detector development readout electronics interconnects bump bonding flex cables KPiX readout chip mechanical prototype R Frey SiD Cal 18Feb2010

overview Revised Overall Goal: Produce test module using same technology as collider detector The necessary silicon sensors in hand (Hamamatsu v-2) – Oregon Readout chip: KPiX-8 (256 ch) → KPiX-9 (512) – SLAC 1024 ch required Interconnects – Davis KPiX-sensor: gold-gold bump-bonding trials in progress Flex cable: need test of ASC cable-sensor connections Target: Assemble module and test in beam (SLAC?) 2010-11 R Frey SiD Cal 18Feb2010

Silicon-Tungsten ECal Progress in integrated analog-digital electronics, interconnect technologies, and silicon sensors have made possible the advent of very dense, imaging electromagnetic calorimeters for future detectors. Highly segmented transverse readout (silicon). 13 mm2 pixels Particle separation for PFA (jets), tau decay id, etc Dense (tungsten) with very small readout gaps (1 mm) Small Moliere radius – resolve individual showers: photon imaging and particle separation (PFA), photon vertexing Longitudinal readout (~30 layers) imaging of showers and MIPs good energy resolution (17%/√E ). R Frey SiD Cal 18Feb2010

Interconnect issues: Technologies being considered Prototyping Production KPiX to Sensor Gold Stud Bonding (Epoxy/Thermo-compression) Indium/Solder Bump Bonding Flex Cable to Sensor Solder Balls Conducting Epoxy Anisotropic Conducting Film (ACF) ACF? Indium/Epoxy ACF/Epoxy/Solder

KPiX with Gold Studs Studs are well-formed and centered on the 70x70 mm pads.

Gold Stud Attachment Three possibilities: Conducting Silver Epoxy. High degree of bump height uniformity required. No limit on number of bumps. Low temp and pressure. Good success for large pads (>100 um). Work in progress for 50 um pads. Thermo-compression. Typically, high temp and pressure: 300-350C and 150-200g/bump. Machine limit ~100-200 kg => Limits total number of bumps. Thermosonic. Lower temp and pressure: 150C and 75g/bump. Limit on total number of bumps because of the limit on total deliverable ultrasonic power without breaking the chip. bullets 6 6

Thermoplastic Conducting Adhesive (ACF) Btechcorp: Metal fibers in a matrix ~2 x 107 fibers/in2 Low Cure pressure: 50 psi Resistive Conductive 8 um nickel fiber structure. close-packed array  Initial results are promising. Goal for Flex Cable pads (100 sq mil) is ~100 mΩ, which is achievable.

KPiX and Si sensors Continued evaluation/debugging of KPiX Noise measurements Found lockup mode in KPiX-7,-8 Should be fixed in KPiX-9 With a 512-channel KPiX-9 bump-bonded to a sensor, can get noise measurements for the full range of input capacitances and resistances. Goal for ~ spring 1300 e rms R Frey SiD Cal 18Feb2010

Summary goals, progress, plans Year 1 Year 2 Year 3 Goal from proposal Complete R&D on component technologies Assemble test module, start beam test Beam test, data analysis Status Sensors – OK Tungsten – OK KPiX – need 1024 channel chip KPiX-Si bumps: need to converge on technology Flex cable – ok Cable-Si connect: needs R&D Need the integrated tests first. Flex cable can be made independently; same for DAQ tbd Plan Hope to have 1024 KPiX and bumping technology by summer for combined testing in lab. Need to finalize cable-Si tech Re-evaluate resource needs – so far ok. If integrated tests look OK, begin planning for beam test. Assume SLAC for now. R Frey SiD Cal 18Feb2010