SPM® 55 Module for Home Appliances Motion Control System Team June 2014

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SPM 55 Series Key features Leading Edge IGBT /Diode *SC rated FieldStop Trench IGBT Interlock / Shoot Through Protect *Arm Short protection fn. in 6-in-1 HVIC Outstanding ruggedness *SCWT > 15μs @normal / 5μs @worst mfg. Convenience *One side full circle locking hole Thermal detecting fn. *TSU/TSD function in LVIC Application optimized product lineup *Low VCE_SAT ver. / Low EOFF ver.

Introduction Circuit Diagram & Product Lineup Key Features Advanced FieldStop Trench IGBT Low Conduction Loss: Vce_sat 1.55 V typ.(normal ver.), 2.0 V typ.(fast ver.) Low Switching Loss: Eoff <30 μJ/A(normal ver.), <15 μJ/A(fast ver.) Superior Ruggedness: SCWT >15 μs @normal, >5 μs @worst Protection Functions Under-Voltage Lock Out for high-side & low-side Over-current & Short-circuit current protection Shoot-through protection(Interlock) function Thermal monitoring: TSU(Thermal Sensing Unit) function & TSD External Shutdown input function Better Reliability New 6-in-1 Gate Drive IC design for higher Noise, Surge immunity Meet ESD rating requirement: HBM 2 kV, CDM 500 V Design Convenience One side full circle screw mounting hole No side dummy pin for easier heatsink design Rating fSW > 10 KHz fSW < 10 KHz 600 V/ 5 A FNB50560T1 FNA50560T1 600 V/ 10 A FNB51060T1 FNA51060T3 600 V/ 15 A FNB51560T1 FNA51560T3

Package Design Two lead length option for different applications Package Size : 37.0 mm x 21.0 mm x 3.5 mm, Lead Count : 20 Leads Lead to Heat Sink Distance : 1.55 mm Zig-zag signal pin lay-out : to prevent lead short(solder bridge) during wave soldering process VS. Half circle Short Lead Option 9.50 mm Long Lead Option 14.00 mm One side closed locking hole : to make easy screw joining on board @heatsink mounting process

Interlock Function Shoot-through Protection [Timing Chart for inter-lock] Note 1 : LS-FIFO mode is the complementary operation of HS-FIFO mode. Note 2 : HS-noise mode is the complementary operation of LS-noise mode.

Fault-out pin function #17 Bi-directional multi-function Pin [Gate Drive IC Internal Block Diagram] Thermal Sensing Unit in 6-in-1 HVIC System fault out (FO) : OCP, TSD System Shutdown input from MCU System Shutdown MCU System fault out (FO) Thermal information Multi fn. Pin ; VF(#17)

Fault-out pin function Operating behavior Normal mode & TSD *Thermal Sensing Fault Out by false *Under Voltage Over current System Shut-down *Signal from MCU Stop operation by ‘0’ V input from external MCU Motor Out Return to driv Driving Triggering TSD @150℃ IC temp. Touch TSD level False Operation *UV,OC,IL Return to normal [V] FO pin Threshold 1.4 V typ. Release 2.0 V typ. Releasing TSD @140℃ IC temp.

Pseudo NTC function [ Fig.1 THVIC vs. VF as pull-up voltage VF [V] THVIC [ºC] THVIC [ºC] THVIC [ºC] [ Fig.1 THVIC vs. VF as pull-up voltage @ 4.7 kΩ of pull up resistor] [ Fig.2 THVIC vs. VF as pull-up resistor @ 5 V of pull up voltage] [ Fig.3 THVIC vs. VF as pull-up resistor @ 3.3 V of pull up voltage] Pseudo NTC is connected with shut-down input and pull-up resistance should be selected considering of HVIC temperature, because threshold voltage of shut-down input is tpy. 1.4 V. Therefore the recommended pull-up resistance is 4.7 kohm for 5 V pull-up and 3.3 kohm for 3.3 V pull-up voltage.

New FieldStop Trench IGBT Performance PT Planar Gate Emitter N+ P-base P-collector Collector P-base N+ Gate Emitter P-collector Collector NPT Planar Trench FS Trench *SPM3 V2 Series *SPM45 V1 Series / SPM3 V4 Series NPT Trench (~75 um) *SPM45 V3 Series / SPM 55 Series NPT Planar(~97 um) [IGBT Trade-off Curve]

New FieldStop Trench IGBT Short Circuit Ruggedness Test conditions : Vdc=450 V, Vcc=20 V, Tj=150degC Result : min. 6.4 us [FNB51060T Short Circuit Withstanding Time result] No. VDC[V] VDD[V] FNB51060T Imax [A] Imin [A] tsc [us] #1 300 15 36.4 26.4 16.2 16.4 #2 400 38.0 27.2 10.6 10.8 #3 16.5 46.4 35.6 7.8 25.6 8.0 Tsc=6.4 us [Fairchild SPM® 55 module SCWT @ Worst case]

Comparison data Overview SPM 55 Module vs. Competitor A Item SPM 55 Module FNB51060T (10 A fast ver.) Competitor A Sxxxxx10K60A (10 A) Note Size/Pin count 21 x 37 / 20pin 22 x 44.4 / 25pin VCE_SAT [V] @Ic 10 A, Tj 25℃ 2.0 V 2.7 V EOFF [uJ] 15 μJ /A 30 μJ /A Total Power Loss One module based @Ic=3.0 Arms 20.0 W 22.7 W VDC=300 V, VCC=15 V, FSW=16 kHz, MI=0.8, PF=0.9, SVPWM, Tj=125℃ SCWT (Short-Circuit Withstand time) >15 μs @normal >7 μs @worst 5.5 μs @normal 4 μs @worst Normal: VDC 300 V, VDD 15 V Worst: VDC 400 V, VDD 16.5 V Interlock function O Substrate / (Thermal resistance) Full mold / (*5.0℃/W) DBC (3.8℃/W) Thermal Sensing Pseudo NTC on Gate Drive IC NTC on Inner PCB

Comparison data Real Load Test SPM 55 Module vs. S-company Test Bench Condition IOUT waveform SPM55(FNB51060T) S-company(Sxxxxx10K60A) IOUT=3.0 Arms VDC=300 V, VCC=15 V, FSW=16 kHz, Tdead=1.5 μs IOUT=3.2 Arms VDC=300 V, VCC=15 V, FSW=16 kHz, Tdead=1.5 μs Heat-sink & DUT IOUT [Arms] FNB51060T Sxxxxx10K60A 3.0 Arms TA [℃] 28.1 28.2 TH [℃] 86.5 90 ΔT [℃] 58.4 61.8 3.2 Arms 27.3 26.1 90.9 93.3 63.6 67.2

Schedule Sample Plan & Target Release Schedule Sample & Code S Release Plan FSID Description Q2 2014 Q3 2014 Q4 2014 P4 P5 P6 P7 P8 P9 P10 P11 P12 FNB50560T1 5 A Fast ER CS Code S FNA50560T1 5 A Normal FNA50560T3K 5 A High Performance FNB51060T1 10 A Fast FNB51560T1 15 A Fast Code S　 FNA51060T3 10 A Normal FNA51560T3 15 A Normal vehicle product

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