Flex wire bonding with pattern recognition between each wire

Slides:



Advertisements
Similar presentations
1 Pixel Bus Development Atsushi Taketani RIKEN/RBRC 1.Who is working 2.Over view of pixel bus 3. Manufacture process 4. Issues 5. Development / Production.
Advertisements

Packaging.
Manufacturing Processes for a 4 Layer Multi-layer PCB Section through PCB Via hole SMD Pad The following presentation covers the main processes during.
Thermo-compression Bonding
Manchester 09/sept/2008A.Falou & P.Cornebise {LAL-Orsay}1 CALICE Meeting/ Manchester Sept 2008 SLAB Integration & Thermal Measurements.
Out2 silk screen assembly H. Wieman revised Jan 30, 2009 for aluminum silkscreen frame with 5 mm dowel pins.
Spectrometer Solenoid Design and Procurement Review Steve Virostek Mike Green Mike Zisman Lawrence Berkeley National Lab MICE Collaboration Meeting October.
Tony Smith LHCb Velo Hybrid Meeting CERN 29/07/04 1 VELO HYBRID STATUS CONSTRUCTION of composite SUBSTRATE – best flatness obtained with TPG central core.
CHE/ME 109 Heat Transfer in Electronics
Brian Keeney, SCIPP trip to LLU, May 2, 2001 Status of Development on Silicon Telescope For Nanodosimetry Santa Cruz Institute For Particle Physics University.

