Anna Macchiolo, PQC Firenze

Slides:



Advertisements
Similar presentations
Quality Assurance of Silicon Strip Detectors and Monitoring of Manufacturing Process Thomas Bergauer Institute f. High Energy Physics HEPHY, Vienna SiLC.
Advertisements

128 September, 2005 Silicon Sensor for the CMS Tracker The Silicon Sensors for the Inner Tracker of CMS CMS Tracker and it‘s Silicon Strip Sensors Radiation.
1 Module produced with low R int sensors-Anthony AffolderSensor Meeting, Feb 11, 2004 Modules Produced With Low R int Sensors Anthony Affolder UCSB.
General Tracker meetingA. Furgeri 1 Irradiation results and Annealing scenarios for HPK IEKP – University of Karlsruhe Alexander Furgeri
First Proton Irradiation of CMS Sensors W. de Boer, A. Dierlamm, A. Furgeri, E. Grigoriev, F. Hartmann, F. Hauler, L. Jungermann, Ch. Piasecki.
Influence of the humidity on the IV curves A.Chilingarov Lancaster University UK-Valencia Cluster Meeting RAL,
Power Amplifiers Power Amplifiers are used in the transmitter
The Transverse detector is made of an array of 256 scintillating fibers coupled to Avalanche PhotoDiodes (APD). The small size of the fibers (5X5mm) results.
V. Cindro, Jožef Stefan Institute, Ljubljana, Slovenia SCT week, Valencia, June 2002 Pre-series Low Mass Tapes 12 different lengths were produced for barrel.
Norhayati Soin 06 KEEE 4426 WEEK 7/1 6/02/2006 CHAPTER 2 WEEK 7 CHAPTER 2 MOSFETS I-V CHARACTERISTICS CHAPTER 2.
Study of Behaviour of n-in-p Silicon Sensor Structures Before and After Irradiation Y. Unno, S. Mitsui, Y. Ikegami, S. Terada, K. Nakamura (KEK), O. Jinnouchi,
Norhayati Soin 06 KEEE 4426 WEEK 3/2 13/01/2006 KEEE 4426 VLSI WEEK 3 CHAPTER 1 MOS Capacitors (PART 2) CHAPTER 1.
1 Plans of Vienna SLHC Proposal Workshop 20. February 2008.
4 May 2010 Thomas Bergauer (HEPHY Vienna) Testing of Test Structures in Vienna CMS Sensor-TUPO.
Anna Macchiolo, Status of Process Qualification Centers, Sensor Meeting, 31st Oct 2001 Status of Process Qualification Centers Florence, Strasbourg, Vienna.
M. Bruzzi, the issue of p-type disuniformity, 7° RD50 Workshop, CERN, November 14-16, 2005 The issue of doping disuniformity in p-type MCz Si sensors M.
Norhayati Soin 06 KEEE 4426 WEEK 3/1 9/01/2006 KEEE 4426 VLSI WEEK 3 CHAPTER 1 MOS Capacitors (PART 1) CHAPTER 1.
Electrical characteristics of un-irradiated ATLAS07 mini strip sensors A.Chilingarov, Lancaster University ATLAS Tracker Upgrade UK Workshop Coseners House,
Guido_Tonelli / CMS_TSC / 5 February Time stability of ST sensors The problem The sensors re-measuring campaign Failure analysis Conclusions.
Update of CMS Process Quality Control Sensor Meeting, CMS TK Week, , CERN Florence Anna Macchiolo Carlo Civinini Mirko Brianzi Strasbourg Jean-Charles.
A. Macchiolo, 13 th RD50 Workshop, CERN 11 th November Anna Macchiolo - MPP Munich N-in-n and n-in-p Pixel Sensor Production at CiS  Investigation.
1 Device Simulations & Hardware Developments for CBM STS Sudeep Chatterji CBM Group GSI Helmholtz Centre for Heavy Ion Research CBM Collaboration Meeting,
Norhayati Soin 06 KEEE 4426 WEEK 3/2 20/01/2006 KEEE 4426 VLSI WEEK 4 CHAPTER 1 MOS Capacitors (PART 3) CHAPTER MOS Capacitance.
