Band Theory: Metallic Bonding

Slides:

Advertisements

Similar presentations

ECE G201: Introductory Material Goal: to give you a quick, intuitive concept of how semiconductors, diodes, BJTs and MOSFETs work –as a review of electronics.

Advertisements

CMOS Fabrication EMT 251.

VLSI Design Lecture 2: Basic Fabrication Steps and Layout

Semiconductors What Is A Semiconductor? A semiconductor is a substance that has a lower conductivity than a metal and a higher conductivity than a non-metal.

Lecture 1.0 Computer Basics What is in a computer?

Electronics Manufacturing Processes Manufacture of Electronics Components Manufacture of Printed Circuit Boards (PCB’s) Assembly of components on PCB’s.

Silicon Computer Chips Review Band Theory Expand to Conductors/ Semiconductors/ Insulators Intrinsic vs. Doped Semiconductors n-type and p-type Semiconductors.

Lecture #3 OUTLINE Band gap energy Density of states Doping Read: Chapter 2 (Section 2.3)

Microelectronics & Device Fabrication. Vacuum Tube Devices Thermionic valve Two (di) Electrodes (ode)

Copyright © Houghton Mifflin Company. All rights reserved. 16a–1 Figure 16.31: Two-dimensional representations of (a) a quartz crystal and (b) a quartz.

Lecture 0: Introduction. CMOS VLSI Design 4th Ed. 0: Introduction2 Introduction  Integrated circuits: many transistors on one chip.  Very Large Scale.

Diodes TEC 284.

Chapter 1 Crystal Growth Wafer Preparation.

OBJECTIVE Objective of this practical is to learn about diode and identify its terminals.

INTEGRATED CIRCUITS.

Copyright © Houghton Mifflin Company. All rights reserved. 16a–1 Figure 16.31: Two-dimensional representations of (a) a quartz crystal and (b) a quartz.

Ohm's Law Ohm's law is an assertion that the current through a device is always directly proportional to the potential difference applied to the device.

Taklimat UniMAP Universiti Malaysia Perlis WAFER FABRICATION Hasnizah Aris, 2008 Lecture 2 Semiconductor Basic.

Gentle Intro to Semiconductors ENGN/PHYS 207. The ubiquitous LED.

P-N Junction Diode Topics covered in this presentation:

Chaos, Communication and Consciousness Module PH19510 Lecture 8 Entering the Transistor Age.

Transistors & Semiconductors. Transistor Amplifying Switch – Current to base enables current from emitter to collector – Base requires small amount of.

29-1Bonding in Molecules *When atoms cling together as a single unit to achieve lower energy levels, this is a chemical bond. *Bonds occur as ionic an.

Detectors (UV-Vis) 1. Phototube 2. Photomultiplier Tube (PMT) 3. Si Photodiode 4. Photodiode Array (PDA) 5. Charge Coupled Device (CCD) 6. Charge Injection.

Band Theory: Metallic Bonding Photoelectron Spectroscopy.

NanoFab Trainer Nick Reeder June 28, 2012.

IC Fabrication Overview Procedure of Silicon Wafer Production

Free Electron Model for Metals

1. Unit I: Semiconductor Diodes and Applications Before we start with Electronics Let us review the Basics of Electricity Q. What are the two main quantities.

1 Higher Physics Unit 3 Optoelectronics Semiconductors.

Band Theory: Metallic Bonding Photoelectron Spectroscopy.

Crystalline Solids, Band Theory, and Doping

Silicon.  Occurs as silica (SiO 2 ) & other silicates.  Hard & Brittle.

1 Semiconductor Devices  Metal-semiconductor junction  Rectifier (Schottky contact or Schottky barrier)  Ohmic contact  p – n rectifier  Zener diode.

Silicon Design Page 1 The Creation of a New Computer Chip.

Diamond Tetrahedral Lattice of Carbon. Graphite Sheets or Layers of Rings of Carbon.

Based on current conduction, materials are classifieds as 1)Insulators Ex: Wood, Mica, Diamond 2) Conductors Ex: Copper, Aluminium 3) Semiconductors Ex:

Properties of metals Metals (75% of elements) Lustrous (reflect light)

Introduction to CMOS Transistor and Transistor Fundamental

Introduction to Silicon Processing Dr Vinod V. Thomas SMIEEE Ref: Section 2.2 ASICs : MJS Smith.

1 Device Fabrication And Diffusion Overview 5 and 8 February 2016 Silicon Wafer Production-Refer to Chapter “0” Prologue Raw material ― Polysilicon nuggets.

Transistors According to Dictionary.com a transistor is:

CMOS Fabrication EMT 251.

Introduction to CMOS VLSI Design Lecture 0: Introduction.

1. What are 3 things you notice in the picture. 2

Introduction to P-N diode

Basic Planar Processes

CMOS Fabrication CMOS transistors are fabricated on silicon wafer

“Semiconductor Physics”

Basics of Semiconductors

EE 4611 INTRODUCTION 21 January 2015 Semiconductor Industry Milestones

Teacher Settani Gabriele Montinaro & Giulio Micieli CLIL ELETTRONICA

An Alternative Semiconductor Definition!

Electronics Manufacturing Processes

Read: Chapter 2 (Section 2.3)

Silicon Wafer cm (5’’- 8’’) mm

Lecture 9.1 Building a FET.

Lecture 1.0 Computer Basics

Basic Semiconductor Physics

Device Fabrication And Diffusion Overview

EE105 Fall 2007Lecture 1, Slide 1 Lecture 1 OUTLINE Basic Semiconductor Physics – Semiconductors – Intrinsic (undoped) silicon – Doping – Carrier concentrations.

Lecture 1.0 Computer Basics

Lecture 1 OUTLINE Basic Semiconductor Physics Reading: Chapter 2.1

Device Fabrication And Diffusion Overview

First Brillouin zone of FCC lattice and the band diagram (Do you see any gaps?)

Solid State Electronics ECE-1109

Band Theory: Metallic Bonding

Basic Planar Process 1. Silicon wafer (substrate) preparation

Presentation transcript:

Band Theory: Metallic Bonding Photoelectron Spectroscopy

Band Theory: Metallic Bonding Photoelectron Spectroscopy

Band Structure for Periods 4-6, Group 1A – 2B http://employees.oneonta.edu/viningwj/sims/metallic_bonding_band_theory_s.html

Conduction in Solids

Silicon Semiconductors

Silicon Semiconductors

Chip Fabrication Make really, really pure Si Add impurities in a controlled way (doping) SiO2(s) + 4 HCl  SiCl4 (l) + H2O(l) SiCl4 purified by distillation. SiCl4 + 2 Zn  Si + ZnCl2 Si now 99.9% pure. Zone refining used to purify to 99.99999% pure.

Circuit Components Diodes Transistors

Doping Apply coating Illuminate through mask Dissolve illuminated areas Add gas phase dopant Repeat

Photolithography http://www.cnf.cornell.edu/cnf_process_photo_resists.html