Electronic Assembly Quality and Standards

Simplified Comparison of Thru Hole and SMT PCB Assembly Process Component Procure Setup Substrate (Fab) Fabrication Fab, Comp Prep Bake, Clean Simplified Comparison of Thru Hole and SMT PCB Assembly Process Thru Hole Mechanical Hand Operations SMT Auto Component Insertion Screen Solder Paste Wave Solder Auto Component Placement Vision System Inspection Lead Trim Reflow Solder (Oven) Stresses and Test Processes Vision/Xray System Inspection

Typical SMT Complex Circuit Board Assembly Processes Setup Screen Print SMT Placement Reflow Hand Assembly Wave Solder Final Assembly Wash In Circuit Test Stress Screen Functional Test Pack / Ship Typical SMT Complex Circuit Board Assembly Processes

Solder Geometry Variability in SMT and THT

IPC = Institute of Printed Circuits, WWW. IPC IPC = Institute of Printed Circuits, WWW.IPC.ORG Association Connecting Electronics Industries IPC-A-610 Acceptability of Electronic Assemblies IPC-6011 Series of Board PCB Performance Standards IPC/EIA J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies IPC-7095 Design and Assembly Process Implementation for BGAs IPC-2221 Generic Std for Printed Board Design IPC-D-279 Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies Quality!

IPC Electronic Assembly Classifications High Reliability Electronic Products: Continued performance, performance on demand, and extended life is critical and equipment downtime cannot be tolerated. Equipment must function when required with a high level of reliability assurance. End-use environment is harsh Includes equipment for commercial, military products, and for such applications as life support or missile systems. Dedicated Service Electronic Products: Continued performance, extended life and uninterrupted service is desired but not critical. Typically the end-use environment would not cause failures Includes communications equipment, sophisticated business machines, instruments and military equipment General Electronic Products: Function of the completed assembly is the major requirement Cosmetic imperfections are not important Includes consumer, some computer, peripherals, general military HW Aerospace, Military 10 Yr Stresses # of Bds, # of solder joints # of Mechanical Cycles 4# of Power Cycles # of Therm Cycles, Excursion PROCESS CONTROL – PROCESS QUALITY Ref: IPC-A-610, IPC-JSTD-001, IPC-7095 Telecom & Certain Medical