LOI Backup Document: R&D Feb Stave Mtg 2012

Topics Overview of systems needs for R&D: The R&D needed for the tracker falls into a number of broad categories, detailed below. Mechanical: The basic element of the tracker is a stave, built up from a thermo-mechanical stave core. The stave core is composed of various carbon based materials, adhesives, and cooling structures. These materials and their fabrication and assembly is an R&D topic. The staves are mounted on light carbon fiber barrels, also a topic of R&D. Sensors: This covers the design of prototyping of silicon strip sensors. Cooling: This covers the basic cooling system, cooling plant, and requirement. Electrical: This covers the FEE, hybrids, modules, and data transmission within the stave. Powering: This covers the alternative powering schemes, serial and DC-DC, and their control, monitoring, and power protection aspects. This also covers the HV distribution and monitoring within the stave. Services: This covers all the off-stave services, in particular optical vs copper, cable plant and cable use/re-use scenarios, and coolant distribution. Assembly: This covers the processes for manufacturing during production including hybrids, modules, cores, flex, staves, and module mounting. Alignment: This covers mechanical alignment and monitoring with is not part of the assembly process. Trigger: This covers the application of the stave tracker to a Level 1 track trigger.

Ongoing Status Reports Stave Core Fabrication: Tim Jones and David Lynn Petal Core Fabrication: Carlos Lacasta Mechanical Bus Co-Cure: Georg Viehhauser and Carl Haber Supermodule Mechanics: Frank Cadoux DECLINED P-type Sensor Development: Nobu Unno, Hartmut Sadrozinski Cooling Studies: Georg Viehhauser Development of the ABC-next 130 nm Chip: Francis Anghinolfi Development of the Hybrid Controller Chip: Mitch Newcomer DONE Development of the SPP Serial Powering Chip: Mitch Newcomer Development of the DC-DC Conversion ASIC and PCB Package: Georges Blanchot Hybrid: Ashley Greenall Module: Tony Affolder Stavelet Test Program: Peter Phillips Petal Electrical Program: Ingrid Gregor Supermodule Electrical Test Program: Didier Ferrere DECLINED Digital Data Transmission on the Stave and the BCC Chip: Carl Haber DONE Power Protection and Serial Powering: David Lynn and Mitch Newcomer DONE Cabling and Services Survey and Analysis: Sergio Diez Cornell Hybrid Assembly Process: Ashley Greenall Module Assembly Process: Tony Affolder Stave Mounting Process: Martin Gibson DONE Low Mass Tape Development: Tony Weidberg DONE HSIO Data Acquisition System: David Nelson and Carl Haber Alignment R&D: Richard Nickerson Level-1 Track Trigger R&D ROI based: NEED Author Level-1 Track Trigger R&D Self Seeded: Maurice Garcia-Sciveres

Pending R&D Needs HV Multiplexing: David Lynn DONE Additional Cabling Studies: Sergio Diez-Cornell Optical Data Transmission to the Stave: Tony Weidberg The Petlet Program: Ingrid Gregor Application of the RCE system to stave DAQ Su Dong