Materials R. Bates et al.

K of PocoFoam under shear strength PocoFoam conductivity ~10% of total sandwich Sample broke at 0.88 MPa Increase in Poco (plus glue joints) of 38% ANSYS implies max stress in foam of 0.47 MPa Property Tensile (MPa) Shear (MPa Yield Strength 0.6 0.5 Ultimate strength 0.8 0.78 Breaking strength 0.86 0.88 Shear (MPa) Total Resistance (K/W) Foam resistance (K/W) Increase in resistance 4.9 0.42 0.5 4.97 0.49 17% 0.78 5.06 0.58 38% New tests of samples with higher sensitivity (Poco~30%) gave similar results

Hysol with BN Samples made with BN + vacuum + Degassing agent Arrived at Glasgow today from RAL Need to order more BN to continue these studies, including wetting agents BN from Momentive not arrived Need to chase SSC – groan! Poco to S/S glue joint Glasgow making simple flat samples – measure joint conductivity at QMU Pipe to poco samples – understand if possible to measure contact with a transient technique.

Poco Modelling Matlab code to generate a bubble material Imported into Solidworks to generate a CAD item Imported into Ansys for thermal/mechanical modelling However, Poco informed us that they have discontinued production! Should concentrate efforts on Allcomp materials – have some models from Ryan Page

Glue Module to bus/stave Creep tests modules to Bus/Stave Initial tests performed with DMA Input required to understand shear force that might occur Modelling work from Richard Bennett for this Alternative glue? Need to be able to remove a module from a stave Need to make a test procedure to quantify ability to remove module from stave Thermal conductivity of Intertronics IRS 2125 soon

Other Mechanical measurements CFPR stress/strain relationship under tension Measure with strain gauges to yield New CFPR sample from Tim arrived at RAL Bend tests of corrugated samples New samples from Georg tested. Results to be presented at Monday meeting

Radiation studies Tim put in mechanical parts before Easter Testing over summer? Should irradiated any new glue or glue additive