Date of download: 1/1/2018 Copyright © ASME. All rights reserved. From: The Effects of Temperature Cyclic Loading on Lead-Free Solder Joints of Wafer Level Chip Scale Package by Taguchi Method J. Electron. Packag. 2008;130(1):011001-011001-10. doi:10.1115/1.2837508 Figure Legend: The dimension and schematic of a chip model on WLCSP

Date of download: 1/1/2018 Copyright © ASME. All rights reserved. From: The Effects of Temperature Cyclic Loading on Lead-Free Solder Joints of Wafer Level Chip Scale Package by Taguchi Method J. Electron. Packag. 2008;130(1):011001-011001-10. doi:10.1115/1.2837508 Figure Legend: Analytic setting of 16 different temperature cyclic loadings for the L16-orthogonal arrays

Date of download: 1/1/2018 Copyright © ASME. All rights reserved. From: The Effects of Temperature Cyclic Loading on Lead-Free Solder Joints of Wafer Level Chip Scale Package by Taguchi Method J. Electron. Packag. 2008;130(1):011001-011001-10. doi:10.1115/1.2837508 Figure Legend: Temperature cyclic loading for the verification of models

Date of download: 1/1/2018 Copyright © ASME. All rights reserved. From: The Effects of Temperature Cyclic Loading on Lead-Free Solder Joints of Wafer Level Chip Scale Package by Taguchi Method J. Electron. Packag. 2008;130(1):011001-011001-10. doi:10.1115/1.2837508 Figure Legend: Elapsed CPU time and shear creep strain range of various simplified models

Date of download: 1/1/2018 Copyright © ASME. All rights reserved. From: The Effects of Temperature Cyclic Loading on Lead-Free Solder Joints of Wafer Level Chip Scale Package by Taguchi Method J. Electron. Packag. 2008;130(1):011001-011001-10. doi:10.1115/1.2837508 Figure Legend: S∕N response chart for five factors in the creep, plastic, and plastic-creep analyses, respectively