From Sand to Electronics

Content What We Do at ON Semiconductor About Semiconductors Inside an Electronic Device Inside a Semiconductor Component About Silicon How an Electronic Device is Made Semiconductor Components Manufacturing Process

ON Semiconductor

About Semiconductors Since their industrial conception in 1959 semiconductors have been responsible for reshaping the world we live in - let us imagine a car. Power Seat Audio System Telematics Air Bag Instrument Cluster Active Suspension Electronic Power Steering ABS/ Traction Retractable Headlamps Body Control Climate Control Engine Control Occupant Sensor Power-train Control All around us in our day-to-day life we are surrounded by devices and equipment which use semiconductors to enable them to function.

Inside an Electronic Device There is a board with many various, differently shaped, components assembled on its surface. Similar components are in all electronic devices which enable them to function ... televisions, play stations, radios, walkmans, stereos, CD players, tape recorders, internet devices, ISDN, phones, cars, planes, ships, trains, the space shuttle, washing machines, microwaves, dishwashers ...

... and the smaller ones are Discrete Components. Inside a Computer There are similar components inside a computer too. The black boxes are Integrated Circuits ... ... and the smaller ones are Discrete Components.

Inside a Semiconductor Component A Semiconductor Component can look like a bug with a black body and silver-coloured legs. But when the black body is removed a small piece of matter connected by thin wires with the legs is visible. This small piece of matter is called a chip. When enlarged, a structure like a city map, can be found on its surface.

On the Chip Surface All the components of an electronic circuit are matched - integrated - into one chip. This is why the final device is called integrated circuit.

Under the Chip Surface The integrated circuit structure is created in a very complicated way, in dozens of technological steps. passivation emitter base field oxide metallization collector epitaxial layer buried layer interconnection insulation buried layer substrate

Thus how it originated? How It Originates Here in few seconds. Actually it takes hundreds of hours and the real structure is even more complicated.

Level of Integration Even the magnifying glass does not show all the details. The structure on a chip, like a processor in a computer, is very complex. The basic material the most chips are made from is silicon.

14Si 28,0885 Silicon Silicon 2,33 g/cm3 Silicon is a chemical element from the group IV in the Periodic table. a = 0,543 nm The basis of a silicon crystallographic structure is a cube with atoms in its vertices and in the wall centers. 28,0885 14Si 2,33 g/cm3 Silicon Silicon has appropriate properties for semiconductor chips only when the atoms in the whole volume of the chip are arranged exactly according to this structure. Such and arrangement is called single crystal.

Inside the Silicon Single Crystal

beginning of the process How an Electronic Device is Made There is a simple substance - sand at the beginning of the process

transformed to raw silicon using a chemical process How an Electronic Device is Made The sand is transformed to raw silicon using a chemical process

a silicon wafer, is made next How an Electronic Device is Made A slice of extremely clean silicon, called a silicon wafer, is made next

of the silicon wafer and under How an Electronic Device is Made Many chips are formed on the top of the silicon wafer and under it´s surface

then separated into chips, which are then assembled How an Electronic Device is Made The silicon wafer is then separated into chips, which are then assembled into components

the printed circuit board How an Electronic Device is Made The components are assembled together on a board called the printed circuit board

Several printed circuit How an Electronic Device is Made Several printed circuit boards are connected together to make e.g. a computer

ON Semiconductor Process ON Semiconductor manufacturing process shown in the green rectangle is a significant part of this Value Chain. Semiconductor components are the major part of each electronic device. Semiconductor Components Products for our Customers Raw Silicon Input Material 1st Phase: Silicon Wafer 2nd Phase: Chips 3rd Phase: Components

operate simple functions for wide range of various applications ON Semiconductor Products Discrete Components operate simple functions for wide range of various applications Integrated Circuits operate complex and sophisticated functions for particular applications

How We Make Them 1st Phase: Silicon Wafer Raw silicon is the input material A round shaped ingot is pulled from molten raw silicon This video clip demonstrates the silicon wafer manufacturing process (click on) A slice - silicon wafer - is sawn from the silicon ingot The silicon wafer is cleaned and polished to a mirror like shine The silicon wafer is shipped to be processed next

How We Make Them 2nd Phase: Chips Silicon wafer is the input material Thin films of various materials are grown on the wafer surface This video clip demonstrates the thin film growing processes (click on)

How We Make Them 2nd Phase: Chips Silicon wafer is the input material Thin films of various materials are grown on the wafer surface This video clip demonstrates the photolithography and etching (click on) The chip structure is formed by a photo-chemical process. This repeats several times.

How We Make Them 2nd Phase: Chips Silicon wafer is the input material Thin films of various materials are grown on the wafer surface This video clip demonstrates testing the finished chips on wafer (click on) The chip structure is formed by a photo-chemical process. This repeats several times. Each chip is tested to the device specification The processed silicon wafer with the chips is shipped to the next manufacturing step

This video clip demonstrates silicon wafer sawing (click on) How We Make Them 3rd Phase: Components The silicon wafer with chips is the input material The wafer is divided up into individual chips by a sawing process This video clip demonstrates silicon wafer sawing (click on)

How We Make Them 3rd Phase: Components The silicon wafer with chips is the input material The wafer is divided up into individual chips by a sawing process This video clip demonstrates a particular component assembly (click on) The chips are bonded onto a leadframe and the leads are connected The bonded chips are then moulded into a protective case After testing and marking the finished components are shipped to the customer

This video clip demonstrates people behavior in clean rooms (click on) Where We Make the Components This video clip demonstrates people behavior in clean rooms (click on) Even such a small particle like a grain of dust, can destroy the semiconductor component when landing on it during the manufacturing process. Our products have to be manufactured in extremely clean areas and the people working there have to follow specific rules to keep the cleanliness. The human hair is so large, compared with chip structures, it can damage the chip totally when falling on it.

Just a small Grain of Dust ...

... a Big Challenge for All of Us www The Future ... chat e-mail mp3 There is no going back today and tomorrow our world and life will depend on semiconductors more and more. ... a Big Challenge for All of Us

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