Pb-Free Design/Implementation Guide - Overview TBD 8-81D Team June 5, 2018 11/13/2018 Unrestricted Content   Unrestricted Content  

Agenda Who Are We? In the Beginning Content Overview Vision Approach Content Overview Content Highlights Status of the Guide Questions 11/13/2018 Unrestricted Content   Unrestricted Content  

Average of ten (10) persons per meeting Who Are We? Close to fifty (50) different participants (globally) Government/military organizations Academic and non-profit organizations Private companies (aerospace, defense, suppliers) Close to fifty (50) team telecons since we began in 2015 Average of ten (10) persons per meeting 11/13/2018 Unrestricted Content   Unrestricted Content  

Pb In the Beginning….. Vision Approach Bob Gregory (Rolls Royce NA, retired) generated a strawman list “Pb-free things that keep me up at night..” Approach Provide a collection of guidelines dealing solely with Pb-free Not a comprehensive electronics design guide A “delta” guide, i.e. differences between Pb-free and SnPb Implementation aspect added in May 2017 Pb Unrestricted Content   Unrestricted Content  

Content Overview 11/13/2018 Unrestricted Content   Unrestricted Content  

Content Overview 11/13/2018 Unrestricted Content   Unrestricted Content  

Content Overview From Section 2.1 of the Guide Guide intent is to address ‘delta’ differences between SnPb and Pb-free solder technologies Any redundant information may be result of completion or context “Delta” differences categorized as: Typically poorer wetting ability Differences in appearance and inspection criteria Typically higher melting temperature Potential tighter process window for repair/rework Increased potential of tin whiskers Unrestricted Content   Unrestricted Content  

Content Highlights Comprehensive basic technical knowledge section Pb-free Solder, Pb-free Interconnections, and Tin Whiskers Risks Mitigations References/Resources Relationships of Pb-free with PWBs Plating/Finishing issues Conductive Filament Formation Pb-free crack in interconnection (Courtesy of DfR Solutions) Tin Whiskers (Courtesy of NASA) Unrestricted Content   Unrestricted Content  

Content Highlights cont’d Comprehensive basic technical knowledge section cont’d Product Qualification Relationship with Manufacturing Processes Soldering Supply Chain Control Obsolescence Management Configuration Management Some Pb-free soldering anomalies (from L to R): fracture, projection, fillet lift (from IPC-A-610, Courtesy of IPC) Unrestricted Content   Unrestricted Content  

Content Highlights cont’d Implementation (Design Strategies) Product Design Risk Management (e.g. underfills) Customer Risk Management Design Process Flow Align with basic product development process – highlight incorporation of Pb-free concerns/mitigations From Proposal stage through Product Support Reference for underfill graphic: https://www.google.com/search?q=IPC,+underfill+photos&safe=active&hl=en&site=webhp&tbm=isch&imgil=Dl1LCUU9E80SpM%253A%253BI4o5l3b3856edM%253Bhttp%25253A%25252F%25252Felectroiq.com%25252Fblog%25252F2001%25252F12%25252Fbga-underfills%25252F&source=iu&pf=m&fir=Dl1LCUU9E80SpM%253A%252CI4o5l3b3856edM%252C_&usg=__Rumd1f5fEMleBqIZhuRPg3UE3UU%3D&biw=1680&bih=843&ved=0ahUKEwiGvpD9h5PVAhUo6YMKHdJ1AZIQyjcIPQ&ei=5B1uWYa8L6jSjwTS64WQCQ#imgrc=xwAW_Sn0peVc7M:&spf=1500388846421 Underfill as an example of ruggedization (from IPC) Unrestricted Content   Unrestricted Content  

Content Highlights cont’d User Friendliness – Design/Implementation Summaries at End of Each Technical Section (Examples) Unrestricted Content   Unrestricted Content  

Guide is released ! INTRODUCING: IPC/PERM-2901 Status of the Guide Guide is released ! INTRODUCING: IPC/PERM-2901 11/13/2018 Unrestricted Content   Unrestricted Content  

THANK YOU ! To the entire team, THANK YOU Job well done 11/13/2018 Unrestricted Content   Unrestricted Content