MTL: The Microsystems Technology Laboratories at MIT

Slides:



Advertisements
Similar presentations
MonolithIC 3D Inc., Patents Pending MonolithIC 3D ICs October MonolithIC 3D Inc., Patents Pending.
Advertisements

NEW SENSING DEVICES FOR IMPROVING THE QUALITY OF LIFE Interest in FP 6 call: 'Nanotechnologies and nanosciences, knowledge-based multifunctional materials.
Thermal Actuators.
MICROFLEX S Beeby, J Tudor, University of Southampton Introduction to MEMS What is MEMS? What do MEMS devices look like? What can they do? How do we make.
M ICRO -E LECTRO M ECHANICAL S YSTEMS (MEMS). MEMS Micro Electrical Mechanical Systems Practice of making and combining miniaturized mechanical and electrical.
Integrated Circuits (ICs)
Tutorials on Systems Miniaturization Luiz Otávio S. Ferreira - LNLS November 28, 2001.
Silicon Programming--Introduction to MEMS 1 Introduction to MEMS; energy domains; mechanical and fluidic devices.
Nanotechnology is receiving a lot of attention of late across the globe. The term nano originates etymologically from the Greek, and it means.
Microelectronics & Device Fabrication. Vacuum Tube Devices Thermionic valve Two (di) Electrodes (ode)
Professor Chuan Seng Tan ( 陈全胜 ) Nanyang Assistant Professor School of Electrical and Electronic Engineering Nanyang Technological University IWNE.
The Evolution of the Computer Age Marcus Riley. First Generation ( ) During the first generation, computers were built with vacuum tubes which are.
How engineers in 1954 expected a computer to look like in 2004.
Meso Machining Norman Salmon Engineering Program Manager
Reporter: AGNES Purwidyantri Student ID no: D Biomedical Engineering Dept.
MEMS Fabrication S.APPA RAO.
Nano electro mechanical systems (nems)
Automated Inspection Using Machine Vision
Small Size, Big Impact – Exploring the Potentials of Micro/Nano Technologies Xingguo Xiong Dept. of Electrical & Computer Engineering, University of Bridgeport,
ECEn 191 – New Student Seminar - Session 5: Integrated Circuits Integrated Circuits ECEn 191 New Student Seminar.
ENERGY MANUFACTURING Prof. Burak Ozdoganlar, Associate Professor Department of Mechanical Engineering Department of Materials Science and Engineering Carnegie.
Lecture on Integrated Circuits (ICs)
Ceramics and Materials Engineering Nanomaterials.
Low-cost organic gas sensors on plastic for distributed environmental sensing Vivek Subramanian Department of Electrical Engineering and Computer Sciences.
Nilufa Rahim C2PRISM Fellow Sept. 12, What is Engineering? Engineering is the field of applying Science and Mathematics to develop solutions that.
Why do we put the micro in microelectronics?. Why Micro? 1.Lower Energy and Resources for Fabrication 2.Large Arrays 3.Minimally Invasive 4.Disposable.
Nano/Micro Electro-Mechanical Systems (N/MEMS) Osama O. Awadelkarim Jefferson Science Fellow and Science Advisor U. S. Department of State & Professor.
Seminar ON SMART SENSOR Submitted by : SUBIR KUMAR GHOSH Roll No. IN-14/04 Electrical & Instrumentation Deptt. B.E 7th Semester JORHAT ENGINEERING COLLEGE,
Nanogrooved silicon dioxide (SiO 2 ) was used to fabricate organic field-effect transistors (OFETs) with a mobility approaching 50 cm 2 V -1 s -1. We expect.
What is MEMS Technology?. What is MEMS ? What is MEMS ? Micro Electro Mechanical Systems – micro scale dimensions (1mm = 1000 microns) – electrical and.
Medical Device R&D / manufacturing in Mexico for worldwide markets Summary of Technical Capabilities ZIPTEK MEXICO SA DE CV.
Early electronic device the vacuum tube
URL: 12-1, Hisakata 2-chome, Tempaku-ku, Nagoya JAPAN (C)2001 Manufacturing Engineering Laboratory,
Microfabrication CHEM-E5115
2.90s: Design of Flexures & Compliant Mechanisms 2.75Ts: Precision Engineering Theory, Concepts & Principles $ course - Prof. Martin Culpepper, MIT.
PACKAGE FABRICATION TECHNOLOGY Submitted By: Prashant singh.
1 Ken Gilleo PhD ET-Trends LLC 1 Introduction & Overview “What are the possibilities of small but movable machines?” - R. Feynman 1959 Feynman described.
SPINTRONICS Submitted by: K Chinmay Kumar N/09/
Microsystems for selective gas sensing
How small is nanotechnology? lessons outline Integrated Circuits and 45nm linewidths (2007 ETP – lesson day 1) What are MEMS? (lesson day 2) Common uses.
Nanophotonics Prof. Albert Polman Center for Nanophotonics
Week 9 Emerging Technologies
SEMICONDUCTOR DEVICE FABRICATION
• Very pure silicon and germanium were manufactured
RF MEMS  The solution to power hungry smart phones
Roer Eka Pawinanto, Jumril Yunas and Burhanuddin Yeop Majlis
BURGLAR ALARM ON WINDOW GLASS BREAKING
Integrated Circuits.
Lecture 9 Fundamentals of Multiscale Fabrication Applications I:
Hong Ma 3D Volumetric Sensing Using Resonant RF Tags
3-D IC Fabrication and Devices
10 Gbps Transimpedance Amplifier and Laser Driver in 0.18 um CMOS
Mechatronics Assignment#1 Topic: MEMS ACTUATORS Prepared by: Sandeep Sharma Dept of Electrical and Computer Engineering Utah State University.
Thin Films for the Next Generation of Neutron Detectors
Microsystems for selective gas sensing
Technology advancement in computer architecture
Materials and Devices for Neural Systems and Interfaces
CHE 5480 Summer 2005 Maricel Marquez
Quantum corral of 48 iron atoms on copper surface
MEMs Sensors Max Tesch.
MEMs Sensors Max Tesch.
Photonics and Electro-Optical Engineering
MEMS TECHNOLOGY.
Silicon wafer fabrication
Career Cluster Manufacturing.
MEMS: Basic structures & Current Applications
Powering the 21st Century with Integrated Photonics
Semiconductor Industry:
• Very pure silicon and germanium were manufactured
Nanotechnology Prepared by: ASHWINI GHORPADE.
Presentation transcript:

