Open Book, Open Note 3-4 Multipart Questions

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Presentation transcript:

Open Book, Open Note 3-4 Multipart Questions Business Processes Organization and Roles Annual Business Cycles and Processes Standard, Performance Requirement Types Sales, CM, OM and Net Income Business Cases for New Product Development Design Inputs, Design Outputs and Reviews Verification and Validation Product Program Milestones and Process

Requirements, Flowdown, Block Diagram Aspects of Good Requirements, Poor Requirements Validation and Verification Standard Requirements Performance Requirements Allocation and Margin Association External Interfaces Block Requirements and Bl-Bl Interfaces Analog, Digital and Power Interface Signal Requirements

Electromagnetic Compliance & Global Power Nominal Voltage & Frequency vs Country Robust Operational Ranges of Voltage and Frequency EMC Certification, Engineering Tests and Technical Justifications Emission Tests and Limits CISPR11 Radiated and Conducted E Field Emission EN61001-3-2 Powerline Harmonic Emission EN61001-3-3 Voltage Fluctuation and Flicker Emissions Susceptibility Tests Standard Response Levels, Classifications EN61000-4-2 Electrostatic Discharge Stress EN61000-4-3 Radiated E-Field Stress EN61000-4-4 Electrical Fast Transient Stress EN61000-4-5 Power Surge Stress EN61000-4-6 RF Conducted Electrical Stress EN61000-4-8 Power Frequency B-Field Stress EN61000-4-11 Power Dropout, Variation Stress

Safety Test Labs, Standards Bodies and Government Agencies Common Hazards NEC Underwriters Labs CSA ISO IEC US Government Departments & Applicable Agencies US DoD Organization Common Applicable Standards, MIL-STDs, UL-STDs CE Mark Key Aspects of Product Safety, Electrical, Mechanical, EHS

Prototyping Systems Methods Guidelines Soldering Substrates & Boards Breadboard Wirewrap Perfboard with and without pads Deadbug PCB’s handmade transfer, photolitho and outsourced Guidelines Soldering Substrates & Boards Overall Prototyping Systems and Limitations Thru Hole vs SMT Packages Sockets, Interconnection Systems

Analog Design For Mass Production Op Amp Basic Inverting, Non-inverting configurations, Nom Gains Op Amp Vio, Iio, Ib, Ad, Ac, CMRR, Slew Rate DC Errors caused by Vio, Iio, Ib Gain Errors caused by Ad Total Error Voltage and Effects of Resistor Tolerance Slew Rate Distortion Op Amp max Vout, Iout Basic frequency response circuit analysis Finding Av(s) from circuit analysis Steady State Response Av(jw) Finding Mag |Av(jw)|, Phase |Av(jw)|, from Av(s) Discrete Component Specification Noise Sources & Analysis What types of Analysis are Required or Suggested for Subcircuits