Bump Bonding Requirements for Nuclear Physics Ian Lazarus Nuclear Physics Group STFC Daresbury Laboratory.
General Semiconductor Packaging Process Flow
S Temple CLRC1 End-cap Mechanics FDR Cooling Structures Steve Temple, RAL 1 November 2001.
March 20, 2001M. Garcia-Sciveres - US ATLAS DOE/NSF Review1 M. Garcia-Sciveres LBNL & Module Assembly & Module Assembly WBS Hybrids Hybrids WBS.
TSU F.E ANALYSIS YAIR SOFFAIR. Ojective Dynamic Response Calculation Temperature Distribution LOS Retention due to Temperatures Design Recommendations.
CRAFT USC Viterbi School of Engineering. The Contour Crafting Process CC builds objects by extruding paste material in a layer by layer fashion while smoothing.
17/06/2010UK Valencia RAL Petals and Staves Meeting 1 DC-DC for Stave Bus Tapes Roy Wastie Oxford University.
Status of RFCC-Module Development Derun Li Center for Beam Physics Lawrence Berkeley National Laboratory MICE Collaboration Meeting at INFN-LNF, Frascati,
Update on alignment kit and stave 250 frame M.Gibson (RAL) 1.
3M Bonding Systems Division Adhesives for Electronics Reliability Study of Sub 100 Micron Pitch, Flex-to-ITO/glass Interconnection, Bonded with an Anisotropic.
Apex Target Marco Oriunno, April 23, Design and fabrication by: Marco Oriunno, Dieter Walz, Jim McDonald, Clive Field, Douglas Higginbotham, and.
Multilayer thin film technology for the STS electronic high density interconnection E. Atkin Moscow Engineering Physics Institute (State University) –
High Density Interconnect (WBS 1.4.3) Extension Cables (WBS 1.4.4) Douglas Fields University of New Mexico Douglas Fields, FVTX DOE Review November 17,
Update on module mounting on staves and stavelets 13/6/11 1 1) Status of clean room for next assembly kit 2) DC to DC stave.
The Inclusive (Measurement ) FVTX aka iFVTX sponsored by LANL-DR in FY ‘06-08 FPIX Chip Module/Hybrid Testcard Pixel Plane Assembly/Integration.
At the HERA collider in Hamburg an experiment (ZEUS) has been built to study electron-proton collisions. For the near future an upgrade of this experiment.
FVTX Review, November 17th, FVTX Mechanical Status: WBS 1.6 Walter Sondheim - LANL Mechanical Project Engineer; VTX & FVTX.
Low Mass Rui de Oliveira (CERN) July
The Mechanical Structure for the SVD Upgrade
Interconnection in IC Assembly
Takeshi Matsuda LC TPC Collaboration March 5, 2008 TPC Endcap Materials.
L0 Module Testing and Analog Cable What we built so far: –No.3 First prototype with SVX4 (L1 hybrid) –No.4 with irradiated sensor –No.5 Installed on the.
The Development of the Fabrication Process of Low Mass circuits Rui de Oliveira TS-DEM.
– EUDET module – Report from Mechanics Brainstorming Marc Anduze – 30/06/2009 Laboratoire Leprince Ringuet Ecole polytechnique - Palaiseau.
Pixel Atsushi Taketani RIKEN RIKEN Brookhaven Research Center 1.Overview of Pixel subsystem 2.Test beam 3.Each Components 4.Schedule 5.Summary.
Pressure Cure Oven (PCO)
Progress on the Prototype design Catania Goikoetxea, Mikel Navarro Medrano, Javier Mainz, March 31st,
Bump Bonding Development
Vessel dimensions GTK assembly carrier Electrical connections Cooling pipes integration Vessel alignment with the beam Next steps Conclusion 3/23/20102electro-mechanical.
Pixel upgrade test structure: CO 2 cooling test results and simulations Nick Lumb IPN-Lyon MEC Meeting, 10/02/2010.
D0 PMG, May 04, 2000 Slide 1 Schedule DØ SMT Status Report.
Module Radiation Length. Goals Estimate the expected radiation length of a module, based on the design and measurements on as-built modules Determine.
Low Mass Alice Pixel Bus Rui de Oliveira TE/MPE/EM 6/9/20161Rui de Oliveira Alice worshop.
PACKAGE FABRICATION TECHNOLOGY Submitted By: Prashant singh.
1 FANGS for BEAST J. Dingfelder, A. Eyring, Laura Mari, C. Marinas, D. Pohl University of Bonn
FP420 Hybrid Mechanical Design Ray Thompson / Manchester Manchester Xmas O7 Ray Thompson Julian Freestone, Andy Elvin.
Module mounting possibilities (FDR and module task force proposals) & Module mounting status at Dortmund Daniel Dobos, University of Dortmund
Andrei Nomerotski 1 Flex Status & AID A.Nomerotski, 18 June 2010.
24 September 2012 Immanuel Gfall (HEPHY Vienna) SVD Status of Mechanics PXD-SVD Meeting Göttingen.
Date of download: 7/6/2016 Copyright © ASME. All rights reserved. From: Performance Analysis of a Combination System of Concentrating Photovoltaic/Thermal.
The STS-module-assembly:
Micro Vertex Detector of PANDA Status of Strip BARREL and DISC
T. Bowcock University of Liverpool
Gaspard-Hyde-Trace workshop 2015
The CSOI approach for integrated micro channels
ob-fpc: Flexible printed circuits for the alice tracker
Date of download: 11/3/2017 Copyright © ASME. All rights reserved.
Phase 2 Outer Tracker Module analysis
1IPHC Strasbourg, France, 2CERN, Geneve, Suisse
Equipment for Assembly – UK Experiences
Studies of Quad Pixel Module assembly using paper laminate
Section 1.0 — Fundamentals and General
iSHELL Design Review Cryostat & Optics Bench
Arch205 building construction Windows- glazed curtain wall, skylights
Discussion on the TDI impedance specifications
Flex Status A.Nomerotski, 4 May 2010.
Solder Fatigue Analysis
Setup for testing LHCb Inner Tracker Modules
Manufacturing Processes
Presentation transcript:

Flex wire bonding with pattern recognition between each wire Westbond 2400B Au Ball & Wedge, Al Wedge Bonder

Custom made flex to frame PCB laminator. Aligns, places and heat Silkscreen for adhesive application Vacuum holders for flex Flex Hybrid on Frame PCB Custom made flex to frame PCB laminator. Aligns, places and heat sets adhesive for 5 flex at one time. Water cooled to prevent thermal expansion of critical parts. Optical comparator displaying contour view of v4.1 flex hybrid (surface view also possible)

50 v3 flex built by Compunetics Passive components loaded at Surface Mount Depot (SMD, OKC) 24 loaded with AMS MCC and tested at Genoa 5 of these now at UOK for test development and cross-calibration Remainder used for wire bonding tests, other studies 100 v4.1 flex built by Compunetics 43 built with 1.5 (increased from 1.0 mil) Pyralux cover layers to compensate for increased Cu thickness (now 17 microns, min.) 50 loaded at SMD to date 10 tested and distributed to Bonn, Genoa and LBNL for module construction 100 v4.2 flex built by Dyconex (Switzerland) V3 flex on frame PCB