www.etienne-sicard.fr > Teaching > EMC of ICs Electromagnetic compatibility of Integrated Circuits Etienne SICARD INSA/DGEI University of Toulouse 31077 Toulouse - France Etienne.sicard@insa-toulouse.fr Alexandre BOYER INSA/DGEI – LAAS-CNRS University of Toulouse 31077 Toulouse - France Alexandre.boyer@insa-toulouse.fr www.etienne-sicard.fr > Teaching > EMC of ICs Sept. 2016 September 18

Objectives Through lectures (12 H) Through practical training (16 H) Understand parasitic emission mechanisms Introduce parasitic emission reduction strategies Give an overview of emission and susceptibility measurement standards Power Decoupling Network modelling Basis of conducted and radiated emission modelling Basis of immunity modelling Understand the role of decoupling at printed-circuit-board level Acquire basic knowledge of design for improved EMC at PCB and IC level Through practical training (16 H) Illustrate basic concepts through simulation IC modeling case study Evaluation based on report September 18

July 2017, St Petersburg, Russia References Books Freeware Workshops July 2017, St Petersburg, Russia www.springeronline.com www.ic-emc.org www.emccompo.org Standards www.iec.ch IEC 61967, 2001, Integrated Circuits Emissions IEC 62132, 2003, Integrated circuits Immunity IEC 62433, 2008, Integrated Circuit Model September 18

1. EMC of ICs An overview

Outlines Electronic Market Growth Electromagnetic interference What is EMC EMC at IC level Origin of parasitic emission Trends towards higher emission Origin on susceptibility Emission issues Susceptibility issues Standardization issues Conclusion September 18

Electronic Market Growth Individuals 30% Companies 4G IoT ADAS PC at home Internet GSM MP3 DVD Flat screens Automotive HDTV 3G Society 20% PC in companies Audio CD Defense Local Energy Security Medical 3% 2014 4% 2017 10% Recession Bank crash 2% 2013 3% 2015 Recession -10% Telecom crash 83 86 89 92 95 98 01 04 07 10 13 16 Year Adapted from Electronique International Mai 21, 2009 September 18

Electronic Market Growth Vision 2020 Increasing disposable income, expanding urban population, growing internet penetration and availability of strong distribution network Share of system sales 2020 vs 2015 Smartphones PC TV Automotive Tablets Internet of Things Game consoles Medical Servers -10% 10% 20% Growth September 18

Mobile Business We are here 7.8 billion 4G 3G 2G http://www.ericsson.com/ericsson-mobility-report

Internet of Things

Automatic Drive 2020 : Injury-free driving TOWARDS AUTOMATIC DRIVE 2020 : Injury-free driving 2030: Accident-free driving ? 2040: Autonomous driving?

Electromagnetic Interference EMI ISSUES IN WIRELESS DEVICES Numerous interference cases reported over the ISM band 2400 – 2483.5 MHz. From Cisco, « 20 Myths of WiFi Interference », White Paper, 2008: “Interference contributes to 50 % of the problems on the customer’s Wi-Fi network. “ “In a recent survey of 300 of their customers, a major Wi-Fi tools provider reported that “troubleshooting interference won ‘top honors’ as the biggest challenge in managing a Wi-Fi network.”” “67 percent of all residential Wi-Fi problems are linked to interfering devices, such as cordless phones, baby monitors, and microwave ovens.” “At 8m, a microwave oven degrades data throughput by 64%.”