MTL: The Microsystems Technology Laboratories at MIT Prof. Martin A. Schmidt Massachusetts Institute of Technology Microsystems Technology Laboratories - MIT

MTL - The Facilities Integrated Circuits Laboratory Class 10 - 2800 sq.ft. (6") 1.25 micron CMOS baseline process Technology Research Laboratory Class 100 - 2200 sq.ft. (6") Flexible Process Environment Exploratory Materials Laboratory Class 1000 - 2000 sq.ft. Thin Film Process Facility IC Design Laboratory Foundry IC Processes Microsystems Technology Laboratories - MIT

MTL Technology: A Tour of Scale Gyroscopes Displays Transistors Microengines mm mm nm Tiny Technologies have as a unifying theme the use of micro/nano fabrication technologies for manufacturing. Many of these technologies derive from the IC fabrication industry. This slide illustrates examples of the applications of the manufacturing methods that are available in the MTL. Microturbomachinery is pursued at MIT as a means to make miniature heat engines with application in portable power generation, cooling, and propulsion (Prof. Alan Epstein-Aero&Astro). Microchemical plants are being built which enable synthesis and detection of chemicals for point-of-use production or analysis. Inertial forces (acceleration/rotation) can be sensed by miniature accelerometers and gyroscopes (Prof. Klavs Jensen-ChemE). These devices are the heart of many new products including crash detectors for airbags. Micromanufacturing allows creation of precision connectors like the silicon microcontactor shown in this slide which is designed for high speed contacting and testing of chips (Prof. Aleks Slocum-MechE). Compact field emitters like the one shown in this slide are assembled in arrays and allow a new class of high brightness field emission displays (Prof. Tayo Akinwande-EECS). Minuature cantilevers can be fabricated and functionalized with biomolecules for biosensors (Prof. Scott Manalis-Media Lab). Of course the microfabrication technology enables miniature transistors, and MIT uses its expertise to pursue novel device designs for new needs such as this RF transistor (Prof. Jesus delAlamo-EECS). Finally, through careful silicon processing, nanometer dimensioned silicon tips are formed which enable a broad range of exploration at the nanometer scale in science and engineering (Prof. Tayo Akinwande-EECS). Microchemical Plants Connectors Nanotips Low Power IC Microsystems Technology Laboratories - MIT

Lamination of Extruded 2-D Shapes Piezo Electrical Power Low Pressure High Valve Controller Microsystems Technology Laboratories - MIT

Opportunities Rapid 2-D Extrusion Aligned Bonding of Chips Plastics, Silicon, Ceramics First-Pass Success Process modeling and tool characterization Lower Cost Transition from semiconductor mindset to machine tool mindset Aligned Bonding of Chips Transition from optical to mechanical/chemical Self-assembly LEGO (A. Slocum) Microsystems Technology Laboratories - MIT