TIMEPIX TESTBEAM TELESCOPE FOR AIDA Paula Collins – LHCb Slides taken from Richard Plackett VERTEX 09 presentation

Medipix2 Single photon counting readout provides low noise, high contrast images with very high dynamic range 55um pixel matrix (256 by 256) reading Si, 3D, CdTe, GaAs sensors Configurable ‘shutter’ allows many different applications

Timepix Timepix is a derivative of Medipix2 Addition of a global clock (up 100MHz) which is propagated to every pixel Originally conceived for GEM foil detectors The clock can be used for Time of Arrival (ToA) and Time over Threshold (ToT) modes. Threshold Time of Arrival Mode Counts from passing threshold to closing shutter Allows accurate timing of hits in individual pixels

silicon edge just 7 mm from beam! LHCb VELO Upgrade Closest LHC detector to the beam Currently 21 perpendicular two sided strip planes Upgrade to strip or pixel system Upgraded device must withstand 0.8x1016 neq (400 MRad TID) silicon edge just 7 mm from beam!

Potential Module Design Silicon (1-3 pieces) 55x55 mm pixels, 800 mm pixels in areas under chip periphery Diamond thermal plane with cutouts immediately above TSV regions 10 Timepix chips (periphery indicated in white) Cooling channel Power strips and signal routing area With a Pixel VELO we can have a low scattering module with high resolution and no strip detector ambiguities

Prototype Strip Developments Prototype Strip detectors with 40 MHz readout being built at USC with support from Glasgow Order being finalised with Hamamatsu for n-in-p prototypes These will need testbeam evaluation

Urgent and continuing testbeam needs Required to demonstrate suitability for tracking Measure efficiency and resolution Provide information for VELOPIX design 3 testbeams at CERN SPS with 120GeV Pions June: as Medipix Group to test Telescope concept July: Running parasitically from CMS SiBit telescope August: Running parasitically from EUDET/LCFI testbeam Significant improvements to telescope design at each testbeam

Timepix Telescope 4 Timepix, 2 Medipix planes in telescope Symmetric positioning of planes around Timepix DUT Telescope planes mounted at nine degrees in x and y DUT position and angle controlled remotely by stepper motors Measurements of resolution with angle, threshold, sensor bias, 3D sensor and timewalk

Angled Planes to Boost Resolution Hits that only affect one pixel have limited resolution (30um pixel region) Angling the sensor means all tracks charge share and use the ToT information 55um 300um 10o Timepix (ToT) tracked position vs cluster reconstructed position

Results – Resolution Vs Track Angle Rotation about Y axis 2.5um Estimated track contribution to residual PRELIMINARY: UNCALIBRATED DATA!! The tracking uncertainty of the telescope around 2 um (and falling) 40 million tracks acquired during 2 weeks running

Results – 3D Sensors Efficiency Glasgow double sided CNM sensor Perpendicular particles passing through a doped hole will deposit less charge in the silicon The sub-pixel resolution of the telescope allows us to see the efficiency losses due to the anode and cathode holes in the silicon. Special acknowledgement to Marco Gersabeck who produced this plot and the 3D group at Glasgow who provided the sensor

Next step: incorporate new readout system high REsolution Large Area X-ray Detector Designed to tile large areas, currently PAN and NIKHEF flavors due to parallel FPGA development ~0.15 kHz readout over ethernet 75,000 tracks per second very reasonable goal for telescope Prototype (PAN) already functional, final delivery ~6 months

Upgraded Timepix Telescope Proposal New Readout New Readout Timing Unit Timing Signals collected by a timing unit provide flexible software synchronisation LHC readout board Telescope arms and timing unit read back to PC via Ethernet or USB 2.0

New ‘Single’ PCBs Data IO – Backward compatibility with current chipboards Serial IO – connecting boards as a ‘quad’ to be read out together Sensor Bias – moved to a more convenient place On board voltage regulators to ensure stable operation Sutter Output – An easy connector for monitoring and measuring the actual shutter signal Cutout behind chip to reduce scattering Mounting Holes to accurately position chipboard Chip positioning guides to ensure accurate mounting

Match to AIDA proposal The telescope is designed for a staged implementation. The first stage upgrade will build on what was achieved in the summer. The main characteristics are First Stage Time stamping to 1ns Track extrapolation precision to ~ 1 micron data rates up to 75,000 tracks per second Automatic integration for testing of 40 MHz electronics Sensitive area 1.4x1.4 cm Second Stage Time stamping to 50-100 ps Increase x 4 active area

Match to AIDA Proposal The deliverable: Standalone telescope arms available on short timescale Ethernet readout capable of independent operation At a later stage Control and timing unit to synchronise with DUT, scintillators, etc. Cheap system designed for testing of 40 MHz electronics Efficiency and resolution key primary goals Guarantee that the DUT is live during the telescope readout (this was a headache for the EUDET system) Resolution is suitable for LHC needs Telescope would be CERN based, but available to test any system successfully used at SPS already available for FEI4 testing, strips etc. Readout software based on PIXELMAN plus plugins Very intuitive and easy use Compatible with future EUDET integration

Complementarity to EUDET Timepix arm can be eventually integrated with EUDET Development is ~ 15 months and a rough estimate, once the system is designed and built, to reproduce each arm is CHF 20,000 Staged development means that telescope arms will be continuously available from now to completion Builds gradually on previous success Support required for development of key items New PCB Timing and control unit mechanics Software (~ 3 months) Plugs the gap between what is needed in the immediate future for LHC prototyping and the final EUDET implementation, which also includes ILC requirements