Product Longevity Program

Slides:



Advertisements
Similar presentations
Database Systems (資料庫系統)
Advertisements

® © 2006 IBM Corporation IBM Software Group Processor Value Unit Licensing for Middleware Sales Skills Training for IBM Business Partners Michael Ryan,
1. 2 TX SET Version Release Schedule RMS Assignment /Action Item Form Discussion Topic.
How to complete and submit a Final Report through Mobility Tool+ Technical guidelines Authentication, Completion and Submission 1 Antonia Gogaki IT Officer.
1 CMBG 2009 Planning for Obsolescence June 27, 2009 John Parler South Carolina Electric & Gas.
Standard Design Process Overview
Orders – Create Responses Boeing Supply Chain Platform (BSCP) Detailed Training July 2016.
How has this product changed over time? Why might it be better for the environment? GCSE Revision Product Time line.
1 Terminal Management System Usage Overview Document Version 1.1.
Principles of Business & Finance Objective 4.02
How to write an effective RFP
Veritas End-of-Life (EOL) Policy Quick Reference Guide
Windows Server Premium Assurance SQL Server Premium Assurance
9100:2016 Transition Training Communication Package
Contracting Officer Podcast Slides
SPS Donate Now VT.
Chapter 10 Product Issues in Channel Management.
Training Documentation – Replacing GSPR with RFQ 2.0
Merchandising Activities
Chapter 26 pricing strategies Section 26.1 Basic Pricing Strategies
Sourcing Event Tool Kit Multiline Sourcing, Market Baskets and Bundles
Let the IMPS program help you with your obsolescence!
PAR Review - Meeting Agenda and Comment slides - Vancouver 2017
REVEALING THE ACTUAL COST OF TELECOMMUNICATIONS TO MOBILE USERS
Contracting Officer Podcast Slides
Distribution Workgroup 24/11/16
FORECASTING IN HOTELS STARTS WITH MAKING A BUDGET
Strategic Events Planning at Pace University
Microsoft 365 powered device offers Execution Guidance
ESB Networks AIP Programme
LFoundry: an open foundry model enabling
Local Option - COVA Health Insurance Plan
Public workshop: CBA 3.0 –come and improve with us the transmission and storage assessment methodology Brussels 07 November 2017.
Hyper-V Cloud Proof of Concept Kickoff Meeting <Customer Name>
Acrobat DC November Release
Michael Kennedy Channel Programmes Manager Sage CRM
CAR Phase 22 Release Notes
Davenport School Board Meeting
ESB Networks Market Release Meeting of the IGG, 1st October 2009
Corporate Actions Reengineering
TRANSCEND SSD NEW LOWER PRICES & SPECIAL OFFERS
TRANSCEND SSD NEW LOWER PRICES & SPECIAL OFFERS
IBM SCPM Forecast Cycle
ViVa_MultimediaStoryboard
Coordinate Operations Standard
IBM SCPM Forecast Cycle
Exit Capacity Substitution and Revision
Royal Mail Group: Testing and Innovation Incentive.
Royal Mail Group: Business Mail Testing and Innovation Incentive.
Release 3 Plan Options Analysis
Principles of Business & Finance Objective 4.02
Advertising Mail Test and Innovation Scheme
Advertising Mail Test and Innovation Scheme
Royal Mail Group: Testing and Innovation Incentive.
Harmonisation Working Group
Release 3 Update 07th March 2018.
DRAM MARKET UPDATE August 2013
Advertising Growth Incentive
Advertising Growth Incentive
Release 3 Update 07th March 2018.
The College Application: An Insider’s View
DRAM MARKET UPDATE July 2013
Status of Exceptional Events Implementation Guidance
Database Systems (資料庫系統)
Database Systems (資料庫系統)
Erik Porter Program Manager ASP.NET Microsoft Corporation
Concord Products Online
Presentation transcript:

Product Longevity Program 3rd Release July 2012 This customer presentation succeeds previous versions and is dated July 31, 2012 which is aligned with the 3rd Release of the Product Longevity Program (PLP). November 14, 2018

Micron Product Longevity Program (PLP) Automotive Industrial Medical, Aerospace, Defense Targets markets requiring long life cycles Automotive, industrial, medical, aerospace, and defense Ensures 10 years of support DRAM, NOR, and NAND Provides stability 2-year conversion timeline in the event of a die shrink Changes: “Multi-Market” replaced with “Medical, Aerospace, and Defense” Micron’s product longevity program (PLP) is targeted at automotive, industrial, medical, aerospace, and defense customers. In general, these applications require long life-cycle support due to 2-3 year design and qualification cycles, as well as 5-10 year production cycles. Micron’s PLP is designed for these types of applications. Specifically, PLP will offer a minimum of 10 years support on select DRAM, NOR, and NAND products. In addition to 10-year longevity, PLP also offers more stability with a 2 year conversion timeline in the event of a product change notification (PCN) in the form of a die shrink. November 14, 2018

