress) Task # Task Name Start date duration (months) end date milestone/goal date M&S (k$) Travel (k$) Labor (#FTE) Engineer Labor (#FTE) Tech 2 Chips   2.1 MAPSa Lite 145 45 1.4 1.6 2.1.1 Initial chip tests 2/1/15 4 6/1/15 25 0.5 2.1.2 Integration with sensors 3 8/30/15 40 0.2 2.1.3 Bench tests 7/1/15 10/29/15 2.1.4 Beam tests 6 4/26/16 20 0.4 2.2 MPA Chip fabrication 715 10 1.75 2.25 2.2.1 Test board development 6/1/16 9/29/16 50 2.2.2 1/27/17 5/27/17 550 0.25 2.2.3 MPA chip test 75 1 1.5 2.2.4 MPA hybrid fabrication 11/28/16 3/28/17 2.2.5 MPA hybrid test 9/24/17 Sensors Sensor Development 12/15/14 7/26/17 485 1.9 2.4 3.1.1 First round Novati Fabrication 6/13/15 3.1.2 Test 12/10/15 3.1.3 Pixel sensor fabrications 150 3.1.4 Strip sensor fabrications 3.1.5 sensor testing 8 60 cost/FTE 200 Total 2003 90 10.7 10.8 Total cost 5853 2140 1620

Centers and equipment Test system CMM Auto. Probe station Assembly fixtures Auto Wirebonder Cooling system Burn-in system Gantry Hybrid Testing X   Sensor pkg assembly MPA testing Hybrid assembly to base X- ? Sensor assembly to base Assembly to rods R. Lipton

Infrastructure: module assembly Wire bonder : ~$200K Pull tester. e.g. Dage 4000: ~10K$ Microscope for optical inspection. Microscope with LED display for quick viewing. ~5K$ Glue dispensing robot. ~20K$ Gantry style robot. Aerotech AGS10000 for TOB construction. ~100K$ Automatic Probe station with cold chuck: ~150K$ Camera with LabVIEW Vision system for robot. ~$20k Keithley 237 voltage sources. Standard lab power supplies. ~10-20K$ Vacuum oven: ~20K$ Dry storage units with grounding capability. ~10-20K$ Anti-static protection system. ~5-10K$ CMM ??? Cooling system Burn-in system Test systems Clean Room? Estimate: 400K$ + wire bonder (200K$) + clean room

Infrastructure: sensors Clean room (class 100,000 or better) Basic equipment Source meter ≥ 1000V, Imax ≥ 1mA pAmmeter LCR-Meter 100Hz ≤ f ≤ 1MHz Voltage source Temperature controlled vacuum chuck (~20°C) for sensors up to 16 cm long Light-tight and humidity controlled metallic enclosure Probes, vacuum tweezers, microscope Humidity controlled storage Additional equipment for strip measurements automatic probe station (up to 2032 strips, 5 parameters each) XYZ-stage (accuracy ~5µm) Switching-matrix including HV switching Long-term setup to monitor leakage current at 500 V for 48h Estimate: 250K$ + wire bonder (200K$) + clean room 2/27/2015 Ulrich Heintz - Caltech USCMS meeting

Summary We would like to develop the procedures and assemble PS modules Current costs based on assembly of half of PS modules Interest and capacity to build ALL PS modules can major purchases be made by international colleagues? Centers: Four for assembly and two for sensor QA Prelim R&D costs and Costs to establish centers review and update based on recent experience and expression of interests by institutes. a lot to do… propose a workshop for outer tracker: April 30 – May 1 location: Brown University, Providence dates will be confirmed based on feedback from our CMS partners