Large Pixel Detector LPD John Coughlan STFC Rutherford Appleton Laboratory on behalf of LPD collaboration.

Slides:



Advertisements
Similar presentations
6 Mar 2002Readout electronics1 Back to the drawing board Paul Dauncey Imperial College Outline: Real system New VFE chip A simple system Some questions.
Advertisements

26-Sep-11 1 New xTCA Developments at SLAC CERN xTCA for Physics Interest Group Sept 26, 2011 Ray Larsen SLAC National Accelerator Laboratory New xTCA Developments.
2D Detectors DAQ Overview 2D detectors are organized as tiles providing 10G Ethernet serialized portions of the full.
20 Feb 2002Readout electronics1 Status of the readout design Paul Dauncey Imperial College Outline: Basic concept Features of proposal VFE interface issues.
28 August 2002Paul Dauncey1 Readout electronics for the CALICE ECAL and tile HCAL Paul Dauncey Imperial College, University of London, UK For the CALICE-UK.
4 Dec 2001First ideas for readout/DAQ1 Paul Dauncey Imperial College Contributions from all of UK: result of brainstorming meeting in Birmingham on 13.
The TrainBuilder ATCA Data Acquisition Board for the European XFEL The TrainBuilder ATCA Data Acquisition Board for the European-XFEL John Coughlan, Chris.
The Train Builder Data Acquisition System for the European-XFEL John Coughlan, Chris Day, Senerath Galagedera and Rob Halsall STFC Rutherford Appleton.
XFEL Large Pixel Detector DAQ. Project Team Technical Team: STFC Rutherford DAQ Glasgow University Surrey University Science Team: UCL Daresbury Bath.
Peter Göttlicher, DESY-FEB, XFEL-DAQ-2007/03/05 1 XFEL-PIXEL Readout and control Detector requirements/proposal Basic concepts for experiments Control.
MR (7/7/05) T2K electronics Beam structure ~ 8 (9?) bunches / spill bunch width ~ 60 nsec bunch separation ~ 600 nsec spill duration ~ 5  sec Time between.
U N C L A S S I F I E D FVTX Detector Readout Concept S. Butsyk For LANL P-25 group.
XFEL The European X-Ray Laser Project X-Ray Free-Electron Laser Dariusz Makowski, Technical University of Łódź LLRF review, DESY, 3-4 December 2007 Advanced.
Leo Greiner IPHC meeting HFT PIXEL DAQ Prototype Testing.
ILC Trigger & DAQ Issues - 1 ILC DAQ issues ILC DAQ issues By P. Le Dû
Data Acquisition Card for the Large Pixel Detector at the European XFEL 1 Tuesday 28 th September 2011, TWEPP Vienna Presented by John Coughlan STFC Rutherford.
Detectors for Light Sources Contribution to the eXtreme Data Workshop of Nicola Tartoni Diamond Light Source.
Leo Greiner IPHC DAQ Readout for the PIXEL detector for the Heavy Flavor Tracker upgrade at STAR.
11th March 2008AIDA FEE Report1 AIDA Front end electronics Report February 2008.
Presentation for the Exception PCB February 25th 2009 John Coughlan Ready in 2013 European X-Ray Free Electron Laser XFEL DESY Laboratory, Hamburg Next.
Network Architecture for the LHCb DAQ Upgrade Guoming Liu CERN, Switzerland Upgrade DAQ Miniworkshop May 27, 2013.
Background Physicist in Particle Physics. Data Acquisition and Triggering systems. Specialising in Embedded and Real-Time Software. Since 2000 Project.
Features of the new Alibava firmware: 1. Universal for laboratory use (readout of stand-alone detector via USB interface) and for the telescope readout.
Instrumentation DepartmentCCLRC Rutherford Appleton Laboratory28 March 2003 FED Project Plan 2003 FED Project aiming to satisfy 2 demands/timescales: Module.
NUMI Off Axis NUMI Off Axis Workshop Workshop Argonne Meeting Electronics for RPCs Gary Drake, Charlie Nelson Apr. 25, 2003 p. 1.
Latest ideas in DAQ development for LHC B. Gorini - CERN 1.
