Phase 2 Outer Tracker Module analysis

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Presentation transcript:

Phase 2 Outer Tracker Module analysis and some wirebonding Susanne Kyre UC Santa Barbara Tracker upgrade workshop June 3, 2009 Susanne Kyre

TK OB module for thermal analysis Module geometry based on slides from April Tracker week Tracker upgrade workshop June 3, 2009 Susanne Kyre

Dimensions and Materials Part Material Area [mm2] Thickness [microns] thermal conductivity [W/mK] Power [mW] Sensor Silicon 100 x 100 200 148 100 Chip 7 x 7 500 125 DCU 3 x3 1000 DC-DC 5 x 5 150 Pitch adapter Kapton 116 x 15 0.3 Hybrid substrate TPG 800 1500 in plane; 20 across thickness Module support rail 200 x 10 Epoxy thermally conductive epoxy all glue joints 50 1.5 Cooling Block Beryllium Oxide 2 x 20 2000 248 Alternate hybrid PC-board Fiberglass & copper 0.62 (fiberglass) 385 (copper) Tracker upgrade workshop June 3, 2009 Susanne Kyre

FEA Model Tracker upgrade workshop June 3, 2009 Susanne Kyre

Result of steady state thermal analysis with PCB hybrid Hybrid: fiberglass with two 0.5oz layers of copper (17.7 micron thick) Max temperature: -23.7 deg C, location: second hybrid at DC-DC Tracker upgrade workshop June 3, 2009 Susanne Kyre

Sensor temperature distribution with PCB hybrid Max sensor temperature: -25.1 deg C Tracker upgrade workshop June 3, 2009 Susanne Kyre

2 Hybrids per Sensor Max temperature: -22.6 deg C, location: 4th hybrid Max sensor temperature: -23.6 deg C Tracker upgrade workshop June 3, 2009 Susanne Kyre

TPG graphite hybrid Max Temperature: -26.2 deg C Tracker upgrade workshop June 3, 2009 Susanne Kyre

This is a first, very basic thermal model! Information needed: Geometry Materials Power of components Cooling system, fluid, pipe diameter etc. Tracker upgrade workshop June 3, 2009 Susanne Kyre

Pitch Adapter? Can we get away without a PA? Try wirebonding directly from the chip to the sensor Max. offset between a 50micron pitch chip and a 100 micron pitch sensor: 3.25mm Problem area is the “kink” between the bondfoot (aligned with the bondpad) and the bondwire; expect low pullstrength Could the bondpads be angled to match the angle of the wire? UCSB can do some bonding tests Tracker upgrade workshop June 3, 2009 Susanne Kyre