Line Card and Part List The PLP part list contains parts included in the PLP and conversion info Here we show more detail about the products included in the program. The PLP line card is a high-level overview of the memory types and densities included in the program. You should note that not all Micron products are included in the PLP (e.g., Mobile DRAM, MLC NAND, etc.) If a customer wants to know details about why a particular product line is not in the PLP, you (or they) can send an e-mail to plpsupport@micron.com. In addition, even though 1Gb DDR3 (MT41) products are included in the PLP, it does not mean all 1Gb DDR3 devices are in the program. To see which specific parts are in the PLP, customers should download the PLP Part List, which is now available at micron.com/support/plp. Updates with PLP 3rd release as of July 2012 include: a) New optimized 1Gb 34nm NAND devices (M68M) b) Post- conversion part numbers for DRAM *Go to micron.com/support/plp and click on the PLP Part List banner for specific part numbers. November 14, 2018

Micron PLP Commitment Minimum of 10 years support from date of introduction (DOI) DOI is assigned to each PLP part number 2-year conversions for form, fit, and function product change notifications (PCNs) 1 year to last-time buy (LTB) 1 year to last-time shipment (LTS) Conversions such as die shrinks will involve part number changes Original DOI stays the same regardless of PCNs, conversions, and/or part number changes   Now that we have defined exactly which parts in the PLP, we can go into more detail on how we plan to implement the PLP commitments. First we need to define the Date of Introduction (DOI). Each part in the PLP has a specific DOI associated with it, which defines the detailed longevity commitment. All parts introduced in the 1st release (more than 200 parts) have a DOI of 5/4/2011. Based on this DOI, Micron will support this form, fit, function (memory type, density, and package) through May 2021, at a minimum. With the 2nd release, we introduced 9 new PLP parts, which have a DOI of 12/31/2011. These 9 parts will be supported at least through December 2021. With the 3rd release, we are introducing 4 new part numbers, which have a DOI date of 07/31/2012, and will be supported through at least July 2022. As noted on the previous foil, you can see exactly which parts are associated with which DOI date by downloading the PLP Part List from micron.com/support/plp. Finally, we need to clarify that the PLP 10-year commitment is to form, fit, and function - not to a specific part number. This means there will be conversions to smaller lithographies, which will involve a product change notification (PCN) and an associated part number change (i.e., the die revision will change). In the event of a die shrink, Micron will issue a PCN, which provides a minimum 2-year conversion timeline, with 1-year last-time buy (LTB) and 1-year last-time shipment (LTS) periods. Introduction of a replacement MPN after the PLP DOI of the original MPN does not extend the 10-year longevity commitment. May 2011 1st Release May 2021 December 2011 2nd Release December 2021 July 2012 3rd Release July 2022 DOI PCN/LTB/LTS PCN/LTB/LTS November 14, 2018

Customer Choice: PLP vs. Standard Parts Using “X” designator in part number to indicate PLP-specific parts All PLP DRAM part numbers use “X” designator 1Gb optimized NAND 34nm PLP devices are already using PLP “X” designator PCN to convert PLP NAND part numbers to PLP “X” designator will be issued 4Q12 PLP NOR part numbers will use “X” designator with new lithography conversions PLP “X” ASPs will decline at a slower rate to support 10-year longevity PLP lowers obsolescence costs in later years of product life cycle One item, which was new with the PLP 2nd release, is the introduction of PLP specific part numbers. Such part numbers contain a special field, using “X” to designate PLP. An “X” refers to the Roman number 10 for 10-year support. Any Micron part number with an “X” in the Special Options field will be a PLP part. This allows customers to easily tell that a specific Micron part is included in the PLP without having to refer to the PLP Part List. As a result, customers now have the choice of buying standard IT DRAM components or “X” designated PLP DRAM components. This choice is now being extended to NAND parts as well. Beginning with Micron 60 Series (50nm lithography) ,“X” parts will designate PLP versus standard products. In the future, Micron plans to introduce the “X” on NOR and NAND product lines as well. The implementation is starting with the NAND 1Gb M68M device and will extend to other NAND parts later this year. Now that customers have a choice between PLP (X) and standard (IT) DRAM products, we need to clarify our long-term pricing plans for the “X” parts. In general, “X” part number prices will decline at a slower rate to support the PLP commitments (10-year longevity and 2-year conversion timelines). The graph shows an example of how this will impact an industrial customer buying PLP vs. standard products with an initial yearly cost of $40,000 dollars. In the initial years the PLP products will cost more (noted by the blue line on the graph). When the standard products EOL (year 6 in this example), customers buying standard products will have to put in a large last-time buy (LTB) order to continue to secure supply line or convert to the PLP parts. In either case, the obsolescence costs can outweigh the yearly procurement costs. In the example, we assumed a $50,000 engineering cost to convert/requalify the platform to the PLP component. In summary, PLP offers stability in the later years of a customer’s product life cycle. To understand how PLP can benefit customers, they must have an understanding of what their engineering and procurement costs are for dealing with product obsolescence. If your obsolescence costs are high, PLP products will have a considerable benefit by minimizing the number of conversions or by allowing more time to plan and budget for obsolescence. What are your obsolescence costs? November 14, 2018

PLP 3rd Release Summary PLP is targeted at automotive, industrial, medical, aerospace, and defense applications PLP part list is available at: www.micron.com/plp PLP 10-year commitment is not to a specific part number Includes form, fit, function conversions/die shrinks/PCNs “X” in special options field of part numbers denotes PLP “X” available on DRAM; starting to implement on NAND “X” ASPs will decline at slower rates Additional questions or requests? Send e-mail to: plpsupport@micron.com In summary … bullets pretty much speak for themselves. November 14, 2018