Electromagnetic Interference EMI ISSUES IN MEDICAL DEVICES Interference Technology – June 2015 “Pacemakers can mistakenly detect electromagnetic interference (EMI) from smartphones as a cardiac signal, causing them to briefly stop working. This leads to a pause in the cardiac rhythm of the pacing dependent patient and may result in syncope.” Dr. Lennerz “For implantable cardioverter defibrillators (ICDs) the external signal mimics a life threatening ventricular tachyarrhythmia, leading the ICD to deliver a painful shock” Dr. Lennerz http://www.interferencetechnology.com September 18

Electromagnetic Interference EMI ISSUES IN MEDICAL DEVICES Interference Technology – March 2014 Electromagnetic radiation from portable suction devices could interfere with some defibrillators, rendering them inoperable in a medical emergency. Philips HeartStart MRx defibrillators are known to fail without warning during battery power operation if subjected to high electromagnetic interference (EMI). Laerdal LSU 4000 portable suction units emitted EMI with field strengths up to 180 V/m, put the defibrillators at risk for malfunction.

Electromagnetic Interference EMI ISSUES IN AUTOMOTIVE http://www.interferencetechnology.com Interference Technology – March 2014 The National Highway Traffic Safety Administration (NHTSA) said in documents filed on June 2 that it had opened a query into a 2012 recall for 744,822 Jeep Liberty SUVs [..] the air bag squib filter circuitry inside the vehicle’s Occupant Restraint Control (ORC) module is susceptible to degradation. ORC degradation can result in an inadvertent air bag deployment (IABD) while the vehicle is in operation, potentially leading to injuries such as burns, cuts and bruises…

Electromagnetic Interference EMI ISSUES IN AUTOMOTIVE ADAS - Advanced Driver Assistance Systems Autonomous driving in 2030 Much more sensors, cameras, embedded calculators & security

Electromagnetic Interference EMI ISSUES IN AVIATION Interference Technology – January 2013 FAA said Wi-Fi systems may interfere with the Honeywell phase 3 display units aboard 157 Boeing airplanes in use by various U.S. airlines. These display units are critical for flight safety, providing crewmembers with information such as airspeed, altitude, heading, and pitch and roll [..] the issue was discovered two years ago during testing to certify a Wi-Fi system for use on Boeing 737 Next Generation.

Electromagnetic Interference EMI ISSUES IN AVIATION News Wind Turbines Could Cause EMI; Pose Danger to Vermont Airspace 11/24/2015 “According to a Notice of Presumed Hazard posted on the FAA’s website, the 499-foot-tall wind turbines proposed for Rocky Ridge in Swanton would have ‘an adverse physical or electromagnetic interference effect upon navigable airspace or air navigation facilities’” Vermont Watchdog.org reported. “The blades of the turbines would degrade radar used by Boston Center to regulate air traffic across New England states, New York and part of Pennsylvania,” Vermont Watchdog.org added.

What is EMC DEFINITION « The ability of a component, equipment or system to operate satisfyingly in a given electromagnetic environment, without introducing any harmful electromagnetic disturbances to all systems placed in this environment. » Essential constraint to ensure functional safety of electronic or electrical applications Guarantee the simultaneous operation of every electrical or electronic equipment in a given electromagnetic environment Reduce both the parasitic electromagnetic emission and the sensitivity or susceptibility to electromagnetic interferences.

EMC at IC level ZOOM AT DEVICES 10 mm 100 mm September 18

1 V 100 µA Integrated Circuits… 10µm 1mm 100 nm 1 µm © Intel Xeon September 18

EMC at IC level WHY EMC OF IC ? Until mid 90’s, IC designers had no consideration about EMC problems in their design.. Starting 1996, automotive customers started to select ICs on EMC criteria Starting 2005, mobile industry required EMC in System in package Massive 3D integration will require careful EMC design September 18

Crypto, sensor, position processor EMC at IC Level 14nm 2016 4G+ Today Octa Core Multi DSP 3D 4K Image Proc Crypto, sensor, position processor Agregated RF 2 Gb Memories 15G 5nm 150 G 2020 ? 5G Technology 130nm 90nm 45nm 28nm Complexity 250M 500M 2G 7G Packaging Mobile generation 3G 3G+ 4G 2004 2007 2010 2013 Core DSPs 10 Mb Mem Dual core Dual DSP RF Graphic Process. 100 Mb Mem Sensors Quad Core Quad DSP 3D Image Proc Crypto processor Reconf FPGA, Multi RF 1 Gb Memories Multi-sensors Embedded blocks

