Process Flow for ESS5810 AMSF

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Presentation transcript:

Process Flow for ESS5810 AMSF 11. Nickel electroplating 1. Wafer clean 2. Thermal oxidation Lift-off process 3. PR coating and patterning, Mask #1 7. Double side alignment and Dry etching on back side, Mask#B Thick PR stripping, Cr etching, and wafer dicing. 4. Wet BOE etching SiO2 Dry RIE etching low stress nitride 8. PR coating and patterning , Mask#3 12. TMAH bulk etching 5. Positive resist become negative PR coating and patterning, Mask#2 Nickel etching and PR stripping 13. Anodic bonding process 10. Thick PR coating and patterning, Mask#4 6. E-beam evaporation Cr/Ni Fall, 2003