Date of download: 12/26/2017 Copyright © ASME. All rights reserved. From: Analysis of the Wicking and Thin-Film Evaporation Characteristics of Microstructures J. Heat Transfer. 2009;131(10):101001-101001-11. doi:10.1115/1.3160538 Figure Legend: Schematic illustration and definition of the thin-film region of a liquid meniscus formed over a sphere
Date of download: 12/26/2017 Copyright © ASME. All rights reserved. From: Analysis of the Wicking and Thin-Film Evaporation Characteristics of Microstructures J. Heat Transfer. 2009;131(10):101001-101001-11. doi:10.1115/1.3160538 Figure Legend: Capillary pressure versus nondimensional liquid volume for square and hexagonally-packed spheres for various contact angles (15–90 deg)
Date of download: 12/26/2017 Copyright © ASME. All rights reserved. From: Analysis of the Wicking and Thin-Film Evaporation Characteristics of Microstructures J. Heat Transfer. 2009;131(10):101001-101001-11. doi:10.1115/1.3160538 Figure Legend: Non-dimensional area-averaged minimum meniscus distance versus nondimensional liquid volume for square- and hexagonally-packed spheres for various contact angles (15–90 deg)
Date of download: 12/26/2017 Copyright © ASME. All rights reserved. From: Analysis of the Wicking and Thin-Film Evaporation Characteristics of Microstructures J. Heat Transfer. 2009;131(10):101001-101001-11. doi:10.1115/1.3160538 Figure Legend: Total exposed liquid free-surface area versus nondimensional liquid volume for square- and hexagonally-packed spheres for various contact angles (15–90 deg)
Date of download: 12/26/2017 Copyright © ASME. All rights reserved. From: Analysis of the Wicking and Thin-Film Evaporation Characteristics of Microstructures J. Heat Transfer. 2009;131(10):101001-101001-11. doi:10.1115/1.3160538 Figure Legend: Final liquid meniscus shape (dark gray) for Topology 1 (HP), r=1, H=1, P=2.8; θ=15 deg between sphere surface and liquid
Date of download: 12/26/2017 Copyright © ASME. All rights reserved. From: Analysis of the Wicking and Thin-Film Evaporation Characteristics of Microstructures J. Heat Transfer. 2009;131(10):101001-101001-11. doi:10.1115/1.3160538 Figure Legend: Total thermal resistance for evaporation and conduction in the wick versus nondimensional liquid height in the wick pore for θ=15, 30, and 45 deg, porosity=0.56