EMC at IC level INCREASED COMPLEXITY Technology 1st year of produc. External Supply (V) Internal supply (V) Max. Current (A) Gate density (K/mm2) SRAM area (µm2) Gate current (mA) Gate capa (fF) Typ gate delay (ps) 0.8 µm 1990 5 <1 15 80.0 0.9 40 180 0.5 µm 1993 3 28 40.0 0.75 30 130 0.35 µm 1995 3.3 12 50 20.0 0.6 25 100 0.25 µm 1997 2.5 90 10.0 0.4 20 75 0.18 µm 1999 1.8 160 5.0 0.3 0.12 µm 2001 1.2 150 240 2.4 0.2 10 35 90 nm 2004 1.0 186 480 1.4 0.1 7 65 nm 2006 236 900 0.07 22 45 nm 2008 283 2 000 0.35 0.05 18 32 nm 2010 290 3 500 0.20 0.04 14 28 nm 2012 1.5 300 4 800 0.15 0.03 2 20 nm 2014 0.8 8 000 0.10 0.02 8 14 nm 2016 350 15 000 0.015 6 10 nm 2018 30 000 0.011 4 7 nm 2020 0.5 50 000 0.008 Adapted from M. Ramdani E. Sicard, “The Electromagnetic Compatibility of Integrated Circuits—Past, Present, and Future”, IEEE Trans. EMC, VOL. 51, N. 1, Feb. 2009 September 18

EMC at IC Level TOWARDS 100 GIGA DEVICES 100,000,000,000 8-core µP = 2 GT Dual core µP+ cache = 100MT 32 bit µP :1MT 16 bit µP = 100 KT 8bit µP : 10 KT 2020

EMC at IC Level IMPORTANCE OF MEMORY 50% 20% 55% 35%

EMC at IC level TWO MAIN CONCEPTS Susceptibility to EM waves Emission of EM waves Carbon airplane Personnal entrainments Safety systems interferences Equipements Boards Susceptibility to radio frequency interference is illustrate in the case of a very high radar wave illuminating an airplane. This situation is very common at the proximity of airports. A Giga-watt pulse is received by the the plane, which captures some energy which may flow to the equipment, the board and finally to the component. On the other hand, the parasitic emission due to the integrated circuit inside a car may jeopardize the correct behavior of personal devices such as mobile phones, and RF links. In some case, the parasitic energy may be high enough to parasite the safety systems of the car. Radar Components Hardware fault Software failure Function Loss September 18

EMC at IC Level Radiation Coupling Emission Susceptibility THE ROLE OF ICS AS PERTURBATION SOURCE AND VICTIM Integrated circuits are the origin of parasitic emission and susceptibility to RF disturbances in electronic systems Emission Radiation Chip Components PCB System Noisy IC Interferences Sensitive IC Coupling Chip Components PCB System Susceptibility September 18

Origin of Parasitic Emission BASIC MECHANISMS FOR CURRENT SWITCHING VDD Switching current IDD Vin Voltage Time Output capa VSS ISS Time One of the major source of perturbation is the current flowing inside each elementary gate of the integrated circuit. Let us consider the CMOS inverter, supplied by a high voltage VDD (2V in 0.18µm) and ground VSS (0V). When the input falls to 0 (i.e logic level “0”), a current (around 0.5mA) charges the capacitance through the pull up device. When the input rises to 2V, that is a logic level “1”, a similar current flows through the pull down device and discharges the capacitance. CMOS inverter exemple Question: waveform, amplitude? September 18

Origin of Parasitic Emission CMOS INVERTER IN IC-EMC Waveforms strongly depend on load Switching current Voltage Time Time Basic > interconnects > GateSwitching.sch September 18

