Mission Profile Aware IC Design - A Case Study - Goeran Jerke, Robert Bosch GmbH, Automotive Electronics Andrew B. Kahng, University of California, San Diego This research project is supported by the German Government, Federal Ministry of Education and Research under the grant number 16M3195C

Overview Introduction Design Challenges Mission Profile Aware Design Case Study – Electromigration Aware IC Design Summary and Conclusion 17-Sep-18 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego

Introduction Tier 2 Tier 1 OEM OEM – Original Equipment Manufacturer ECUs, mechatronics sensors MEMS sensors Tier 2 Tier 1 Semiconductors OEM OEM – Original Equipment Manufacturer 17-Sep-18 17-Sep-18

Introduction Electronic Control Unit for ESP 17-Sep-18 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego

Introduction Tier 2 + Tier 1 ECU for Driver Assistance Acceleration Sensor Module 17-Sep-18 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego

Introduction Temperatures Responsibility Parameters Ambient Temperature (Car) OEM Environment Installation Location (Car) ECU Housing Tier 1, OEM System Design Packaging Constraints ECU (internal) Tier 1 Component Pin Tiers 1 and 2 Foundry Functional Load Constraints Tier 2 Foundry Device Junction 17-Sep-18 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego

Introduction IC Technology Node Evolution 17-Sep-18 Smart-Power HV-CMOS CMOS automotive CMOS leading edge (ITRS) 17-Sep-18 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego

Design Challenges Aggressive technology scaling Time to market  co-design System partitioning and integration Robustness Application requirements: Origin and cause of requirements  replicability, quality Impact on application design and technologies Application use  operating conditions, environmental load Functional loads  thermal, current, voltage, ... Reliability  dominant failure mechanisms Complex, heterogeneous and fragmented design flows 17-Sep-18 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego

Design Challenges Aggressive technology scaling Time to market  co-design System partitioning and integration Robustness Application requirements: Origin and cause of requirements  replicability, quality Impact on application design and technologies Application use  operating conditions, environmental load Functional loads  thermal, current, voltage, ... Reliability  dominant failure mechanisms Complex, heterogeneous and fragmented design flows 17-Sep-18 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego

Overview Introduction Design Challenges Mission Profile Aware Design Case Study – Electromigration Aware IC Design Summary and Conclusion 17-Sep-18 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego

Mission Profile Aware Design Supply Chain OEM Tier 1 Tier 2 ... Tier n ... 17-Sep-18 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego

Mission Profile Aware Design Design Chain OEM MP MP MP MP Tier 1 MP MP MP MP Tier 2 ... Tier n ... Requirements, Constraints, Functional Loads, Environmental Loads 17-Sep-18 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego

Mission Profile Aware Design Design Chain OEM MP MP MP MP Tier 1 MP MP MP MP Tier 2 ... Tier n ... NEW: Achieved Robustness, Dominant Failure Mechanisms  RIF 17-Sep-18 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego

Mission Profile Aware Design Design Flow Overview 2 1 5 3 3 4 4 17-Sep-18 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego

Mission Profile Aware Design Consistent consideration of mission profiles (MP) in supply chain Reduction of design uncertainty More precise requirements and stress factors Better understanding of system (failure mechanisms) Formalized and improved communication OEM  Tier n and Tier n  OEM Standardization of structure and content of MPs Electronic format  MP documents RMP Framework (Tool-independent platform for mission profile aware design) 17-Sep-18 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego

Mission Profile Aware Design Mission Profile Document Document header Operating states definition Component definition Property definition Back-annotation data 17-Sep-18 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego

Mission Profile Aware Design Mission Profile Document Document header Author Timestamp Document history Mounting location Operating states definition Component definition Property definition Back-annotation data 17-Sep-18 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego

Mission Profile Aware Design Mission Profile Document Document header Operating states definition Generic data container for operating states Manufacturing, assembly, storage, ... Car: start, acceleration, breaking, stop&go, freeway cruising, ... IC: power-up, idling, power-down, mode_1, mode_2, ... Component definition Property definition Back-annotation data 17-Sep-18 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego

Mission Profile Aware Design Mission Profile Document Document header Operating states definition Component definition Type  e.g. ECU, passive component, IC, sensor, ... Device I/O port definition (*) Operating state dependent environmental and functional loads Heat flow Transient/effective voltages and currents ... Profiles Property definition Back-annotation data (*) A port is a generic object: thermal port or electrical port 17-Sep-18 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego

Mission Profile Aware Design Source: ZVEI Handbook RV EE Modules 2012 17-Sep-18 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego

Mission Profile Aware Design Mission Profile Document Document header Operating states definition Component definition Type Device I/O port definition Profiles: Temperature histogram, gradient and cycling Humidity vs. temperature histogram Vibration ... Property definition Back-annotation data 17-Sep-18 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego

Mission Profile Aware Design Source: ZVEI Handbook RV EE Modules 2012 17-Sep-18 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego

Mission Profile Aware Design Mission Profile Document Document header Operating states definition Component definition Property definition Back-annotation data Reliability: Robustness Indication Figures (RIF) of dominant failure mechanisms Robustness: Enhanced Worst-Case Distance (WCD) 17-Sep-18 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego

Mission Profile Aware Design Component Properties Component Parameter ECU TEEM_Package, TVMLA, TEEM_internal , TComp.Package , ... Board TBoard , ... Package TComp.Package, TComp.Pins, Rth, ... Chip TJunction, ... Sensor Discrete device, ... Source: ZVEI Handbook RV EE Modules 2012 17-Sep-18 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego

Overview Introduction Mission Profile Aware Design Case Study – Electromigration Aware IC Design Summary and Conclusion 17-Sep-18 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego

EM Aware Design – Case Study Quality of Functional Load Data Classic Design Flow Current Aware Design Flow 17-Sep-18 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego

EM Aware Design – Case Study Cell-Level Current Aware Design Flow 17-Sep-18 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego

EM Aware Design – Case Study Block-Level Current Aware Design Flow 17-Sep-18 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego

EM Aware Design – Case Study Electromigration (EM) Quality of Functional Load Data I I = 1A DC EM EOS RPP Voids Voids Hillock Hillock AE/QMM Electrical Overstress (EOS) t Abnormal peak event AE/QMM I Imax = 1A + Duty cycle Repetitive Power Pulsing (RPP) EM EOS RPP t 17-Sep-18 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego AE/QMM

EM Aware Design – Case Study Current (Density) Aware Routing to prevent EM and EOS 17-Sep-18 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego

EM Aware Design – Case Study Effective Design Parameters 17-Sep-18 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego

EM Aware Design – Case Study Electromigration Aware Design Flow 1 3 2 4 4,5 5 17-Sep-18 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego

EM Aware Design – Case Study Current Density Critical Nets – Automotive IC A Different Mission Profile Next technology node Base node 17-Sep-18 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego

EM Aware Design – Case Study Current Density Critical Nets – Automotive IC B Next technology node Different Mission Profile Base node 17-Sep-18 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego

Overview Introduction Design Challenges Mission Profile Aware Design Case Study – Electromigration Aware IC Design Summary and Conclusion 17-Sep-18 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego

Summary and Conclusion Consideration of robustness as design target is essential for automotive electronic designs Consistent consideration of mission profiles within the design chain is required (bi-directional flow) Current aware design is driven by mission profiles Mission profile aware design: Vendor- and EDA tool-independent  focus on design flow Reduction of design uncertainty Formalized and improved communication 17-Sep-18 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego

Thank You! 17-Sep-18 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego