Date of download: 1/3/2018 Copyright © ASME. All rights reserved. From: Prediction of Wire Sweep During the Encapsulation of IC Packaging With Wire Density Effect J. Electron. Packag. 2004;127(3):335-339. doi:10.1115/1.1939028 Figure Legend: Flowchart of wire sweep analysis
Date of download: 1/3/2018 Copyright © ASME. All rights reserved. From: Prediction of Wire Sweep During the Encapsulation of IC Packaging With Wire Density Effect J. Electron. Packag. 2004;127(3):335-339. doi:10.1115/1.1939028 Figure Legend: Outline of TSOP II 40∕44L and wire locations
Date of download: 1/3/2018 Copyright © ASME. All rights reserved. From: Prediction of Wire Sweep During the Encapsulation of IC Packaging With Wire Density Effect J. Electron. Packag. 2004;127(3):335-339. doi:10.1115/1.1939028 Figure Legend: Illustration of element extrusion. The left panel shows the original 2D mesh and the extruded 3D mesh is shown in right panel.
Date of download: 1/3/2018 Copyright © ASME. All rights reserved. From: Prediction of Wire Sweep During the Encapsulation of IC Packaging With Wire Density Effect J. Electron. Packag. 2004;127(3):335-339. doi:10.1115/1.1939028 Figure Legend: Mesh is refined around the projected area containing wires
Date of download: 1/3/2018 Copyright © ASME. All rights reserved. From: Prediction of Wire Sweep During the Encapsulation of IC Packaging With Wire Density Effect J. Electron. Packag. 2004;127(3):335-339. doi:10.1115/1.1939028 Figure Legend: Outlines of the mesh models for mold-filling analysis
Date of download: 1/3/2018 Copyright © ASME. All rights reserved. From: Prediction of Wire Sweep During the Encapsulation of IC Packaging With Wire Density Effect J. Electron. Packag. 2004;127(3):335-339. doi:10.1115/1.1939028 Figure Legend: Melt front of mold-filling analysis with and without accounting for wire density effect. Deeper color lines indicate the results from the simulation that accounts for the wire density effect, and the lighter color lines indicate the results from the simulation that does not account for the wire density effect.
Date of download: 1/3/2018 Copyright © ASME. All rights reserved. From: Prediction of Wire Sweep During the Encapsulation of IC Packaging With Wire Density Effect J. Electron. Packag. 2004;127(3):335-339. doi:10.1115/1.1939028 Figure Legend: Illustration of extraction of mold-filling results
Date of download: 1/3/2018 Copyright © ASME. All rights reserved. From: Prediction of Wire Sweep During the Encapsulation of IC Packaging With Wire Density Effect J. Electron. Packag. 2004;127(3):335-339. doi:10.1115/1.1939028 Figure Legend: Comparison of the wire sweep indices between computational and experimental results