FPC1011F Introduction of a new sensor package

FPC1011F Summary: FPC has invested + 1 000 KUSD High quality design Electrically compatible with FPC1011C Available as solderable component New high quality supplier chain Production start June 2008

FPC1011F Product improvements: BT substrate + High quality FR4 + No silver migration or oxide - May need mechanical support from underneath

FPC1011F Product improvements: BT substrate Film Assisted Moulding + Standard mould method + Embedded passives + Protects silicon edges

FPC1011F Product improvements: BT substrate Film Assisted Moulding Flex film contact + Custom design of flex film (length etc.) - Sourced by customer

FPC1011F Product improvements: BT substrate Film Assisted Moulding Flex film contact Available for soldering with BGA + Enables automated assembly process + Low cost

FPC1011F Product improvements: BT substrate Film Assisted Moulding Flex film contact Available for soldering with BGA New hard coating + Mass production process, applied on wafer + Not sensitive to scratches, - May give ESD footprint under extreme conditions

FPC1011F Product improvements: BT substrate Film Assisted Moulding Flex film contact Available for soldering with BGA New hard coating - May give ESD footprint under extreme conditions: Strong ESD discharge from test electrode (>7.5KV) => Coating surface may be affected by oxygen plasma reaction => May be detected in image from extremely wet fingers. Disappears over time (typically by 30% after 3 days) Conditions for possible appearance: Low humidity, typically northern China (may bring high voltage ESD discharges), High humidity, typically southern China (may bring wet skin properties), Electrode approach from top & discharge via sensor surface. Not observed by live finger discharge.

FPC1011F Product improvements: BT substrate Film Assisted Moulding Flex film contact Available for soldering with BGA New hard coating Metal frame + More robust versus plastic frame in FPC1011C + Available in different forms + Colour and surface conditions (default Satine finish metal colour) - Needs minimum order quantity

FPC1011F Product improvements: BT substrate Film Assisted Moulding Flex film contact Available for soldering with BGA New hard coating Metal frame available in different forms

New Supplier chain Production improvements: Assembly managed by Amkor + No. one package supplier world wide Full automated production process + High volume capacity + Repeatable high quality process Well defined qualification process + High product quality - Longer product change time

New Supplier chain Production process: Silicon production

New Supplier chain Production process: Spin coating process Silicon production Coating Spin coating process

New Supplier chain Production process: Silicon production Coating Packaging Wafer dicing Die attach Wire bonding Passives FIM mould Frame assembly Flex contact assembly Test & outgoing inspection

FPC1011F Customer feedback: Thank you for your attention ! Questions? Acceptable product? Thank you for your attention !