Date of download: 1/2/2018 Copyright © ASME. All rights reserved. From: Development of a Fused Deposition Modeling System for Low Melting Temperature Metal Alloys J. Electron. Packag. 2013;135(1):011008-011008-6. doi:10.1115/1.4007160 Figure Legend: Schematic of liquefier used for FDM

Date of download: 1/2/2018 Copyright © ASME. All rights reserved. From: Development of a Fused Deposition Modeling System for Low Melting Temperature Metal Alloys J. Electron. Packag. 2013;135(1):011008-011008-6. doi:10.1115/1.4007160 Figure Legend: Execution of main ACL commands

Date of download: 1/2/2018 Copyright © ASME. All rights reserved. From: Development of a Fused Deposition Modeling System for Low Melting Temperature Metal Alloys J. Electron. Packag. 2013;135(1):011008-011008-6. doi:10.1115/1.4007160 Figure Legend: Two-dimensional deposition (a) fused deposition of non-eutectic Sn–Bi solder lines, (b) design of circuit pattern, (c) fused deposition of non-eutectic Sn–Bi circuit pattern, (d) pattern built using eutectic Sn–Bi, and (e) pattern built using non-eutectic Sn–Bi

Date of download: 1/2/2018 Copyright © ASME. All rights reserved. From: Development of a Fused Deposition Modeling System for Low Melting Temperature Metal Alloys J. Electron. Packag. 2013;135(1):011008-011008-6. doi:10.1115/1.4007160 Figure Legend: Multilayer deposition of Sn–Bi (a) multilayer line and (b) 360× optical image of stacked layers that were polished and etched (interface is highlighted with arrows)

Date of download: 1/2/2018 Copyright © ASME. All rights reserved. From: Development of a Fused Deposition Modeling System for Low Melting Temperature Metal Alloys J. Electron. Packag. 2013;135(1):011008-011008-6. doi:10.1115/1.4007160 Figure Legend: Deposition of Sn–Bi via FDMm into 3D vias