Activities Status and Plan for the week D. Giugni / INFN Milano Monday Meeting 2011-01-30 D. Giugni

Harnesses Stacking Set 0 left UN-USED Set 1 Set 2 Set 3 Decided so far to grab from the set only spares (if required). Considered not “for production” Set 1 General Set has been assigned to C34 (X0) One Harnesses non conformal  one taken from Set 2 Status All the Harnesses “Prepared” and tested IPS, IHV-NTC, OIH-NTC are Stacked and tested OPS stacking planned today Open Issues Need to repair the swapped harness Set 2 Set has NOT been assigned to nSQP Decided to put in hold: too many faults. Only 2 Harnesses “Prepared” and tested Need repairs Set 3 General Set assigned to C12 Status All IHV-NTC and OHV-NTC “Prepared” IHV-NTC, OHV-NTC Redy to stack (Today) Open Issues None D. Giugni Monday Meeting 2011-01-30

Soldering Agreed sequence IF PP0 OSP boards are not released: ISP C34 (X0) started ISP C12 (X1?) will start next Monday (new soldering team) ISP C56 (X2?) will start ~Feb 20th with the 3rd soldering team ISP C78 (X3?) will start when ISP C12 is done (< Feb 20th) D. Giugni Monday Meeting 2011-01-30

Post Soldering Assembly (General) This activities is referring, at the moment, only to the Trail C34 (X-1) Main operations: Bond ER bundle organizers at PP0 Bond E_boards peek pins Bond type0 cable stabilizer (only for ISP) Bond PP1 Flanges Bend harnesses at the dogleg Testing Load ER bundles (on the OSP bottom a/o ISP) and mount some ancillary parts Load the E-Boards (on the OSP bottom a/o ISP) Functionality test Secure the E-boards D. Giugni Monday Meeting 2011-01-30

Post Soldering Assembly (Status) OSP C4 (X-1) Completed. Panel is not functional due to the extensive wire cut required to put it together OSP C3(1) (X-1) Not done yet. Panel has been just released from the Soldering ISP C4 (X-1) Completed. Panel is functional. ISP C3 (X-1) Bond ER bundle organizers at PP0 Bond E_boards peek pins Bond type0 cable stabilizer (only for ISP) Bond PP1 Flanges Bend harnesses at the dogleg Testing Load ER bundles (on the OSP bottom a/o ISP) and mount some ancillary parts Load the E-Boards (on the OSP bottom a/o ISP) Functionality test Secure the E-boards D. Giugni Monday Meeting 2011-01-30

Final Assembly Referring only to the trial (X-1). Main operations: Set up the backbone Load the cooling pipes Load OSP L and R Load the ER_Bundles on the OSP’s Top Load the E_Board on the OSP’s Top Flip the assembly up side down Dress up the ER_Bundles at PP1 and on the Flowers Functionality Test Load the ENV sensors Flip the nSQP Secure the Top E_Boards Dress up the bundles at the PP1 can D. Giugni Monday Meeting 2011-01-30

Schedule for this week Schedule presented last week has been significantly reshuffled due to same missing parts. Mainly: OSP PP0 boards, some ISP Cx and all A side boards. PP0 stiffeners The original nSQP assembly sequence: has been changed to: C34 ISP  C12 ISP  ISP C56  ISP C78 … D. Giugni Monday Meeting 2011-01-30

Schedule for this week (2) Corrugated panel bonding: Delay in SLA parts. 2 panels done for the C34. Restart the production as soon as parts a delivered (this week?) . PP0 boards stiffening and Alu Block bonding Received C2, C5, C7 ISP board loaded. Received ISP stiffeners  Laminate and test the boards within this week ISP C12 (really needed by Fri!) Soldering Keep going with the ISP C34 (X0) HV-NTC (Main Team) Prepare the second Team by next Mo for the ISP C12. Post Soldering Assembly On ISP C3 (X-1): Bond cable stabilizer Bend Harness, Test, Load ER-Bundles and dummy E-Board On OSP C4 (X-1): Start the full procedure. Final Assembly Trial (X-1) Work out better flipping tool Load pipes in C3 Sort out ENV sensor location Be prepared to receive the ISP C3 and ISP C3