DAEDUCK Micro via PCB 8 12 9

Build Up Status of DAEDUCK 8 12 9

New Factory for Build-Up Boards (Daeduck Bisuness Unit #2) Inspection PSR RCC Press Image /Etching Cu Plating AOI Laser drill Gold Plating

Mass Production Schedule 8 12 9

Laser Micro Via Process Flow Inner Layer RCC Lamination by Hot Press Dry Film Lamination Window Image Developing Window Etching Stripping Dry Film Laser Drilling Desmear (Hall Cleaning) Copper Plating 3 3 6

- Manufacturing Flow (Conventional PCB) 8 12 9

- Manufacturing Flow (Type-A) 8 12 9

- Manufacturing Flow (Type-B) 8 12 9

- Manufacturing Flow (TYPE-C) 8 12 9

Daeduck Bluld-Up Board Types (6Layer) 1 4 1

Daeduck Bluld-Up Board Types (8Layer) 1 4 1

Detailed Design Rule Laser Micro Via Hole Design Rule Schematic Diagram of LVH C B A A C B B A C D C B A 1-2 LVH 2-3 LVH 1-3 LVH 1-2-3 LVH 1 4 1

Mechanical Hole Design Rule B C IVH PTH Line Width/Space Design Rule OW OS IW IS 1 4 1

Daeduck Laser Drilling 1st shot 2nd shot 3rd shot Cross-section of Φ120㎛ Laser Via mobile phone peaces per month 8 13 9

Laser Via Hole Reliability Data 1. Thermal Cycle Test 1) Specification Thermal Cycle Test : IPC TM-650-2.6.7.2, NPS25001 5.2.3.1 Condition : -55℃/15min - +125℃/15min Machine : BOTSCH VI7012 S2 / 2chambers / transfer time less than 10sec. Evaluation : Resistance change less than 10% 2) Result Resistance change (%) cycle - Resistance change less than 3% : OK 8 13 9

- No Open&Short After Hot Oil Dip 2. Hot Oil Dip Test ( Micro Via Reliability ) Bare Board Tester 1) Specification Good Boards Daeduck Spec. Evaluation : Have to stand 5times of Hot Oil Dip Purpose : Laser Via Hole Reliability (Cracked laser via holes result in OPEN’s) Cool water quenching 200℃ PEG 1min. 5 times 2) Method Step 1 : Prepare PCB’s that passed BBT Step 2 : Dip in 200℃ PEG for 1min. Step 3 : Cool water quenching Step 4 : Repeat Stpe2-3 four times. (total 5times) Step 5 : Water rinse Step 6 : Re-BBT (Bare Board Test) Re - Bare Board Tester Test Flow 3) Result - No Open&Short After Hot Oil Dip Laser Via after Hot Oil Dip * Used Oil : Poly Ethylene Glycol (PEG) 8 13 9

TECHNOLOGY ROADMAP of DAEDUCK Categories: a.Normal product; b.Build up product with microvia; c.Substrate for package