Paul Dolejschi Progress of Interstrip Measurements on DSSDs SVD.
Interstrip PT Updates John Wright. Introduction In DC PT tests it was previously assumed that PT occurred between the implant and the bias rail only,
Paul Dolejschi Characterisation of DSSD interstrip parameters BELLE II SVD-PXD Meeting.
Studies on n and p-type MCz and FZ structures of the SMART Collaboration irradiated at fluences from 1.0 E+14 to 5.6E+15 p cm -2 RD50 Trento Workshop ITC-IRST.
1 Updates on Punch-through Protection H. F.–W. Sadrozinski with C. Betancourt, A. Bielecki, Z. Butko, A. Deran, V. Fadeyev, S. Lindgren, C. Parker, N.
Influence of humidity on the IV characteristics A.Chilingarov Lancaster University ATLAS SCT Week CERN,
Clear Performance and Demonstration of a novel Clear Concept for DEPFET Active Pixel Sensors Stefan Rummel Max-Planck-Institut für Physik – Halbleiterlabor.
-Stephan AUNE- RD51 BARI. Saclay MPGD workshop R&D 09/10/20101 Saclay workshop R&D for new Bulk structure.
Rint Simulations & Comparison with Measurements
INFN and University of Florence Test Beam Meeting Tracker Week
Lecture 18 OUTLINE The MOS Capacitor (cont’d) Effect of oxide charges
Karlsruhe probe equipment and QA proposals/expertise
Pilot run – matrix measurements after first metal
Axel König, HEPHY Vienna
 Silicon Vertex Detector Upgrade for the Belle II Experiment
The Normal Probability Distribution
I. Rashevskaya on behalf of the Slim5 Collaboration, Trieste Group
Status of PQC Florence, Strasbourg, Vienna
Grid Pix Field Simulations and precision needed for a module
Irradiation and annealing study of 3D p-type strip detectors
INFN and University of Florence Test Beam Meeting Tracker Week
Cint of un-irr./irradiated 200μm devices
HG-Cal Simulation using Silvaco TCAD tool at Delhi University Chakresh Jain, Geetika Jain, Ranjeet Dalal, Ashutosh Bhardwaj, Kirti Ranjan CMS simulation.
Always with appliances V= 230V
Study of radiation damage induced by 24/c GeV and 26MeV protons on heavily irradiated MCz and FZ silicon detectors N. Manna Dipartimento Interateneo di.
Results from the first diode irradiation and status of bonding tests
TIB module performance at X5 Test beam – preliminary studies
A Long Term Study of Charge Multiplication
PHYS 1444 – Section 003 Lecture #21
Update of US Testing Status
Overview Time structure of leakage currents
Ning Shen and Jorge O. Sofo,
Module Production Status in Florence
News from CMS Process Quality Control
Module production in Italy
The measurement set-up
Modules Produced With Low Rint Sensors
Metal overhang: an important ingredient against “micro-discharge”
Module Testing in Florence Carlo Civinini INFN-Florence
EMT 182 Analog Electronics I
(2) Incorporation of IC Technology Example 18: Integration of Air-Gap-Capacitor Pressure Sensor and Digital readout (I) Structure It consists of a top.
Positive Ion Current – Hot Coulomb Explosion?
PANDA solenoid quench calculations
Ohm’s Law & Circuits Chapter 7.2 & 7.3.
Magnetic shielding and thermal shielding
Clustering-based Studies on the upgraded ITS of the Alice Experiment
Dr. Hari Kishore Kakarla ECE
Presentation transcript:

Anna Macchiolo, PQC Firenze Update on the Inter-strip Resistance problem in the recent STM production PQC Firenze: Mirko Brianzi, Anna Macchiolo, Florentina Manolescu, Matteo Sani Sensor Meeting, Tracker Week, 11/04/02 Anna Macchiolo, PQC Firenze

Anna Macchiolo, PQC Firenze Bulk N-- 508 m Thermal oxide Vapox PSG Aluminum N+ Passivation (PSG) Backside aluminum STM explanation: one of the two concurring effects in the diminished inter-strip isolation is the decrease of the fixed charge density in the inner oxide layer The recent production has a positive charge density into this triple oxide layer of: 5E9 ÷ 1E10 charges/cm2 (used to be NF = 5E10 ÷ 1.0E11 charges/cm2) This reflect also in the lower Vfb that we measure in the MOS for the last shipments PISA 115-121 Used to be around 5 Volts Sensor Meeting, Tracker Week, 11/04/02 Anna Macchiolo, PQC Firenze

Anna Macchiolo, PQC Firenze The same effect explains the decrease of the surface generated current measured on the GCD The average surface current used to be around 40 pA PISA 110-114 Sensor Meeting, Tracker Week, 11/04/02 Anna Macchiolo, PQC Firenze

Anna Macchiolo, PQC Firenze The second cuncurring effect is a slightly increase in the negative charges of the passivation oxide that is not measured in the MOS and GCD (since it is not deposited under the Aluminum layer). These negative charges are no more compensated by the positive ones in the inner oxide. Passivation oxide (PSG) N+ Al P+ + + + + + + + + + - - - - - - - - - - - - + + Backside aluminum Bulk N-- Two actions taken in STM: Removal of the equipment that introduced an excessive negative charge Introduction of a gate on the R-int value Sensor Meeting, Tracker Week, 11/04/02 Anna Macchiolo, PQC Firenze

Anna Macchiolo, PQC Firenze STM measures R-int on its own test-structure (placed in one of three the not-standard half moons) with the back kept floating since this is believed to be the worst conditions. The STM test-structure corresponds to 2 squares of inter-strip material. The CMS CAP-TS-DC to 0.015 squares Sensor Meeting, Tracker Week, 11/04/02 Anna Macchiolo, PQC Firenze

Anna Macchiolo, PQC Firenze Comparison between the measurements on the CMS and STM test-structures: these batches were delivered in October and November before the introduction of the gate on Rint The STM results have been rescaled taking into account the different number of squares STM Rint gate The value of the STM Rint gate is put at 1E08 relative to the direct measurement on the RS_ISO structure (1E 05 after rescaling to compare with our measurements) The gate identifies the three batches that are affected according to the standard CMS criteria Sensor Meeting, Tracker Week, 11/04/02 Anna Macchiolo, PQC Firenze

Anna Macchiolo, PQC Firenze Measuring the CMS test-structure with the back left floating improves the comparison with the STM Rint measurements STM Rint gate Leaving the back floating the sensitivity to the presence of negative charges in the passivation oxide is enhanced The STM gate is reliable Sensor Meeting, Tracker Week, 11/04/02 Anna Macchiolo, PQC Firenze

Anna Macchiolo, PQC Firenze The last measured batches (@ Vbias=20 V ) show a clear improvement in the R-int performance N.B. The values inserted in the plot are obtained after the full PQC scan Good at 50 V bias Good at 50 V bias Good at 50 V bias Good at 100V bias Good at 100V bias 1 GΏ Delivery date Sensor Meeting, Tracker Week, 11/04/02 Anna Macchiolo, PQC Firenze

Anna Macchiolo, PQC Firenze Dependance on the humidity of the Rint behaviour Some affected structures from old batches have undergone a thermal treatment (TT): kept in the oven for 3 hours at 90o . 1,00E+03 1,00E+04 1,00E+05 1,00E+06 1,00E+07 1,00E+08 1,00E+09 1,00E+10 1,00E+11 1,00E+12 2 4 6 8 10 12 Structure number Rint (Ohm) Rint before TT Rint after TT Rint after TT and one week in dry environment For very low values of the Rint before TT the improvement is mainly in the bias voltage at which the RInt value comes back within our specification (typically from 200 to 100 V) STM Rint gate The results are stable after TT and one week at low humidity in the dry cupboard. This constitutes a warning on the ambiental conditions at which the sensors are stored: humidity affect the Rint behaviour Sensor Meeting, Tracker Week, 11/04/02 Anna Macchiolo, PQC Firenze

Anna Macchiolo, PQC Firenze A proposal In view of the better performance of the latest STM production in terms of Rint and the reliability of the STM gate on this parameter we would benefit of a change in our Rint acceptance criteria Rint > 1 G Ώ @ 100 V This would simplify our current procedure: for the structures failing our present cut we now increase in a time-consuming way the bias voltage starting from 20 V up to the voltage where the measured Rint is larger than 1 G Ώ (and in the latest STM production this voltage is always lower than 100 V) 100 V is a safe value since it is considerably lower than the bias voltage foreseen for the sensors in the normal tracker operation (300 V) Sensor Meeting, Tracker Week, 11/04/02 Anna Macchiolo, PQC Firenze

Anna Macchiolo, PQC Firenze R-int measured on CAP-TS-DC @ 20 V bias corresponding to the sensors used in the US to build the R-int affected modules Module # I Sensor # R-int Voltage at which RInt > 1 G  II Sensor # 5036 32016112 29 M 50 V 32016113 20 V 112 G 5041 32016111 808 K  32016101 228 G  5077 32016114 178 K  100 V 32016103 150 V 146 K  5100 33600223 140 K  200 V 33215723 138 K  5187 32016120 169 M 32016117 5 M Sensor Meeting, Tracker Week, 11/04/02 Anna Macchiolo, PQC Firenze