John Coughlan Tracker Week October FED Status Production Status Acceptance Testing.
1 07/10/07 Forward Vertex Detector Technical Design – Electronics DAQ Readout electronics split into two parts – Near the detector (ROC) – Compresses and.
Guido Haefeli CHIPP Workshop on Detector R&D Geneva, June 2008 R&D at LPHE/EPFL: SiPM and DAQ electronics.
Update on the project - selected topics - Valeria Bartsch, Martin Postranecky, Matthew Warren, Matthew Wing University College London CALICE a calorimeter.
A Super-TFC for a Super-LHCb (II) 1. S-TFC on xTCA – Mapping TFC on Marseille hardware 2. ECS+TFC relay in FE Interface 3. Protocol and commands for FE/BE.
STAR Pixel Detector readout prototyping status. LBNL-IPHC-06/ LG22 Talk Outline Quick review of requirements and system design Status at last meeting.
D. Attié, P. Baron, D. Calvet, P. Colas, C. Coquelet, E. Delagnes, R. Joannes, A. Le Coguie, S. Lhenoret, I. Mandjavidze, M. Riallot, E. Zonca TPC Electronics:
BPM stripline acquisition in CLEX Sébastien Vilalte.
XFEL In-kind Review Committee Meeting, 11 May 2009 Parliament British Museum XFEL clock and control system In kind contribution proposal Development and.
1 On- and near-detector DAQ work for the EUDET calorimeters Valeria Bartsch, on behalf of CALICE-UK Collaboration.
ECFA Workshop, Warsaw, June G. Eckerlin Data Acquisition for the ILD G. Eckerlin ILD Meeting ILC ECFA Workshop, Warsaw, June 11 th 2008 DAQ Concept.
Rutherford Appleton Laboratory September 1999Fifth Workshop on Electronics for LHC Presented by S. Quinton.
ROM. ROM functionalities. ROM boards has to provide data format conversion. – Event fragments, from the FE electronics, enter the ROM as serial data stream;
August 24, 2011IDAP Kick-off meeting - TileCal ATLAS TileCal Upgrade LHC and ATLAS current status LHC designed for cm -2 s 7+7 TeV Limited to.
ROD Activities at Dresden Andreas Glatte, Andreas Meyer, Andy Kielburg-Jeka, Arno Straessner LAr Electronics Upgrade Meeting – LAr Week September 2009.
DAQ and Trigger for HPS run Sergey Boyarinov JLAB July 11, Requirements and available test results 2. DAQ status 3. Trigger system status and upgrades.
E. Hazen1 MicroTCA for HCAL and CMS Review / Status E. Hazen - Boston University for the CMS Collaboration.
E. Hazen -- Upgrade Week1 AMC13 Project Status E. Hazen - Boston University for the CMS Collaboration.
E. Hazen -- xTCA IG1 AMC13 Project Status E. Hazen - Boston University for the CMS Collaboration.
EXtreme Data Workshop Readout Technologies Rob Halsall The Cosener’s House 18 April 2012.
Giovanna Lehmann Miotto CERN EP/DT-DI On behalf of the DAQ team
M. Bellato INFN Padova and U. Marconi INFN Bologna
Use of FPGA for dataflow Filippo Costa ALICE O2 CERN
AMC13 Project Status E. Hazen - Boston University
DAQ and TTC Integration For MicroTCA in CMS
CALICE DAQ Developments
Electronics Trigger and DAQ CERN meeting summary.
Enrico Gamberini, Giovanna Lehmann Miotto, Roland Sipos
Large Area Endplate Prototype for the LC TPC
The Train Builder Data Acquisition System for the European-XFEL
CMS EMU TRIGGER ELECTRONICS
MicroTCA Common Platform For CMS Working Group
Photon beamline crates
A First Look J. Pilcher 12-Mar-2004
VELO readout On detector electronics Off detector electronics to DAQ
8-layer PC Board, 2 Ball-Grid Array FPGA’s, 718 Components/Board
Example of DAQ Trigger issues for the SoLID experiment
UK ECAL Hardware Status
John Harvey CERN EP/LBC July 24, 2001
LHCb Trigger, Online and related Electronics
The CMS Tracking Readout and Front End Driver Testing
SVT detector electronics
The LHCb Front-end Electronics System Status and Future Development
Presentation transcript:

Large Pixel Detector LPD John Coughlan STFC Rutherford Appleton Laboratory on behalf of LPD collaboration

Project Team Technical Team: STFC Rutherford Appleton Laboratory Glasgow University Surrey University Science Team: UCL Daresbury Bath University others …

Work Packages WP1: Sensors WP2: Front End ASIC Stephen Thomas One overall project manager Marcus French WP1: Sensors WP2: Front End ASIC Stephen Thomas WP3: Mechanical Design WP4: On Detector Electronics WP5: Front End Readout John Coughlan WP6: Software, Controls Tim Nicholls WP7: Flat Geometry Design (Glasgow) Approved ISO9000 Project management system

Project Schedule 1) Phase 1: Develop a digitising pipelined XFEL 2D pixel detector (1k by 1k pixels) 3Y Project started Feb 2008 2) Phase 2: Construct complete XFEL instruments (~16 Mpix) as required before XFEL operation 2013 Mapped to XFEL Science areas tbd

Phase 1 Prototype Detector 1M Pixel Hybrid Pixel Detector 0.5 x 0.5 mm pixels MSCs readout Cards on rear 4 x 4 Super Modules Silicon Sensor Array Tiled Geometry

Module Concept Sensor Tile with mounted ASICs 4 K pixels High resistivity Silicon 500 micron thickness 200 V bias 0.5 x 0.5 mm Pixels

XFEL ASIC New design matched to the XFEL: - Time Structure - Dynamic Range - Channel Count - System Interfaces etc. Implemented in 0.13 micron CMOS

Multi-gain concept Required dynamic range compression Experience with calorimetry at CERN Relaxes ADC requirements Fits with CMOS complexity

Store in Pipeline during bunch train Readout during long gap XFEL ASIC 512 channels Analogue Pipelines 512 samples deep x 3 ADC 14 bits (12 eff) @10 MHz Sequencing and control Dynamic range stages ADC Stages Overload Control IO to DAQ Power supplies Pixel Resetting Store in Pipeline during bunch train Readout during long gap Deep pipeline memory (786,432 samples) Power supply Conditioning

XFEL Structure X-ray photons 100 fs FEL Data Sampling to Memory Electron bunch trains; up to 3000 bunches in 600 msec, repeated 10 times per second. Producing 100 fsec X-ray pulses (up to 30 000 bunches per second). 100 ms 100 ms 600 ms 99.4 ms XFEL ~ 30 000 bunches/s but 99.4 ms (%) emptiness 200 ns FEL process X-ray photons 100 fs Data Sampling to Memory Serialise and Transmit to DAQ

Front End Readout MSCs readout Cards on rear 16 Super Modules

Front End Readout 1st Stage On Detector Head Module Support Cards (MSC) 2 per Super Module -> 32 MSCs total Aim to keep MSC simple (need a lot for large detectors) FPGA interface to ASICs. ASIC Read Out: Select appropriate 1 of 3 Gains for Readout Keep 12 bits 320 MB/sec per MSC (~2.5 Gbps) ASIC Input: Clock and Controls , bunch fill pattern

Front End Readout 1st Stage Baseline LVDS off Detector Head Module Support Cards (MSC) 2 per SuperModule -> 32 total Data transmission off Detector Baseline Electrical Links Bi-dir E.g. LVDS Camera Link (NatSemi Channel Link) Advantage COTS receivers for prototype tests Issues Cable length, LSZH restrictions, Common mode, shielding Detector movements (every day?)

Front End Readout 2nd Stage Close to Detector FEM Flexible Layer Concentrator Buffering DMA controller Calibration corrections Peds.. XFEL Formatting (headers id) Serial Optical output GEthernet Traffic Shaping + Reject bunches MSCs FPGA Interface to DAQ Interface to CTR Fast Timing and Ctrls System Receive clocks, synch, event nr, bunch fill information, vetos? Configuration User Controls via DOOCs

Requirements on the Machine Info to FEMs Fast Signals: Clock(s) @ multiple of bx? psec rms Serial stream with encoded... Bunch fill serial bits transmitted well before each pulse train, FEM transmits to FE ASIC. Bunch currents FEM appends to data stream Event Vetos Interlocks, safety Slow Info Run type, modes, bunch energies CTR AMC in each FE crate? Local distribution?

Front End Readout Interface to common DAQ MSCs EoI Straw Man Event Builder & Processor X FPGA Interface to DAQ

Front End Readout Feasibility could we use Dev boards? MSC Cards x 32 COTS FEM : Virtex 5 dev board Buffering ~GB Xilinx MPMC Traffic Shaping GbE/UDP 1 GbE x 3-4 FPGA Virtex 5 Interface to DAQ LVDS links Run Linux on PPC in V5FX? Interface to Fast Timing and Ctrls System?

