Date of download: 11/6/2017 Copyright © ASME. All rights reserved. From: Effect of Joint Size on Microstructure and Growth Kinetics of Intermetallic Compounds in Solid-Liquid Interdiffusion Sn3.5Ag/Cu-Substrate Solder Joints J. Electron. Packag. 2013;135(2):021004-021004-10. doi:10.1115/1.4023846 Figure Legend: (a) Actual specimen design (top) and schematic drawing (bottom) of the SS specimen. (b) Actual specimen design (top) and a schematic drawing (bottom) of the LS specimen. Dimensions are in mm.

Date of download: 11/6/2017 Copyright © ASME. All rights reserved. From: Effect of Joint Size on Microstructure and Growth Kinetics of Intermetallic Compounds in Solid-Liquid Interdiffusion Sn3.5Ag/Cu-Substrate Solder Joints J. Electron. Packag. 2013;135(2):021004-021004-10. doi:10.1115/1.4023846 Figure Legend: SEM backscattered electron images illustrating the microstructure of Sn-3.5Ag/Cu solder joints of the SS2 specimen (25 μm-thick) fabricated at different temperatures for various soldering times

Date of download: 11/6/2017 Copyright © ASME. All rights reserved. From: Effect of Joint Size on Microstructure and Growth Kinetics of Intermetallic Compounds in Solid-Liquid Interdiffusion Sn3.5Ag/Cu-Substrate Solder Joints J. Electron. Packag. 2013;135(2):021004-021004-10. doi:10.1115/1.4023846 Figure Legend: SEM backscattered electron images illustrating the microstructure of Sn-3.5Ag/Cu solder joints of the LS specimen (450 μm-thick) fabricated at different temperatures for various times

Date of download: 11/6/2017 Copyright © ASME. All rights reserved. From: Effect of Joint Size on Microstructure and Growth Kinetics of Intermetallic Compounds in Solid-Liquid Interdiffusion Sn3.5Ag/Cu-Substrate Solder Joints J. Electron. Packag. 2013;135(2):021004-021004-10. doi:10.1115/1.4023846 Figure Legend: EDX analysis indicating the presence of (a) Cu3Sn (b) Cu6Sn5, and (c) Ag3Sn IMCs in the Sn-3.5Ag/Cu solder joints

Date of download: 11/6/2017 Copyright © ASME. All rights reserved. From: Effect of Joint Size on Microstructure and Growth Kinetics of Intermetallic Compounds in Solid-Liquid Interdiffusion Sn3.5Ag/Cu-Substrate Solder Joints J. Electron. Packag. 2013;135(2):021004-021004-10. doi:10.1115/1.4023846 Figure Legend: Comparison of the IMC growth behavior in different specimen sizes at different soldering temperatures

Date of download: 11/6/2017 Copyright © ASME. All rights reserved. From: Effect of Joint Size on Microstructure and Growth Kinetics of Intermetallic Compounds in Solid-Liquid Interdiffusion Sn3.5Ag/Cu-Substrate Solder Joints J. Electron. Packag. 2013;135(2):021004-021004-10. doi:10.1115/1.4023846 Figure Legend: Log-log plot of the growth rate constant versus the reciprocal of temperature: (a) for the Cu6Sn5 IMC layer and (b) for the Cu3Sn IMC layer in different specimen sizes