LHCb Upgrade Chris Parkes Stefano de Capua May 17, 2013

Pixel Prototype Make a mechanical prototype of a pixel module0 for testing mechanical stability/stiffness + cooling properties with a dummy sensor, dummy chips and a resistor. May 17, 2013 Stefano de Capua

silicon/silicon bonding Components The substrate is made of carbon foam encapsulated in carbon fibre. 200 mm thick silicon for both the sensor and the chips. Kapton/Copper heaters from Tony. Carbon foam (allcomp) 5 mm Tc = 70 Wm-1K-1 (isotropic) Carbon Fiber 150 mm Tc = (297, 140, 1.29) Wm-1K-1 Silicon sensors 44.0 x 14.6 x 0.2 mm3 Silicon chips 16.1 x 14.1 x 0.2 mm3 Epolite FH-5313 Epoxy silicon/silicon bonding Tc = 0.28 Wm-1K-1 DowCorning SE4445 CV silicon/CF bonding Tc = 1.34 Wm-1K-1 Hysol EA9396 C fibre/foam bonding Tc = 0.21 Wm-1K-1 Epoxy glue for PT sensors Tc = 0.84 Wm-1K-1 25 chips (1x) May 17, 2013 Stefano de Capua

Scheme sensor epolite fh5313 heater epolite fh5313 chip chip chip dowcorning se4445 carbon fibre hysol ea9396 carbon foam hysol ea9396 carbon fibre May 17, 2013 Stefano de Capua

May 17, 2013 Stefano de Capua

FPGA Processing Simon is working on data processing for pixel sensors in FPGAs Work completed so far – compile EPFL prototype and show fits in proposed FPGA Next steps: develop API, implements time-descrambling of packets Partner on VELO algorithms is AGH-Krakow May 17, 2013 Stefano de Capua

FPGA Processing Simon is working on data processing for pixel sensors in FPGAs Work completed so far – compile EPFL prototype and show fits in proposed FPGA Next steps: develop API, implements time-descrambling of packets Partner on VELO algorithms is AGH-Krakow May 17, 2013 Stefano de Capua

Software Tom Bird (student) has optimised pixel layout