Origin of Parasitic Emission STRONGER SWITCHING CURRENT: i(t) Time 50ps i(t) Time Vdd i(t) Vss Internal switching current Switching gates Very large Simultaneous Switching Current Main transient current sources: Clock-driven blocks, synchronized logic Memory read/write/refresh I/O switching September 18

Origin of Parasitic Emission EXAMPLE: EVALUATION OF SWITCHING CURRENT ____ VDD, ___ technology ____ mA / gate in ____ ps ____ % is gate ____ gates in ____ Bit Micro => ____ A ____ % switching activity => ____ A ____ % current peak spread (non synchronous switching) ____ in ____ ps ____ Current (A) ____ ns time Vdd Vss i(t) Current / gate Current (A) ____ ns time Current / Ic ____ 0.1 ma/gate in 100 ps, 10 million (base band), 10 K(8bits), 100K (16 bits), 1M (32 bits). % switching activity = 10 %, /10 because spread current = 1 A peak sur 1 ns. 16 bits : 100 mA sur 1 ns, 32 bits = 1A 500 ps… September 18

Origin of Parasitic Emission Wires act as antennas V(t) Time Vss Vdd September 18

Origin of Parasitic Emission WIRES+CURRENT = NOISE DSPIC33F noise measurement with active probe on X10 Activation of the core by a 40 MHz internal PLL Synchronous ADDR0..15 bus switching 0x0000, 0xFFFF DSPIC_VDD_VofT.tran September 18

Origin of Parasitic Emission WIRES RADIATE September 18

Increase parasitic noise Emission issues WHY TECHNOLOGY SCALE DOWN MAKES THINGS WORSE ? Time New process Volt Old process Current level keeps almost constant but: Faster current switching Stronger di/dt Increase parasitic noise Current di/dt Old process Reduc Voltage swing => less E field With the technology scale down, the supply voltage is reduced and the signals switch faster within interconnects (From voltage to scaled voltage). In 0.18µm technology, the switching is about 100ps (Pico-second or 10-12 second), with a 2V swing. Concerning currents, the amplitude of elementary peaks appearing on supply lines of each elementary gates are sharper, but their amplitude remains constant (0.5mA in 100ps, per gate). Consequently, stronger di/dt are observed, leading to increased emission problems. New process Time September 18

Susceptibility Issues DECREASED NOISE MARGIN IN ICS 3.3 V inside, 5V outside ____ noise margin Supply (V) 5.0 1V inside, 1.2V outside ____ noise margin 3.3 I/O supply 2.5 Core supply 1.8 1.2 Tension cœur: réduire la puissance consommée, fragilité des oxyde Tension I/O: reduction => aller + vite de 0 à VDD, mais – rapide pour des raison de compatibilité entre techno 1.0 0.35µ 0.18µ 130n 90n 65n 45n 32n 20n 14n 10n 7n Technology September 18

Susceptibility Issues UNINTENTIONAL ELECTROMAGNETIC SOURCES Power HF VHF UHF SHF xHF THF 1GW Weather Radar Radars Fields radiated by electronic devices Continuous waves & pulsed waves 1MW Thunderstorm impact TV UHF 1KW TV VHF 2-4G BS 1W 4G 2G 3G 1mW Frequency 3 MHz 30 MHz 300 MHz 3 GHz 30 GHz 300 GHz 25m 25mm 0.25m 2.5mm 2.5m /4 (ideal antenna) 0.25mm

Susceptibility Issues SYSTEM-ON-CHIP, 3D STACKING: DANGER EMC Level (dB) Susceptibility level 50 High risk of interference 40 30 Safe interference margin 20 Unsafe margin 10 -10 -20 Sum of perturbations -30 -40 1 10 100 1000 Frequency (MHz) September 18

Conclusion EMI reported in all kinds of devices IC involved in many EMI problems IC technology evolution towards higher complexity On-chip switching currents in the 10-100 A range ICs are good antennas in the GHz range Increased switching noise Increased emission issues Reduced noise margins System-on-chips, systems-in-package rise new EMC issues September 18