Modularity 1xMPixel Nr Super Modules 16 Nr Hybrids 256 Nr Module Support Cards 32 Nr Front End Modules (4 links) Nr Links (@1 GbE) 96 Each FEM Fragment = 64 KB (32 MB per train) 64 KB x 512 x 10 = 320 MB/s 1 M Pixels x 512 x ~ 2 bytes x 10 Hz ~ 10 GBytes/sec 10 GB/sec per MPix => 36 TeraBytes per hour

16 x MPixel Nr Super Modules 256 Nr Hybrids 4,096 Nr Module Support Cards 512 Nr Front End Modules (4 links) Nr Links (@1 GbE) 1,536 Each FEM Fragment = 64 KB (32 MB / train) 64 KB x 512 x 10 = 320 MB/s 160 GB/sec => ~ 600 TeraBytes per hour

C.f. LHC Event Builder CMS : 512 FEMs each bx 2 kB @ 100kHz Throughput ~ 100 GB/sec @ full Lumi XFEL : 512 FEMs each bx 32 MB @ 10 Hz Throughput ~ 160 GB/sec

10 GbE Front End Readout X 10 GbE switch 10 GbE xTCA MSCs Build 10 Gb Custom FEM Today quite challenging 4 x 2.5 Gbps links XAUI Xilinx V6 with 10 Gb GTP? X FPGA 10 GbE switch 10 GbE xTCA

Alternative Solutions for 10 GbE? Industry Processor Based iWARP = Internet Wide Area RDMA Protocol RDMA over TCP/IP Storage networking, HPC Major industry involvement Objective to exploit 10 GbE @ wire speed Standard to compete with proprietary solutions e.g. Myrinet COTS Multiple vendors NICs 1GbE, 10GbE OS agnostic PCIe form factor in xTCA one day? 10Gb iWARP NIC

Alternative Solutions for 10 GbE? iWARP = Internet Wide Area RDMA Protocol More than TCP Offload Engines Remote DMAs between User Space, eliminate copies (Infiniband) Offloads TCP/IP, avoids context switches PC offload factors 90% ? FEM FPGA functions in Processor. Adds protocol layers. Effort into programming. Requires iWARP NICs at PC farm end Worth investigating Combine Camera Link Receiver with NIC in PC? Full COTS solution

EoI Straw Man Event Builder 1 MPix Line Card Receiver 10 GbE Event builder and Processor. Assuming Data Processing with Data Reduction Need access to complete frames? Data Processing engines FPGA vs FPNA vs MicroProcessor? FPt ?? Implementation AMC Mezzanines on Commercial ATCA Carrier Board Or AMCs in MicroTCA Large scale data switching problem -> ATCA Serial mesh fabric sharing between 1 MPix cards

Software, Controls and Integration Delivery and Operation of Detector in beam-line environments. System Operation Timing and Controls. Software Development and Integration with Beam-line scientists. Real Time Data Monitoring and Analysis. Assume use common XFEL controls package DOOCS

Next Steps FPGA Solutions MSC FPGA LVDS Camera Link readout off detector head. FEM Firmware development on V5 dev boards. Fragment building Memory controller Traffic shaping UDP/GbE Profit from DESY developments Keep monitoring COTS dev boards Virtex 6 45nm? 10 Gb? R&D FEM in AMC FEM prototype with 1 Gb / 10 Gb link (SFP+?), V5, Cross point switch (elements of an ATCA Line Card) Alternative Solutions Investigate FEM processor based solution on iWARP Demonstrator 1 GbE iWARP NICs Or 10 GbE NICs Test FEM demonstrator PC with Camera Link Frame Grabber card and iWARP NIC

Spare Slides

Some Questions Assume problem is to design readout system to transmit raw data for all possible bunches/bunch trains continuously. Which scientific experiments require this? Assume 1-10 GbE layer is DAQ interface. Will science be done at XFEL with the our 1 MPix prototype? How often do Large Detectors need to move? Is data reduction before PC farm possible or tolerable to end users? Need clever ideas from knowledgeable people for data processing algorithms.

Phase 2 Final Detector Large Pixel Detector multi M Pixel …we were planning for this at XFEL start up…

Prototypes vs Final Systems Detector builders want some (basic) readout early Final systems design with full readout in mind Conflict of interest, resources Using standards COTS ready made solutions for prototyping

Camera Link Standard Industrial video NatSemi Channel Link chipset (implement in V5) LVDS cables (CERN SLINK) Base 24 bits @ 85 MHz ~ 2 Gbps (Medium ~ 4 Gbps High ~ 6 Gbps) Cables <10 m? LSZH Shielding, common mode

Power and Cooling Detector 1- 2 mW per pixel (power management on ASIC?) Water cooling LV .13 ASICs @ 1 V HV 200 V bias